• Title/Summary/Keyword: top-contact

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Analysis of Contact Singular Stresses with Relief Notch by Using Dynamic Photoelasticity(II) (동적 광탄성실험에 의한 응력이완 노치부근에서의 접촉특이응력 해석 (2))

  • Lee, Eok-Seop;Hwang, Si-Won;Nah, Gyeong-Chan
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.7
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    • pp.2097-2107
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    • 1996
  • The dynamic photoelastic technique had been utilized to investigate the possibillity of relieving the large local singular stresses induced at the corner of a right- angle- indenter. The indenter compressed a semi-infinite body dynamically with an impact load applied on the top of the indenter. The effects of the geometric changes of the indenter in terms of the diameter (d) and the location (1) of the stress relieving notch on the behavior of the dynamic contact stresses were investigated. The influence of stress relieving notches positioned along the edge of the semi-infinite body on the dynamic contact stresses were also studied by changing the diameter (D) and the location (L) of the notch. A multi-speak-high speed camera with twelve sparks were used to take photographs of full field dynamic isochromatic fringe patterns. The contact singular stresses were found to be released significantly by the stress relief notches both along the indenter and the edge of the semi-infinite body. The optimal position and geometry of the stress relieving notches were obtained with the aid of limited experimental results.

Development of Hydrophilic Performance Measurement System for Anti-Condensation Using Computer Image (컴퓨터 영상을 이용한 오염방지 친수성능 측정 시스템 개발)

  • Ahn, Byung-Tae;Cho, Sung-Ho;Choi, Sun;Kim, Eun-Kuk;Park, Sang-Soo;Hwang, Heon
    • Journal of Biosystems Engineering
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    • v.35 no.4
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    • pp.257-261
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    • 2010
  • Surface energy is the principal factor of anti-condensation. High surface energy appears hydrophilic itself and low surface energy represents hydrophobic itself. The contact angle is widely being used for measurement of surface energy of materials, evaluation of coating performances, measurement of wettability, and so on. However, the existing contact angle measuring system is so expensive for purchasing and complicated, so it takes a lot of time and money to use. This study was conducted to develop the algorithm for evaluating hydrophilic performance through measuring the contact angle of water droplet automatically, and fabricate relatively simple measuring system using a low-cost monochrome camera and image processing. A constant amount of water was firstly allocated on a slide by a micropipette, and then the image of water droplet was captured by monochrome digital camera and sent to a computer. The image was binarized and then reduced noises by labeling. Finally, the contact angle of water droplet was computed by using three points (left, right, and top coordinates), simple linear mathematics, and trigonometric function. The experimental results demonstrated the accuracy and reproducibility of the developed system showing less deviations and deviation ratio.

Flip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging (신축성 전자패키징을 위한 CNT-Ag 복합패드에서의 플립칩 공정)

  • Choi, Jung Yeol;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.17-23
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    • 2013
  • As a basic research to develop stretchable electronic packaging technology, CNT-Ag composite pads were formed on top of Cu/Sn chip bumps and flip-chip bonded using anisotropic conductive adhesive. Average contact resistances of the flip-chip joints were measured with respect to bonding pressure and presence of the CNT-Ag composite pads. When Cu/Sn chip bumps with CNT-Ag composite pads were flip-chip bonded to substrate Cu pads at 25MPa or 50 MPa, contact resistance was too high to measure. The specimen processed by flip-chip bonding the Cu/Sn chip bumps with CNT-Ag composite pads to the substrate Cu pads exhibited an average contact resistance of $213m{\Omega}$. On the other hand, the flip-chip specimens processed by bonding Cu/Sn chip bumps without CNT-Ag composite pads to substrate Cu pads at 25MPa, 50MPa, and 100MPa exhibited average contact resistances of $370m{\Omega}$, $372m{\Omega}$, and $112m{\Omega}$, respectively.

