• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.164-168
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• 2011

Nanocrystalline cadmium sulphide (CdS) thin films were prepared using chemical bath deposition (CBD), and the structural, optical and photoconductive properties were investigated. The crystal structure of CdS thin film was studied by X-ray diffraction. The crystallite size, dislocation density and lattice constant of CBD CdS thin films were investigated. The dislocation density of CdS thin films initially decreases with increasing film thickness, and it is nearly constant over the thickness of 2,500 ${\AA}$. The dislocation density decreases with increasing the crystallite size. The Urbach energies of CdS thin films are obtained by fitting the optical absorption coefficient. The optical band gap of CdS thin films increases and finally saturates with increasing the lattice constant. The Urbach energy and optical band gap of the 2,900 A-thick CdS thin film prepared for 60 minutes are 0.24 eV and 2.83 eV, respectively. The activation energies of the 2,900 ${\AA}$-thick CdS thin film at low and high temperature regions were 14 meV and 31 meV, respectively. It is considered that these activation energies correspond to donor levels associated with shallow traps or surface states of CdS thin film. Also, the value of ${\gamma}$ was obtained from the light transfer characteristic of CdS thin film. The value of ${\gamma}$ for the 2,900 A-thick CdS thin film was 1 at 10 V, and it saturates with increasing the applied voltage.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.7
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• pp.974-979
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• 2013

$TiO_2$ thin films are fabricated using R.F.sputtering method. $TiO_2$ thin films are coated on $Al_2O_3$ substrate printed IDE(interdigitated electrode). Impedance of thin films decreases according to increase relative humidity and it increases according to decrease measuring frequency. When substrate temperature is room temperature, impedance of thin films is from 45.68[MHz] to 37.76[MHz] within the limits from 30[%RH] to 75[%RH] at 1[kHz]. Whereas when substrate temperature is 100[$^{\circ}C$], impedance of thin films is from 692[kHz] to 539[kHz] within the limits from 30[%RH] to 75[%RH] at 1[kHz]. Impedance variation of thin films is bigger in low frequency regions than in high frequency regions. When substrate temperature is 100[$^{\circ}C$], impedance of thin films is lower than that of room temperature.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.4
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• pp.96-101
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• 2011

The thin films of TiN have been used extensively as wear-resistant materials, for instance, such as tools of high-speed cutting, metal mold forming etc. In these days, because the thin films capable of being used more severe conditions are needed, the technologies of arc ion plating are tried to improve its characteristics. The purpose of this study is to investigate the characteristics of thin films of (Ti,Cr)N compared with those of TiN. The method of arc ion plating, which is known as showing good tight-adherence and productivity, was used. After manufacturing thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) with change of Cr in (Ti,Cr) target, atomic concentration, structure, size of crystallite, residual stress and surface roughness of thin films on substrate were investigated. As the results, it was confirmed that Cr atomic concentrations of thin films were proportionally changed with Cr atomic concentrations of target, and thin films of ($Ti_{1-x}Cr_{x}$)N (x=0~1) showed NaCl type and CrN existed as solid solution to TiN.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.166.2-166.2
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• 2014

In this work, we demonstrated a facile and effective method for deposition of metal tetraphenylporphyrin (MTPP) thin film by a combined a thermal evaporation (TE) and atomic layer deposition (ALD). For the deposition of Zn-TPP thin film, Tetraphenylporphyrin (TPP) and diethyl zinc (DEZ) were used as organic and inorganic materials, respectively. Optimum conditions for the deposition of Zn-TPP thin film were established systematically: (1) the exposure time of DEZ as inorganic precursor and (2) the substrate temperature were adjusted, respectively. As a result, we verified that the surface reaction between organic semiconductor (TPP) and metal atom (Zn) was ALD process. In addition, we calculated activation energy by using Arrhenius equation for the substrate temperature versus area change rate of pyrrolic nitrogen. The surface and interface reactions between TPP with Zn were investigated by X-ray photoelectron spectroscopy, Raman spectroscopy, UV-vis spectroscopy, and scanning electron microscopy. These results show a facile and well-controllable fabrication technique for the metal-organic thin film for future electronic applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11b
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• pp.13-14
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• 2004

Using Se as a photoconductive element and ZnS as a luminescent element, a Se/ZnS thin film device for light amplifier applications was fabricated and its characteristics were investigated At various conditions of substrate temperatures, heat treatment times, and heat treatment temperatures, Se thin films and ZnS thin films were separately deposited by an EBE(Electron Beam Evaporation) method of an high accuracy in deposition rates and the optimum fabrication conditions for the Se thin film and the ZnS thin film with a hexagonal structure were obtained The Se/ZnS thin film light amplifier was fabricated by evaporating the ZnS thin film on an ITO(Indium Tin Oxide) glass and the Se thin film on the ZnS thin film in sequence.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.431-431
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• 2007

In this paper, the LC alignment characteristics of the NDLC thin film deposited by PECVD and sputtering were reported respectively. The NDLC thin film deposited using sputter showed uniform LC alignment at the 1200 eV of the ion beam intensity and pretilt angle was about $2^{\circ}$ while the NDLC thin film deposited using the PECVD showed uniform LC alignment and high pretilt angle at the 1800 eV of the ion beam intensity. Concerning the ion beam intensity, uniform LC alignment of the NDLC thin film deposited by the sputtering was achieved at the lower intensity. And the pretilt angle of the NDLC thin film deposited by sputter was higher than those of NDLC thin film that was deposited using the PECVD. The uppermost of the thermal stability of NDLC thin film was $200^{\circ}C$, respectively. However, NDLC thin film deposited by the PECVD showed stability at high temperature without defects, compared to NDLC thin film deposited by the sputter.

• Korean Journal of Materials Research
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• v.32 no.7
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• pp.326-331
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• 2022

AZ31 magnesium alloy was used to manufacture a thin plate using a melt drag method. The effects of roll speed, molten metal temperature, and molten metal height, which are the basic factors of the melt drag method, on the surface shape, the thickness of the thin plate, Vickers hardness, and microstructure of the thin plate were investigated. It was possible to manufacture AZ31 magnesium alloy thin plate at the roll speed range of 1 to 90 m/min. The thickness of the thin plate, manufactured while changing only the roll speed, was about 1.8 to 8.8 mm. The shape of the solidified roll surface was affected by two conditions, the roll speed and the molten metal height, and the Vickers hardness of the manufactured magnesium alloy thin plate value ranged from Hv38~Hv60. The microstructure of the thin plate produced by this process was an equiaxed crystal and showed a uniform grain size distribution. The grain size was greatly affected by the contact state between the molten metal and the solidification roll, and the amount of reactive solids and liquids scraped at the same time as the thin plate. The average grain size of the thin plate fabricated in the range of these experimental conditions changed to about 50-300 ㎛.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.88-88
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• 2012

High efficiency thin film photovoltaic device technology is reviewed. At present market situation, the industrial players of thin film technologies have to confront the great recession and need to change their market strategies and find technical alternatives again. Most recent technology trends and technical or industrial progress for Silicon thin film and CIGS are introduced and common interests for high efficiency and reliability are discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2001.02a
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• pp.102-102
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• 2001

• Proceedings of the Korean Vacuum Society Conference
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• 1998.06a
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• pp.154-154
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• 1998