• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.1
• /
• pp.27-31
• /
• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.2
• /
• pp.43-48
• /
• 2001

Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power losses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out in Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of such domain of hybrid circuits are also discussed.

• Applied Chemistry for Engineering
• /
• v.21 no.4
• /
• pp.411-416
• /
• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• Journal of the Microelectronics and Packaging Society
• /
• v.1 no.1
• /
• pp.41-50
• /
• 1994

RuO2 분말의 비표면적이 후막저항체의 전기적 특성에 미치는 영향을 규명하기 위하 여 비표면적이 서로다른 RuO2 분말을 이용하여 RuO2 함량을 다양하게 후막저항을 형성하 고 그들의 전기적 특성을 저항체 막의 미세조직과 관련하여 고찰하였다. 그 결과 후막저항 체의 전기적 특성은 소성과정에서 RuO2 의 비표면적과 함량에 따라 도전통로를 통하여 발 달하여 소결접촉과 비소결접촉의 수와 그 비에 크게 의존함을 확인하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.1 no.1
• /
• pp.51-60
• /
• 1994

RuO2 계 후막저항체에 사용된 유리의 입도 및 연화점이 후막저항체의 전기적 특성 에 미치는 영향을 시험하기 위하여 연화점이 서로 다른 두 종류의 유리를 제조하고 이들을 미분쇄하여 각각 세 조류의 평균입도로 분급하였다. 이 유리분말들을 이용하여 여섯 종류의 후막저항체를 제조하고 그 저항체들의 전기적 특성을 평가하고 고찰하였다. 연화점이 높은 유리로 만든 후막저항체들보다 높은 쉬트 저항을 나타냈다. 또한 후막저항체들의 쉬트 저항 및 저항온도계수는 저항체들의 미세조직과 밀접한 관계가 있음을 확인하였다.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
• /
• 2001.11a
• /
• pp.172-175
• /
• 2001

A novel microstrip type low-pass filter using thin or thick film resistors is proposed to efficiently eliminate harmonic spurious response in stop-band. The proposed low-pass filter shows the spurious suppression enhancement of 20 dB over a conventional one. The designed low-pass filter could be used as a harmonic rejection filter of a local oscillator for Ku-band satellite payload system.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.8 no.5
• /
• pp.10-19
• /
• 1971

Problems and technologies involved in integrating an audio preamplifier in terms of thick film technology has been discussed in detail. In particular, an attempt has been made to find methods for functional trimming of the amplifer by employing computer analysis. Among seven resistors integrated on a alumina substrate, only one resistor was found to be very sensitive to over all performance of the preamplifier. By trimming this resistor to its freguency charcteristic reguirements, it was possible to cut down trimming labor by one seventh. Besides, problems concerning resistor conductor contacts, crossover parasitic capacitance and the relations between noise per(ormance and trimming method are discussed in detail.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.337-338
• /
• 2006

The 200 nm thick-NiCr films grew on $SiO_2$/Si substrates at various deposition temperatures by a dc magnetron co-sputtering technique were characterized for the variation of film texture. The resistivity of the films decreases with increasing deposition temperature and temperature coefficient of electrical resistance (TCR) varies from negative value to a positive one with increasing deposition temperature. The NiCr films deposited at $300^{\circ}C$ exhibit 4 ppm/K being near zero TCR, resulting in TCR suitable for $\pi$-type attenuator applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.421-421
• /
• 2008

Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

• Journal of the Microelectronics and Packaging Society
• /
• v.2 no.1
• /
• pp.19-28
• /
• 1995

RuO2 함량을 각각 달리한 pyrochlore 구조의 Pb2Ru2O6.5분말을 제조하여 이 분말과 유기 vehicle 유기용매를 혼합하여 저항 페이스트를 제조한후 인쇄, 소결과정을 거쳐 전반적 인 물성을 분석하였고 두 종류의 페이스트에 TCR보정용 첨가제로서 ZrO2를 첨가한 경우 처가량에 따라 저항값은 크게 변화하였으나 TCR 은 약간의 변화를 보였으며 Nb2O5의 경우 저항값이 크게 증가하였으며 TCR은 2wt%까지 첨가시 매우 안정적인 값을 나타내었다. 고 정항의 경우 CuO의 첨가시 저항값이 크게 감소 하였으며 TCR은 첨가량에 따라 증가하였 으나 3wt%이상 첨가시 저항체 표면이 심하게 거칠어지는 결과를 보였다.