• 전기의세계
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• v.17 no.4
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• pp.13-17
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• 1968

Up to the present time, laminated insulators have been used for the insulation of electrical apparatus. The reason to use laminated insulators is based on the fact that electrical break-down voltage depends on the weak spot theory. If thin insulators are laminated, the weak spot existence probability across the electrodes decreases according to the number of lamination. In this test, the effect of the number of lamination and the thickness of each lamination sheets on their break-down voltage are discussed. The results taken as a whole indicate; (1) The break-down voltage of laminated insulators composed of thin sheets are higher than those of thick sheets, however, the voltage may become the same beyond any definite thickness of laminated insulators. (2) When the lamination sheets becomes thinner, the variation of break-down voltage is great according to the number of lamination sheets. (3) It may by effective to use laminated insulators even when the insulators are aparted from the electrodes.

• Journal of the Korean Ceramic Society
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• v.34 no.3
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• pp.241-248
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• 1997

RuO2 thin films were deposited on SiO2(1000$\AA$)/Si and MgO(100) single crystal substrates at low tem-peratures by hot-wall metalorganic chemical vapor deposition(MOCVD), and effects of deposition paramet-ers on the properties of the thin films were investigated. RuO2 single phase was obtained at lower de-position temperature of 25$0^{\circ}C$. RuO2 thin films deposited onto SiO2(1000$\AA$)/Si substrates showed a random orientation, and RuO2 films onto MgO(100) single crystals showed the (hk0) orientation. The crystallinity and resistivity of RuO2 thin films increased and decreased with increasing deposition temperature, respec-tively. The resistivity of RuO2 thin films decreased with decreasing the flow rate. The resistivity of the 2600$\AA$-thick RuO2 thin films deposited with O2 flow rate of 50 sccm at 35$0^{\circ}C$ was 52.7$\mu$$\Omega$-cm, and they could be applicable to bottom electrodes of high dielectric materals.

• Journal of the Korean institute of surface engineering
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• v.51 no.4
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• pp.243-248
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• 2018

All solid state thin film batteries with two types of cell structure, Pt / $LiCoO_2$ / LiPON / Cu and Pt / $LiCoO_2$ / LiPON / $LiCoO_2$ / Cu, are prepared and their electrochemical performances are investigated to evaluate the effect of $LiCoO_2$ interlayer at the interface of LiPON / Cu. The crystallinity of the deposited $LiCoO_2$ thin films is confirmed by XRD and Raman analysis. The crystalline $LiCoO_2$ cathode thin film is obtained and $LiCoO_2$ as the interlayer appears to be amorphous. The surface morphology of Cu current collector after cycling of the batteries is observed by AFM. The presence of a 10 nm-thick layer of $LiCoO_2$ at the interface of LiPON / Cu enhances the interfacial adhesion and reduces the interfacial resistance. As a result, Li plating / stripping at the interface of LiPON / Cu during charge/discharge reaction takes place more uniformly on Cu current collector, while without the interlayer of $LiCoO_2$ at the interface of LiPON / Cu, the Li plating / stripping is localized on current collector. The thin film batteries with the interlayer of $LiCoO_2$ at the interface of LiPON / Cu exhibits enhanced initial coulombic efficiency, reversible capacity and cycling stability. The thickness of the anode current collector Cu also appears to be crucial for electrochemical performances of all solid state thin film batteries.

• International Journal of Automotive Technology
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• v.8 no.2
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• pp.193-201
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• 2007

The present paper deals with the application of the explicit finite element code, PAM-CRASH, to simulate the crash behavior of steel thin-walled tubes with various cross-sections subjected to axial loading. An isotropic elastic, linear strain-hardening material model was used in the finite element analysis and the strain-rate sensitivity of mild steel was modeled by using the Cowper-Symonds constitutive equation with modified coefficients. The modified coefficients were applied in numerical collapse simulations of 11 types of thin-walled polygon tubes: 7 convex polygon tubes and 4 concave polygon tubes. The results show that the thin hexagonal tube and the thick octagonal tube showed relatively good performance within the convex polygon tubes. The crush strengths of the hexagonal and octagonal tubes increased by about 20% and 25% from the crush strength of the square tube, respectively. Among the concave tubes, the I-type tube showed the best performance. Its crush strength was about 50% higher than the crush strength of the square tube.

