• 제목/요약/키워드: thickness uniformity

검색결과 364건 처리시간 0.026초

Development of a New Modeling Technique to Simulate 3-dimensional Electroplating System Considering the Effects of Fluid Flow

  • Lim, Kyung-Hwan;Lee, Minsu;Yim, Tai Hong;Seo, Seok;Yi, Kyung-Woo
    • Journal of Electrochemical Science and Technology
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    • 제10권4호
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    • pp.408-415
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    • 2019
  • Electroplating is a widely used surface treatment method in the manufacturing process of electronic parts and uniformity of the electrodeposition thickness is very crucial for these applications. Since many variables including fluid flow influence the uniformity of the film, it is difficult to conduct efficient research only by experiments. So many studies using simulation have been carried out. However, the most popular simulation technique, which calculates secondary current distribution, has a limitation on the considering the effects of fluid flow on the deposition behavior. And modified method, which is calculating a tertiary current distribution, is limited to a two-dimensional study of simple shapes because of the massive computational load. In the present study, we propose a new electroplating simulation method that can be applied to complex shapes considering the effect of flow. This new model calculates the electroplating process with three steps. First, the thickness of boundary layers on the surface of the cathode plane and velocity magnitudes at the positions are calculated from the simulation of fluid flow. Next, polarization curves of different velocities are obtained by calculations or experiments. Finally, both results are incorporated into the electroplating simulation program as boundary conditions at the cathode plane. The results of the model showed good agreements with the experimental results, and the effects of fluid flow of electrolytes on the uniformity of deposition thickness was quantitatively predicted.

열화학증기증착법을 이용한 그래핀의 합성 및 투과전자현미경 관찰용 그리드 멤브레인으로의 응용 (Synthesis of Graphene Using Thermal Chemical Vapor Deposition and Application as a Grid Membrane for Transmission Electron Microscope Observation)

  • 이병주;정구환
    • 한국재료학회지
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    • 제22권3호
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    • pp.130-135
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    • 2012
  • We present a method of graphene synthesis with high thickness uniformity using the thermal chemical vapor deposition (TCVD) technique; we demonstrate its application to a grid supporting membrane using transmission electron microscope (TEM) observation, particularly for nanomaterials that have smaller dimensions than the pitch of commercial grid mesh. Graphene was synthesized on electron-beam-evaporated Ni catalytic thin films. Methane and hydrogen gases were used as carbon feedstock and dilution gas, respectively. The effects of synthesis temperature and flow rate of feedstock on graphene structures have been investigated. The most effective condition for large area growth synthesis and high thickness uniformity was found to be $1000^{\circ}C$ and 5 sccm of methane. Among the various applications of the synthesized graphenes, their use as a supporting membrane of a TEM grid has been demonstrated; such a grid is useful for high resolution TEM imaging of nanoscale materials because it preserves the same focal plane over the whole grid mesh. After the graphene synthesis, we were able successfully to transfer the graphenes from the Ni substrates to the TEM grid without a polymeric mediator, so that we were able to preserve the clean surface of the as-synthesized graphene. Then, a drop of carbon nanotube (CNT) suspension was deposited onto the graphene-covered TEM grid. Finally, we performed high resolution TEM observation and obtained clear image of the carbon nanotubes, which were deposited on the graphene supporting membrane.

목분 충진 고분자 용융체의 압출다이 내 유동 및 열전달에 관한 수치해석 (Numerical Analysis on the Flow and Heat Transfer Characteristic of Wood-flour-filled Polypropylene Melt in an Extrusion Die)

  • 고승환;박형규;송명호;김찬중
    • 대한기계학회논문집B
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    • 제27권2호
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    • pp.147-154
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    • 2003
  • A three-dimensional numerical analysis of the flow and heat transfer characteristic of wood-flour-filled polypropylene melt in an extrusion die was carried out. Used for this analysis were Finite Concept Method based on FVM, unstructured grid and non-Newtonian fluid viscosity model. Temperature and flow fields are closely coupled through temperature dependent viscosity and viscous dissipation. With large Peclet, Nahme, Brinkman numbers, viscous heating caused high temperature belt near die housing. Changing taper plate thickness and examining some predefined parameters at die exit investigated the effect of taper plate on velocity and temperature uniformities. In the presence of taper plate, uniformity at die exit could be improved and there existed an optimum thickness to maximize it.

