• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.12
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• pp.987-993
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• 2001

In this paper, we presents the construction details and output characteristics of a thick film piezoresistive strain gage. The thick film was printed on the ceramic diaphragm back side by screen printing and cured at 850$^{\circ}C$. The strain distribution and deflection on ceramic diaphragm were performed with finite-element method(FEM tool ANSYS-5.3). Various thick film strain gage characteristics were analysed, including nonlinearity, hysteresis, stability and sensitivity of thick film strain gages.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1529-1531
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• 2003

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, piezocapastive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. The screen printing technique has been used to fabricate the pressure sensors on alumina substrate($Al_2O_3$). Thick film capacitive of strain sensing characteristics are reported and dielectric paste based on (Ti+Ba) materials. The electric property of dielectric paste has been studied and exhibit good properly with good gage factor comparable to piezoresistive strain gage. New piezocapacitive strain sensor was designed and tested. The output of capacitive value was good characteristics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.884-887
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• 2003

Strain gages were widely used transducers. Essentially a strain gage was an electric element to which an appropriate type was attached. Strain was sensed by gages and provided electrical output proportional to applied forced. This paper describes the recent development of a thick film strain gage ceramic pressure sensors. The thick film resistors as strain gage in the Wheatstone bridge were fabricated with a novel mixture of ruthenium. The thick-film technology of resistors were printed on the ceramic diaphragm back side by screen printing and cured at $850^{\circ}C$. The mechanical measurements were performed with the computer simulation results(ANSYS 5.1). The output sensitivity was 1.2mV/V, of which max. nonlinearity was less than 0.29%, hysteresis was less than 0.38%FS.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.350-351
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• 2006

Thick film mechanical sensors can be categorized into four main areas piezoresistive, piezoelectric, capacitive and mechanic tube. In this areas, the thick film strain gage is the earliest example of a primary sensing element based on the substrates. The latest thick film sensor is used various pastes that have been specifically developed for pressure sensor application. Some elastic materials exhibit a change in bulk resistivity when they are subjected to displacement by an applied pressure. This property is referred to as piezoresistivity and is a major factor influencing the sensitivity of a piezoresistive strain gage. The effect of thick film resistors was first noticed in the early 1970, as described by Holmes in his paper in 1973.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.245-246
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• 2009

정전용량형 후막 스트레인 게이지(piezocapacitive thick film strain gage)는 세라믹 ($Al_2O_3$)을 주 원료로 하는 지지대(약 5mm)와 다이어프램(약 $300{\mu}m$) 그리고 가드 링으로 구성된다. 전극 판은 도전성 페이스트를 이용하여 지지대와 다이어프램에 형성되었으며 극판 사이에는 유전체 메이스트를 사용하여 스크린 인쇄로 후막을 형성하였다. 극판 사이의 가드 링 두께는 약 $30{\mu}m$정도로 다이어프램의 변위 최대값을 유지시키는 데 필요한 간격이다. 따라서 정전용랑형 후막 스트레인 게이지는 지지대를 중심으로 다이어프램에 압력 (0.5~1.0bar)이 인가될 때 변위를 발생시키면서 커패시터 값이 압력의 크기에 따라 비례 특성을 가지고 변화하는 것을 이용한 것이다. 압력이 없을때 초기값은 35pF~40pF 정도이고 정격압력의 최대치를 인가시켰을 때 약 55pF~55p를 나타내었다.

• Nano
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• v.13 no.11
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• pp.1850126.1-1850126.10
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• 2018

Flexible strain sensors, as the core member of the family of smart electronic devices, along with reasonable sensing range and sensitivity plus low cost, have rose a huge consumer market and also immense interests in fundamental studies and technological applications, especially in the field of biomimetic robots movement detection and human health condition monitoring. In this paper, we propose a new flexible strain sensor based on thick CVD graphene film and its low-cost fabrication strategy by using the commercial adhesive tape as flexible substrate. The tensile tests in a strain range of ~30% were implemented, and a gage factor of 30 was achieved under high strain condition. The optical microscopic observation with different strains showed the evolution of cracks in graphene film. Together with commonly used platelet overlap theory and percolation network theory for sensor resistance modeling, we established an overlap destructive resistance model to analyze the sensing mechanism of our devices, which fitted the experimental data very well. The finding of difference of fitting parameters in small and large strain ranges revealed the multiple stage feature of graphene crack evolution. The resistance fallback phenomenon due to the viscoelasticity of flexible substrate was analyzed. Our flexible strain sensor with low cost and simple fabrication process exhibits great potential for commercial applications.