• Journal of the Korean Society for Heat Treatment
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• v.30 no.1
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• pp.1-5
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• 2017

A 100 nm thick $SnO_2$ thin films were prepared by radio frequency magnetron sputtering on glass substrates and then annealed in nitrogen atmosphere for 30 minutes at 100, 200, and $300^{\circ}C$, respectively. While the visible light transmittance and electrical resistivity of as deposited $SnO_2$ films were 81.8% and $1.5{\times}10^{-2}{\Omega}cm$, respectively, the films annealed at $200^{\circ}C$ show the increased optical transmittance of 82.8% and the electrical resistivity also decreased as low as $4.3{\times}10^{-3}{\Omega}cm$. From the observed results, it is concluded that post-deposition annealing in nitrogen atmosphere at $200^{\circ}C$ is an attractive condition to optimize the optical and electrical properties of $SnO_2$ thin films for the various display device applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.243.2-243.2
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• 2016

Tungsten (W) is recently gaining attention as a potential candidate to replace Cu in semiconductor metallization due to its expected improvement in material reliability and reduced resistivity size effect. In this study, the impact of electron scattering at grain boundaries in a polycrystalline W thin film was investigated. Two nominally 300 nm-thick films, a (110)-oriented single crystal film and a (110)-textured polycrystalline W film, were prepared onto (11-20) Al2O3 substrate and thermally oxidized Si substrate, respectively in identical fabrication conditions. The lateral grain size for the polycrystalline film was determined to be $119{\pm}7nm$ by TEM-based orientation mapping technique. The film thickness was chosen to significantly exceed the electron mean free path in W (16.1 and 77.7 nm at 293 and 4.2 K, respectively), which allows the impact of surface scattering on film resistivity to be negligible. Then, the difference in the resistivity of the two films can be attributed to grain boundary scattering. quantitative analyses were performed by employing the Mayadas-Shatzkes (MS) model, where the grain boundary reflection coefficient was determined to be $0.42{\pm}0.02$ and $0.40{\pm}0.02$ at 293 K and 4.2 K, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.114-115
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• 2007

In this paper, it was demonstrated that organic thin-film transistors (OTFTs) were fabricated with the organic passivation layer by vapor deposition polymerization (VDP) processing, In order to form polymeric film as an passivation layer, VDP process was also introduced instead of spin-coating process, where polymeric film was co-deposited by high-vacuum thermal evaporation from 6FDA and ODA followed by curing, Field effect mobility, threshold voltage, and on-off current ratio with 450-nm-thick organic passivation layer were about $0.21\;cm^2/Vs$, IV, and $1\;{\times}\;10^5$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.305-309
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• 2002

We have successfully fabricated a Metal-Ferroelectric-Insulator-Semiconductor (MFIS) structure using Bi$\sub$4-x/La$\sub$x/Ti$_3$O$\sub$12/ (BLT) ferroelectric thin film and SiO$_2$/Nitride/SiO$_2$ (ONO) stacked buffer layers for single transistor type ferroelectric nonvolatile memory applications. BLT films were deposited on 15 nm-thick ONO buffer layer by sol-gel spin-coating. The dielectric constant and the leakage current density of prepared ONO film were measured to be 5.6 and 1.0 x 10$\^$-8/ A/$\textrm{cm}^2$ at 2MV/cm, respectively, It was interesting to note that the crystallographic orientations of BLT thin films were strongly effected by pre-bake temperatures. X-ray diffraction patterns showed that (117) crystallites were mainly detected in the BLT film if pre-baked below 400$^{\circ}C$. Whereas, for the films pre-baked above 500$^{\circ}C$, the crystallites with preferred c-axis orientation were mainly detected. From the C-V measurement of the MFIS capacitor with c-axis oriented BLT films, the memory window of 0.6 V was obtained at a voltage sweep of ${\pm}$8 V, which evidently reflects the ferroelectric memory effect of a BLT/ONO/Si structure.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.68-93
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• 1998

The physical properties of polymer are greatly influenced by the extent to which a resin cures. The presence of un reacted monomer can, have a plasticizing effect on the polymer, thereby altering the physical and mechanical properties of dentin bonding agent (DBA). If the DBA does not polymerize sufficiently, it will leave a weak bonding layer and lead to lower bond strength. The purpose of this study was to evaluate the shear bond strengths(SBS) and the degree of conversion (DC) of 4 commercialy avilable dentin bonding systems which are composed of 2 multi-bottle systems [Scotchbond Multi-Purpose (SMP), AeliteBond(AB)] and 2 onebottle systems [SingleBond(SB), One-Step(OS)]. For shear bond strength measurement, labial surfaces of freshly extracted bovine incisors were ground with # 600 grit SiC paper to expose dentin. Four different groups of samples were formed, with 10 samples. being made for each of the 4 commercial DBA in each group according to the curing sequences of DBA and overlayer thickness of composites: Group I (standard cure and 1mm thick composites) : The DBA was light cured and the composites of 1mm thickness was applied ; Group II (standard cure and 2mm thick composites) : The DBA was light cured and the composites of 2mm thickness was applied; Group III (simultaneous cure and 1mm thick composites) : The DBA was not light-cured and simultaneously cured with composites of 1mm thickness; Group N (simultaneous cure and 2mm thick composites) : The DBA was. not light-cured and simultaneously cured with composites of 2mm thickness. The SBS was measured immediately after the composites was bonded to the bovine dentin using an Instron machine. The DC of the DBA was examined in a thin film under simulated conditions of the experimental groups according to the curing sequences and overlayer thickness of composites in the SBS test. using a Fourier transform Infrared(FTIR) spectrometer. The following results were obtained from SBS tests and DC measurements 1. In SBS tests, the multi-bottle DBA(SMP, AB) had a generally higher bond strength values than the one bottle DBA(SB, OS). In DC measurements, the one bottle DBA(SB, OS) had a significantly higher DC than the multi-bottle DBA(SMP, AB). 2. In all DBAs except OS, there was no significant difference between the bond strength of group I (standard cure and 1mm thick composites) and that of group III (simultaneous cure and 1mm thick composites). SMP, SB in Group I had a significantly higher DC than those in group III, but AB, OS in group I had a significantly lower DC than those in group III 3. All DBAs in Goup II (standard cure and 2mm thick composites) had significantly higher bond strength and DC than those in Group N (simultaneous cure and 2mm thick composites). 4. In all DBAs, there was no significantly different SBS and DC between Group I and Group II, but all DBAs in Group III had significantly higher SBS and DC than those in Group IV.