Wettability of denture relining materials under water storage over time

  • Jin, Na-Young;Lee, Ho-Rim;Lee, Hee-Su;Pae, Ahran
    • The Journal of Advanced Prosthodontics
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    • v.1 no.1
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    • pp.1-5
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    • 2009
  • STATEMENT OF PROBLEM. Poor wettability of denture relining materials may lead to retention problems and patient discomfort. PURPOSE. Purpose of this study is to compare and evaluate wettability of nine denture relining materials using contact angle measurements under air and water storage over time. MATERIAL AND METHODS. Nine denture relining materials were investigated in this study. Two heat-curing polymethyl-methacrylate(PMMA) denture base materials: Vertex RS, Lang, one self-curing polyethyl-methacrylate(PEMA) chairside reline resin: Rebase II, six silicone relining materials: Mucopren soft, Mucosoft, $Mollosil^{{R}}$ plus, Sofreliner Touch, GC $Reline^{TM}$ Ultrasoft, Silagum automix comfort were used in this experiment. Contact angles were measured using high-resolution drop shape analysis system(DSA 10-MK2, KRUESS, Germany) under three conditions(in air after setting, 1 hour water storage, and 24 hours water storage). Nine materials were classified into three groups according to material composition(Group 1: PMMA, Group 2: PEMA, Group 3: Silicone). Mean values of contact angles were compared using independent samples t-test and one-way ANOVA, followed by a Scheffe's post hoc analysis($\alpha$=0.01). RESULTS. Contact angles of materials tested after air and water storage increased in the following order: Group 1(PMMA), Group 2(PEMA), Group 3(Silicone). Heat-cured acrylic denture base resins had more wettability than silicone relining materials. Lang had the highest wettability after 24 hours of water storage. Silicone relining materials had lower wettability due to their hydrophobicity. Wettability of all denture relining materials, except Rebase II and $Mollosil^{{R}}$ plus, increased after 24 hours of water storage. CONCLUSIONS. Conventional heat-cured resin showed the highest wettability, therefore, it can be suggested that heat-cured acrylic resin is material of choice for denture relining materials.

Nature of contact between the Ogcheon belt and Yeongnam massif and the Pb-Pb age of granitic gneiss in Cheondong-ri, Danyang (단양 천동리 지역 옥천대/영남육괴의접촌관계와 소위 화강암질 편마암의 Pb-Pb 연대)

  • 권성택;이진한;박계헌;전은영
    • The Journal of the Petrological Society of Korea
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    • v.4 no.2
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    • pp.144-152
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    • 1995
  • The Jangsan Quartzite of the Joseon Supergroup and the foliated granite (so-called granitlc gneiss of presumed Precambrian age) of the Yeongnam massif are in direct contact at Cheondong-ri area, 6 km @SE of Danyang. sllthough it has been thought traditionally that the Jangsan Quartzite overlies unconformably the f&ted granite, it is difficult to interpret the contact as an unconformity smce the basal conglomerate in- the lower part of the Jangsan Quartzite does not have any clast of the foliated granite, Rather, recent structural studies of this area indlcate that the contact is a ductile shear zone. However, the sense and age of the shear movement are still problematic. Our mesoscopic and microscopic studies of &tre Cheondong-11 semi-brittle shear zone involving foliated cataclasite and phyllonite, which is a pa& of the Ogdong fault, indlcate a top-to-the northeast shearing, i.e., dextral strike slip. We also performed Pb-Pb dating for the age-unknown foliated granite, since the age of deformed granite ccarr emtrain the maximum age of deformation. The whole rock and feldspar Pb isotape data for the foliated granite and a micaceous xenolith define an isoc chron age of $2.16{\pm}0.15$ Ga ($2{\sigma}$;MSWD=4.4) which is interpreted as the emplacement age of the granite. This early Proterozoic age agrees with those of Precambrian igneous activity In the Yeongnam massif reported previously. The obtaiPrfid gge confirms the traditional idea about the age of the foliated granite and indicates that other methd(s) should be employed to constrain the age of the shear movement.

