• Progress in Superconductivity and Cryogenics
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• v.22 no.3
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• pp.13-19
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• 2020

This study presents the experiment and simulation results on the magnetic field response and electrical stability behaviors of no-insulation (NI) and metal insulation with stainless steel tape (MI-SS) which wound in form of racetrack type coils. First of all, the structural design of the racetrack type bobbin was shown along with its parameters. Then, the current-voltage tests were carried out to measure the critical current of both test coils. Also, the sudden discharging and charging tests were performed in the steady state to estimate the decay field time and magnetic field response, respectively. Finally, the overcurrent tests were conducted in the transient state to investigate the electrical stability of these test coils. Based on the experimental results, the contact surface resistances were calculated and applied to the field coils (FCs) of 10-MW-class second generation high temperature superconducting generator (2G HTSG) used in wind offshore environment. The charging delay time and electrical stability for NI and MI-SS HTS FCs of 10-MW-class 2G HTSG are analyzed by the equivalent circuit model and the key parameters which were obtained from the electromagnetic finite element analysis results.

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.113-119
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• 2007

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat material by means of an electric current that is caused to flow through the material or its container by electromagnetic induction. It has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers a finite element analysis of the induction heating process which can rapidly raise mold temperature. To simulate the induction heating process, the electromagnetic field analysis and transient heat transfer analysis are required collectively. In this study, a coupled analysis connecting electromagnetic analysis with heat transfer simulation is carried out. The estimated temperature changes are compared with experimental measurements for various heating conditions.

• Proceedings of the KIEE Conference
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• 2003.07a
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• pp.555-557
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• 2003

As electric power transmission systems grow to supply the increasing electric power demand, transmission capacity is larger. but that's really difficult to secure the location for power transmission and distribution to user. The high temperature superconducting(HTS) cable is a method to solve this problem. But for applying to real systems, it needs to investigate the effect of HTS cable. The most important things is the investigation of fault condition. the fault on HTS cable include the quench state. When a fault occur in a circuit, three critical parameters(temperature, current density, magnetic field) exist. when one of these parameters exceeds the critical value, the superconducting becomes normal-conducting. f the cooling power is insufficient to recover the superconducting state, the normal-conducting zone expands. In order to solve these problem, this paper present simulate the quench state considering the over-current and over-voltage in the informal circuit and analyze the quench state.

• Smart Structures and Systems
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• v.16 no.5
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• pp.835-851
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• 2015

This paper presents theoretical and experimental evaluation of the structural health monitoring (SHM) capability of piezoelectric wafer active sensors (PWAS) at elevated temperatures. This is important because the technologies for structural sensing and monitoring need to account for the thermal effect and compensate for it. Permanently installed PWAS transducers have been One of the extensively employed sensor technologies for in-situ continuous SHM. In this paper, the electro-mechanical impedance spectroscopy (EMIS) method has been utilized as a dynamic descriptor of PWAS behavior and as a high frequency standing wave local modal technique. Another SHM technology utilizes PWAS as far-field transient transducers to excite and detect guided waves propagating through the structure. This paper first presents how the EMIS method is used to qualify and quantify circular PWAS resonators in an increasing temperature environment up to 230 deg C. The piezoelectric material degradation with temperature was investigated and trends of variation with temperature were deduced from experimental measurements. These effects were introduced in a wave propagation simulation software called Wave Form Revealer (WFR). The thermal effects on the substrate material were also considered. Thus, the changes in the propagating guided wave signal at various temperatures could be simulated. The paper ends with summary and conclusions followed by suggestions for further work.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.4
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• pp.435-445
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• 1997

It was studied the phenomena of transient freezing of an inclined water-saturated enclosure. One side of the test section was cooled and the other sides were insulated. The effects of the initial temperature, the inclination angle on the temperature field and the shape of the ice-water interface were observed. In the beginning of freezing, with increasing the inclination angle the freezing rate was increased and in the stable density layer centered $4^{\circ}C$, the freezing was fast as the convective fluid flow became small. When the initial temperature was above the $4^{\circ}C$, the frozen thickness in the upper part of inclined surface was thinner than that in the lower part, but with time the frozen thickness of upper part was thicker than that of lower part, below the $4^{\circ}C$, the frozen thickness in the upper part was thicker than that of lower part from the begining, and above the $8^{\circ}C$ in the beginning upper part was thinner with concave, but with time thicker the upper part, vanishing concave.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.55-55
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• 2009