산화막 CMP에서 패드 두께가 연마율과 연마 불균일도에 미치는 영향 (Effect of Pad Thickness on Removal Rate and Within Wafer Non-Uniformity in Oxide CMP)

  • 배재현;이현섭;박재홍;니시자와 히데키;키노시타 마사하루;정해도
    • 한국전기전자재료학회논문지
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    • 제23권5호
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    • pp.358-363
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    • 2010
  • The polishing pad is important element for polishing characteristic such as material removal rate(MRR) and within wafer non-uniformity(WIWNU) in the chemical mechanical planarization(CMP). The result of the viscoelasticity measurement shows that 1st elastic modulus is increased and 2nd elastic modulus is decreased when the top pad is thickened. The finite element analysis(FEA) was conducted to predict characteristic of polishing behavior according to the pad thickness. The result of polishing experiment was similar with the FEA, and it shows that the 1st elastic modulus affects instantaneous deformation of pad related to MRR. And the 2nd elastic modulus has an effect on WIWNU due to the viscoelasticity deformation of pad.

RFI ionized magnetron sputtering에서 radial uniformity 문제 (Radial uniformity problem in RFI ionized magnetron sputtering)

  • 주정훈
    • 한국진공학회지
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    • 제6권1호
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    • pp.85-90
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    • 1997
  • 32cm직경의 $AlCu_x$(x=0.5%)음극 타겟과 회전 자석을 이용한 상용 마그네트론 스퍼 터링 장치에서 부가적인 플라즈마 여기 방법으로 스퍼터링된 입자들을 이온화시킨후, 수십 볼트의 직류 기판 바이어스로 이온의 방향성과 에너지를 조절하여 작은 트렌치나 via를 채 울 수 있는 공정을 개발하였다. 여기에서, 반경방향의 이온 플럭스비의 균일도 문제를 개선 하기 위하여, 입자들의 가시광선 영역의 방출선을 이용한 플라즈마 진단과, 패터닝된 웨이 퍼에 대한 직접 채우기로 플라즈마 내의 입자 분포와의 상관 관계를 찾고, RF 코일 설계의 개선을 도모하였다. 가시광 방출 분광에서 $Ar^{\circ},\;Ar^+;Al^+,\;Al^{\circ}$ 입자들의 방출선 세기는 1$\mu\textrm{m}$이 하의 크기를 갖는 트렌치와 via의 바닥과 top 두께비와 밀접한 관련이 있었다. RF코일의 직 경을 29cm에서 32cm로 증가 시키고, RF 입력부에 의한 비대칭을 개선하여 이온 플럭스비 의 척도가 되는 via 채우기의 바닥과 top의 두께비에서 7.5%에서 1.5%로의 균일도 향상을 얻었다.

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Electrode Thickness Optimization at Full Color OLED and Analysis of Power Consumption

  • Park, Sung-Joon;Kim, Ok-Tae;Kim, Hee-Je
    • KIEE International Transactions on Electrophysics and Applications
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    • 제4C권3호
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    • pp.106-110
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    • 2004
  • The operating condition of the OLED (organic light-emitting diode) is very sensitive to electrode thickness properties. The electrode thickness is a significant issue in the construction of OLEDs because of its transparency, high conductivity and high efficiency as an injector into organic materials. We carried out a systematic study to optimize the electrode thickness conditions in Indiumtin oxide (ITO), Molybdenum (Mo) and Aluminum (Al). Further, we measured electrode thickness under standard conditions [ITO 1500$\AA$, Mo 2600$\AA$, Al 1500$\AA$]. We also evaluated power consumption. In addition, we analyzed substrate uniformity with IVL measurement results. From these results, it is known that the electrode thickness should be optimized in order to accomplish optimal power efficiency.