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The Study on the Wollastonite Mineral Resources for Silicious Fertilizer (Wollastonite을 중심(中心)으로 한 규산질비료광물자원(珪酸質肥料鑛物資源)에 관(關)한 연구(硏究))

  • Shin, Byung Woo
    • Economic and Environmental Geology
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    • v.5 no.4
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    • pp.221-229
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    • 1972
  • Through the series of study on the above subjects, the following were founded. 1. Soluble silica in paddy top-soil (xppm) and maxium possible yield (y) is expressed as following equatic $y=63.97+0.425x-0.00114x^2$ It is known that soluble silica in paddy top-soil in South Korea is limited as 130ppm. 2. Gnder the present Korean condition 90% of paddy-top-soil is estimated to be short in available silica content and the country average to only 78ppm. 3. The total area of Korean paddy-top-soil is about 1,036,710 ha. All requirements of wollastonite in South Korea estimated from the equation $Y=0.94-0.033{\times}$are about 2 million M/T 4. Silicates fertilizer minerals are Bentonite, Zeolite, Wollastonite, Serpentine, and Chlorite. But Wollastonite is most economic and can be supplied to using Korea. 5. Wollastonite is formed in contact metomorphic deposits. Limestone is the country rock of wollastonite. Limestone in Korea is in Ryunchcon system, (Pre-cambrian) Okcheon system, (unknown), Great limestone series (paleozoic), Hongjum series (Paleozoic) and Kyungsang system (mesozoic) so that the zones of these limestone and igneous rock are the possible area which wollastonite can be produced. 6. According to the published geologic map (scale 1/5000), about 25 provinces will be possible area which wollastonite can be produced. In future, I believe that many possible area will be increased. 7. According to this survey at Danyang, total wollastonite resources are about 179,000 M/T and average of soluble $SiO_2$ is 29.84%. 8. According to this survey at Daijeon, total resources are about 57,600 M/T and average of soluble $SiO_2$ is 21.53%. 9. Total wollastonite resources including Danyang, Yangduk, and Daijeon are about 1,172,200 M/T. Considering possible resources, it will be over 20 million M/T and I can say that it is possible to be supply for a score.

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COG(chip-on-glass) Mounting Using a Laser Beam Transmitting a Glass Substrate (유리 기판을 투과하는 레이저 빔을 사용한 COG(chip-on-glass) 마운팅 공정)

  • 이종현;문종태;김원용;김용석
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.1-10
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    • 2001
  • Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion (i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) were healed by the UV laser beam transmitted through the glass substrate. The lather energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, and formed a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

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Investigation of Top-Contact Organic Field Effect Transistors by the Treatment Using the VDP Process on Dielectric

  • Kim, Young-Kwan;Hyung, Gun-Woo;Park, Il-Houng;Seo, Ji-Hoon;Seo, Ji-Hyun;Kim, Woo-Young
    • Journal of the Korean Applied Science and Technology
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    • v.24 no.1
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    • pp.54-60
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    • 2007
  • 이 논문에서는 게이트 절연막 위에 vapor deposition polymerization(VDP)방법을 사용하여 성막한 유기 점착층을 진공 열증착하여 유기 박막 트랜지스터(OTFTs)소자를 제작할 수 있음을 증명하였다. 우리가 제작한 Staggered-inverted top-contact 구조를 사용한 유기 박막 트랜지스터는 전기적 output 특성이 포화 영역안에서는 포화곡선을, triode 영역에서는 비선형적인 subthreshold를 확실히 볼 수 있음을 발견했다. $0.2{\mu}m$ 두께를 가진 게이트 절연막위에 유기 점착층을 사용한 OTFTs의 장 효과 정공의 이동도와 문턱전압, 그리고 절멸비는 각각, 약 0.4cm2/Vs, -0.8V, 106 이 측정되었다. 게이트 절연막의 점착층으로써 폴리이미드의 성막을 위해, 스핀코팅 방법 대신 VDP 방법을 도입하였다. 폴리이미드 고분자막은 2,2bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride(6FDA)와 4,4'-oxydianiline(ODA)을 고진공에서 동시에 열 증착 시킨 후, 그리고 $150^{\circ}C$에서 1시간, 다시 $200^{\circ}C$에서 1시간 열처리하여 고분자화된 막을 형성하였다. 그리고 점착층이 OTFTs의 전기적 특성에 주는 영향을 설명하기 위해 비교 연구하였다.