Silicon Carbide (SiC) is a material with a wide bandgap (3.26eV), a high critical electric field (~2.3MV/cm), a and a high bulk electron mobility (${\sim}900cm^2/Vs$). These electronic properties allow high breakdown voltage, high frequency, and high temperature operation compared to Silicon devices. Although various SiC DMOSFET structures have been reported so far for optimizing performances. the effect of channel dimension on the switching performance of SiC DMOSFETs has not been extensively examined. In this paper, we report the effect of the interface states ($Q_s$) on the transient characteristics of SiC DMOSFETs. The key design parameters for SiC DMOSFETs have been optimized and a physics-based two-dimensional (2-D) mixed device and circuit simulator by Silvaco Inc. has been used to understand the relationship with the switching characteristics. To investigate transient characteristic of the device, mixed-mode simulation has been performed, where the solution of the basic transport equations for the 2-D device structures is directly embedded into the solution procedure for the circuit equations. The result is a low-loss transient characteristic at low $Q_s$. Based on the simulation results, the DMOSFETs exhibit the turn-on time of 10ns at short channel and 9ns at without the interface charges. By reducing $SiO_2/SiC$ interface charge, power losses and switching time also decreases, primarily due to the lowered channel mobilities. As high density interface states can result in increased carrier trapping, or recombination centers or scattering sites. Therefore, the quality of $SiO_2/SiC$ interfaces is important for both static and transient properties of SiC MOSFET devices.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.678-686
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• 2001

Origins for the transconductance dispersion and the gate leakage current in a GaAs metal semiconductor field effect transistor were found using capacitance deep-level transient spectroscopy (DLTS) measurements. In DLTS spectra, we observed two surface states with thermal activation energies of 0.65 $\times$ 0.07 eV and 0.88 $\times$ 0.04 eV and an electron trap EL2 with thermal activation energy of 0.84 $\times$ 0.01 eV. Transconductance was decreased in the frequency range of 5.5 Hz ~ 300 Hz. The transition frequency shifted to higher frequencies with the increase of temperature and the activation energy for the change of the transition frequency was determined to be 0.66 $\times$ 0.02 eV. From the measurements of the gate leakage current as a function of the device temperature, the forward and reverse currents are coincident with each other below gate voltages lower than 0.15 V, namely Ohmic behavior between gate and source/drain electrodes. The activation energy for the conductance of electrons on the surface of MESFET was 0.63 $\times$ 0.01 eV. Comparing activation energies obtained by different measurements, we found surface states H1 caused the transconductance dispersion and the fate leakage current.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.525-533
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• 2003

The dimensional accuracy and global roughness between successive layers of VLM-s, which is a new rapid prototyping process using hotwire cutter and EPS foam, depend significantly on the operating parameters of hotwire cutter. In the present study, the effect of cutting angle on the kerf width and edge shape in hotwire cutting of EPS foam for the case of single-sloped cutting with one cutting angle was investigated. Through single-sloped cutting tests, the modified relationship between kerf width and effective heat input, considering the effect of the cutting angle, and the relationship between the melted area and the cutting angle were obtained. In order to investigate the effect of cutting angles on the thermal field in EPS foam, transient heat transfer analyses using single-sloped volumetric heat flux model and locally-conformed mesh were performed. Through the comparison between experimental and numerical results, it was shown that the proposed analysis model is needed to estimate the three-dimensional temperature distribution of the EPS foam for the case of single-sloped hotwire cutting.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.176-180
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• 2002

All types of VLM-s process include the linear heat cutting of EPS foam to generate a layer with 3D shape. The dimensional accuracy and part quality of the cut part are dependent on the thermal characteristics in the EPS foam. The thermal characteristics are determined by operating parameters such as an effective heat input and cutting angle. The objective of this study is to investigate into the influence of cutting angle on the kerfwidth and the melted length of the cut part using the numerical analysis and the experiments in generally sloped cutting with two cutting angles. In order to estimate an accurate temperature field, the transient thermal analysis using moving coordinate system, the fully conformed mesh and the heat flux model with two cutting angles is carried out. From the results of the analysis and the experiments, it has been found that the influence of the rotational angle about x-axis in which the rotational axis is normal with hotwire cutting direction is appreciably negligible in comparison with that of the rotational angle about y-axis.

• Nuclear Engineering and Technology
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• v.52 no.10
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• pp.2290-2298
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• 2020

The damage of first wall material in fusion reactor due to the bubbles caused by plasma has been studied by introducing a relation between the von Mises equivalent stress and the temperature field. The locations and shapes of the bubbles and the synergetic effect between the different bubbles under steady operational conditions have been studied using the finite elements method. Under transient heat loads, plastic deformations have been found to occur, and are significantly enhanced by the presence of the bubbles. The calculated concentration locations of von Mises equivalent stress are well consistent with the observed crack positions of the tungsten surface in many test experiments. Our simulations show that the damage of the bubbles is not severe enough to lead to catastrophic failure of the tungsten armor; however, it can cause local and gradual detachment of tungsten surface, which provides a reasonable explanation for the observed pits and rough or hairy surface morphology etc. Considering the transient heat loads, the lower bound of the security thickness of the tungsten tile is estimated to be greater than 2 mm.