Flow Analysis of the Spin Coating Machine

  • Ha, Man-Yeong;Kang, Dong-Hoon;Jeong, Bong-Kyo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.1147-1150
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    • 2003
  • When a braun tube becomes wider, one of the major problems to be experienced is the non-uniform coating along the four diagonal directions on its surface. This non-uniformity in the coating thickness has a deep relation with the fluid flow on the surface of a braun tube. In order to control the fluid flow properly, we install the plate to block fluid flow at the corner of a braun tube. In the present study, we investigate the effects of the geometry of plate to control the fluid flow and coating uniformity and determine the optimal shape of plate to improve the quality of coating uniformity.

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The ZnS Film Deposition Technology for Cd-free Buffer Layer in CIGS Solar Cells

  • Lee, Jae-Hee;Hwang, Do-Weon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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    • pp.218-218
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    • 2011
  • The CIGS Solar Cells have the highest conversion efficiency in the film-type solar cells. They consist of p-type CuInSe2 film and n-type ZnO film. The CdS films are used as buffer layer in the CIGS solar cells since remarkable difference in the lattice constant and energy band gap of two films. The CdS films are toxic and make harmful circumstances. The CdS films deposition process need wet process. In this works, we design and make the hitter and lamp reflection part in the sputtering system for the ZnS films deposition as buffer layer, not using wet process. Film thickness, SEM, and AFM are measured for the uniformity valuation of the ZnS films. We conclude the optimum deposition temperature for the films uniformity less than 1.6%. The ZnS films deposited by the sputtering system are more dense and uniform than the CdS films deposited by the Chemical Bath Deposition Method(CBD) for the CIGS Solar Cells.

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Uniformity Improvement of Micromirror Array for Reliable Working Performance as an Optical Modulator in the Maskless Photolithography System

  • Lee, Kook-Nyung;Kim, Yong-Kweon
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권2호
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    • pp.132-139
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    • 2001
  • We considered the uniformity of fabricated micromirror arrays by characterizing the fabrication process and calculating the appropriate driving voltages of micromirrors used as virtual photomask in maskless photolithography. The uniformity of the micromirror array in terms of driving voltage and optical characteristics is adversely affected by factors, such as the air gap between the bottom electrode and the mirror plate, the spring shape and the deformation of the mirror plate or torsion spring. The thickness deviation of the photoresist sacrificial layer, the misalignment between mirror plate and bottom electrode, the aluminum deposition condition used to produce the spring and the mirror plate, and initial mirror deflection were identified as key factors. Their importance lies in the fact that they are related to air gap deviations under the mirror plate, asymmetric driving voltages in left and right mirror directions, and the deformation of the Al sring or mirror plate after removal of the sacrificial layer. The plasma ashing conditions used for removing the sacrificial layer also contributed to the deformation of the mirror plate and spring. Driving voltages were calculated for the pixel operation of the micromirror array, and the non-uniform characteristics of fabricated micromirrors were taken into consideration to improve driving performance reliability.

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레이저를 이용한 화합물 반도체 연구 (Investigation of compound semiconductor)

  • 이승원
    • 한국광학회:학술대회논문집
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    • 한국광학회 1990년도 제5회 파동 및 레이저 학술발표회 5th Conference on Waves and lasers 논문집 - 한국광학회
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    • pp.211-214
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    • 1990
  • Investigation of GaAs/AlGaAs QW carried out by using PL and Absorption spectroscopy. In order to get high resolution (0.76meV) and low noise, proper experimental system was set-up. From measurements, we have deduced the properties of GaAs/AlGaAs QW, such as the residual impurity, well thickness, crystal quality, interface abruptness and well thickness uniformity. Also we can obtain other properties such as sub-band absorption by using Absorption Spectroscopy.

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