Investigation of Microstructure and Mechanical Properties of KR60 Rail (KR60 레일의 미세조직과 기계적 물성 평가)

  • Choi, Wookjin;Cho, Hui Jae;Yun, Kyung-Min;Min, Kyung-Hwan;Lim, Nam-Hyoung;Lee, Soo Yeol
    • Korean Journal of Materials Research
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    • v.27 no.12
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    • pp.652-657
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    • 2017
  • The use of continuous welded rail is increasing because of its many advantages, including vibration reduction, enhanced driving stability, and maintenance cost savings. In this work, two different types of continuous welded rails were examined to determine the influence of repeated wheel-rail contact on the crystal structure, microstructure and mechanical properties of the rails. The crystal structure was determined by x-ray diffraction, and the microstructure was examined using optical microscopy and scanning electron microscopy. Tensile and microhardness tests were conducted to examine the mechanical behaviors of prepared specimens taken from different positions in the cross section of both newly manufactured rail and worn rail. Analysis revealed that both the new and worn rail had a mixed microstructure consisting of ferrite and pearlite. The specimens from the top position of each rail exhibited decreased lamella spacing of the pearlite and increased yield strength, ultimate tensile strength and hardness, as compared with those from other positions of the rail. It is thought that the enhanced mechanical property on the top position of the worn rail might be explained by a mixed effect resulting from a directional microstructure, the decreased lamella spacing of pearlite, and work hardening by the repeated wheel-rail contact stress.

Selective etching of SiO2 using embedded RF pulsing in a dual-frequency capacitively coupled plasma system

  • Yeom, Won-Gyun;Jeon, Min-Hwan;Kim, Gyeong-Nam;Yeom, Geun-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.136.2-136.2
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    • 2015
  • 반도체 제조는 chip의 성능 향상 및 단가 하락을 위해 지속적으로 pattern size가 nano size로 감소해 왔고, capacitor 용량은 증가해 왔다. 이러한 현상은 contact hole의 aspect ratio를 지속적으로 증가시킨바, 그에 따라 최적의 HARC (high aspect ratio contact)을 확보하는 적합한 dry etch process가 필수적이다. 그러나 HARC dry etch process는 많은 critical plasma properties 에 의존하는 매우 복잡한 공정이다. 따라서, critical plasma properties를 적절히 조절하여 higher aspect ratio, higher etch selectivity, tighter critical dimension control, lower P2ID과 같은 plasma characteristics을 확보하는 것이 요구된다. 현재 critical plasma properties를 제어하기 위해 다양한 plasma etching 방법이 연구 되어왔다. 이 중 plasma를 낮은 kHz의 frequency에서 on/off 하는 pulsed plasma etching technique은 nanoscale semiconductor material의 etch 특성을 효과적으로 향상 시킬 수 있다. 따라서 본 실험에서는 dual-frequency capacitive coupled plasma (DF-CCP)을 사용하여 plasma operation 동안 duty ratio와 pulse frequency와 같은 pulse parameters를 적용하여 plasma의 특성을 각각 제어함으로써 etch selectivity와 uniformity를 향상 시키고자 하였다. Selective SiO2 contact etching을 위해 top electrode에는 60 MHz pulsed RF source power를, bottom electrode에는 2MHz pulse plasma를 인가하여 synchronously pulsed dual-frequency capacitive coupled plasma (DF-CCP)에서의 plasma 특성과 dual pulsed plasma의 sync. pulsing duty ratio의 영향에 따른 etching 특성 등을 연구 진행하였다. 또한 emissive probe를 통해 전자온도, OES를 통한 radical 분석으로 critical Plasma properties를 분석하였고 SEM을 통한 etch 특성분석과 XPS를 통한 표면분석도 함께 진행하였다. 그 결과 60%의 source duty percentage와 50%의 bias duty percentage에서 가장 향상된 etch 특성을 얻을 수 있었다.

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