• Journal of the Korean Wood Science and Technology
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• v.10 no.1
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• pp.5-37
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• 1982

Plywood used for construction as a decorative inner material is inflammable to bring large fire accidents and burn out human life and their properties. To diminish the fire disaster, fire retardant plywood has been required indeed. In the methods of manufacturing the fire retardant plywood the soaking method is occasionally used. However after soaking plywood into fire retardant chemical solutions, redrying of soaked plywood is the most important. In this study, 3.5mm thin and 5.0mm thick plywoods were selected for fire retardant treatment. Treating solutions were prepared for 20% dilute solutions of ammonium sulfate, monoammonium phosphate, diammonium phosphate, borax-boric acid and minalith, and water solution. 1-, 3-, 6-, and 9 hour-soaking treatments were applied and after treatments hot plate drying was applied to those treated plywoods at $90^{\circ}C$, $120^{\circ}C$ and $150^{\circ}C$, of press temperature. Drying rates, drying curves, water absorption rates of fire retardant chemicals, weight per volume and fire retardant degree of plywood were investigated. The results may be summarized as follows: 1. The plywoods treated with ammonium sulfate, monoammonium phosphate and diammonium phosphate and diammonium phosphate showed increase of chemical absorption rate with proportion to increase of treating time, but not in case of the plywood treated with borax-boric acid and minalith. 2. In the treatment of definite time, the absorption rate per unit of volume of plywood showed higher in thin plywood (thickness of 3.5mm) than in thick plywood (thickness of 5.0mm). In both thin and thick plywoods, the highest absorption rate was observed in 9 hour-treatment of ammonium sulfate. The value was 1.353kg/$(30cm)^3$ in thin plywood and 1.356kg/$(30cm)^3$ in thick plywood. 3. The volume per weight of plywood after chemical treatment increased remarkably and. after hot plate drying, the values were to a little extent higher than before chemical treatment. 4. The swelling rates of thickness in chemical-treated plywoods increased similarly with that of water-treated plywood in 1- and 3 hour-treatment of both thin and thick plywoods. But in 6- and 9 hour-treatment, the greater increased value showed in water-treated ply wood than any other chemical, especially in thick plywood. 5. The shrinkage rates after hot plate drying showed the same tendency as the swelling rate, and the rate showed the increasing tendency with proportion to increase of treating time in thick plywood of both chemical and water treatments. 6. Among drying curves, the curves of water-treated plywood placed more highly than chemical-treated plywood without-relation to thickness in 6- and 9 hour-treatment except in 1- and 3 hour-treatment. 7. The drying rate related to thickness of treated plywood, was twice above in thin plywood compared with thick plywood. 8. The drying rate remarkably increased with proportion to increase of the plate temperature and, the values were respectively 1.226%/min., 6.540%/min., 25.752%/min. in hot plate temperature of $90^{\circ}C$, $120^{\circ}C$, $150^{\circ}C$ in thin plywood and 0.550%/min., 2.490%/min, 8.187%/min, in hot plate temperature of $90^{\circ}C$, $120^{\circ}C$, $150^{\circ}C$ in thick plywood. 9. In the treatment at $120^{\circ}C$ of hot plate temperature, the drying rates of chemical-treated plywood showed the highest value in monoammonium phosphate of thin plywood and in diammonium phosphate of thick plywood. But the drying rate of water-treated plywood was highest in 6- and 9 hour-treatment. 10. The fire retardant degree of chemical-treated plywood was higher than that of the untreated plywood as shown in loss of weight, burning time, flame-exhausted time and carbonized area. 11. The fire-retardant effect among fire retardant chemicals were the greatest in diammonium phosphate, the next were in monoammonium phosphate and ammonium sulfate, and the weakest were in borax-boric and minalith.