Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 2006.07c
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- Pages.1729-1730
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- 2006
A Study of Electrochemical Characteristics on Copper Film
Copper 막의 전기화학적 특성에 관한 연구
- Han, Sang-Jun (Daebul Univ.) ;
- Park, Sung-Woo (Daebul Univ.) ;
- Lee, Woo-Sun (ChoSun Univ.) ;
- Seo, Yong-Jin (Daebul Univ.)
- Published : 2006.07.12
Abstract
We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of
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