• Korean Journal of Metals and Materials
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• v.50 no.7
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• pp.539-544
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• 2012

Thermal shock behavior of TiN-coated SUS 304 substrate was investigated using a laser ablation method. By short surface ablation with a pulse Nd-YAG laser, considerable surface crack and spalling were observed, whereas there were few oxidation phenomena, such as grain growth of TiN crystallites, nucleation and growth of $TiO_2$ crystallites, which were observed from the coatings quenched from $700^{\circ}C$ in a chamber. The oxygen concentration of the ablated coating surface with the pulse laser also had a lower value than that of the quenched coating surface by Auger electron spectroscopy and electron probe micro analysis. These results were attributed to the fact that the properties of the pulse laser method have a very short heating time and so the diffusion time for oxidation was insufficient. Consequently, it was verified that the laser thermal shock test provides a way to evaluate the influence of the thermal shock load reduced oxidation effect.

• Korea-Australia Rheology Journal
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• v.19 no.4
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• pp.183-190
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• 2007

Injection molding is one of the most common operations in polymer processing. Good quality products are usually obtained and major post-processing treatment is not required. However, residual stresses which exist in plastic parts affect the final shape and mechanical properties after ejection. Residual stresses are caused by polymer melt flow, pressure distribution, non-uniform temperature field, and density distribution. Residual stresses are predicted in this study by numerical methods using commercially available softwares, $Hypermesh^{TM},\;Moldflow^{TM}\;and\;ABAQUS^{TM}$. Cavity filling, packing, and cooling stages are simulated to predict residual stress field right after ejection by assuming an isotropic elastic solid. Thermo-viscoelastic stress analysis is carried out to predict deformation and residual stress distribution after annealing of the part. Residual stresses are measured by the hole drilling method because the automotive part selected in this study has a complex shape. Residual stress distribution predicted by the thermal stress analysis is compared with the measurement results obtained by the hole drilling method. The molded specimen has residual stress distribution in tension, compression, and tension from the surface to the center of the part. Viscoelastic deformation of the part is predicted during annealing and the deformed geometry is compared with that measured by a three dimensional scanner. The viscoelastic stress analysis with a thermal cycle will enable us to predict long term behavior of the injection molded polymeric parts.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.9
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• pp.77-83
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• 2018

Thermoplastic elastomers are being used increasingly throughout industry owing to their superior properties, such as superior elasticity, formability, and recoverability. Currently, research related to thermoplastic elastomers is focused on the development of composite elastomers by combining with various materials and the development of equipment. On the other hand, in the field of small and medium sized companies, it is necessary to study not only the application of these new materials, but also the process conditions that enable the extrusion of thermoplastic elastomers in inexpensive uniaxial screwing equipment. If extrusion is performed in a single screw extruder, it is important to maintain a uniform thickness through process control of the extruder. This study examined the effects of the processing temperature, which is an extrusion process variable, on the formability of a tube in the thermoplastic elastomer TPE-800L uniaxial extrusion process. The nozzle zone temperature is the most important factor in the extrusion of thermoplastic elastomer TPE-800L; the most excellent moldability was confirmed at $165-170^{\circ}C$.

• Transactions of the KSME C: Technology and Education
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• v.3 no.4
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• pp.265-271
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• 2015

The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

• Transactions of Materials Processing
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• v.14 no.4 s.76
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• pp.384-391
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• 2005

The nickel-based alloy Nimonic 80A possesses the excellent strength, and the resistance against corrosion, creep and oxidation at high temperature. Its products are used in aerospace engineering, marine engineering and power generation, etc. Control of forging parameters such as strain, strain rate, temperature and holding time is important because change of the microstructure in hot working affects the mechanical properties. Change of the microstructure evolves by recovery, recrystallization and grain growth phenomena. The dynamic recrystallization evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range of $0.05\~5s^{-1}$ using hot compression tests. The metadynamic recrystallization and grain growth evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range $0.05,\;5s^{-1}$, holding time range of 5, 10, 100, 600 sec using hot compression tests. Modeling equations are proposed to represent the flow curve, recrystallized grain size, recrystallized fraction and grain growth phenomena by various tests. Parameters in modeling equations are expressed as a function of the Zener-Hollomon parameter. The modeling equation for grain growth is expressed as a function of the initial grain size and holding time. The modeling equations developed were combined with thermo-viscoplastic finite element modeling to predict the microstructure change evolution during hot forging process. The grain size predicted from FE simulation results is compared with results obtained in field product.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.5-18
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• 1996

The solid state cesium ion source os alumino-silicate based zeolite which contains cerium. The material is an ionic conductor. Cesiums are stably stored in the material and one can extract the cesiums by applying electric field across the electrolyte. Cesium ion bombardment has the unique property of producing high negative ion yield. This ion source is used as the primary source for the production of a negative ion without any gas discharge or the need for a carrier gas. The deposition of materials as an ionic species in the energy range of 1.0 to 300eV is recently recognized as a very promising new thin film technique. This energetic non-thermal equilibrium deposition process produces films by “Kinetic Bonding / Energetic Condensation" mechansim not governed by the common place thermo-mechanical reaction. Under these highly non-equilibrium conditions meta-stable materials are realized and the negative ion is considered to be an optimum paeticle or tool for the purpose. This process differs fundamentally from the conventional ion beam assisted deposition (IBAD) technique such that the ion beam energy transfer to the deposition process is directly coupled the process. Since cesium ion beam sputter deposition process is forming materials with high kinetic energy of metal ion beams, the process provider following unique advantages:(1) to synthesize non thermal-equilibrium materials, (2) to form materials at lower processing temperature than used for conventional chemical of physical vapor deposition, (3) to deposit very uniform, dense, and good adhesive films (4) to make higher doposition rate, (5) to control the ion flux and ion energy independently. Solid state cesium ion beam sputter deposition system has been developed. This source is capable of producing variety of metal ion beams such as C, Si, W, Ta, Mo, Al, Au, Ag, Cr etc. Using this deposition system, several researches have been performed. (1) To produce superior quality amorphous diamond films (2) to produce carbon nitirde hard coatings(Carbon nitride is a new material whose hardness is comparable to the diamond and also has a very high thermal stability.) (3) to produce cesiated amorphous diamond thin film coated Si surface exhibiting negative electron affinity characteristics. In this presentation, the principles of solid state cesium ion beam sputter deposition and several applications of negative metal ion source will be introduced.

• Korean Journal of Medicinal Crop Science
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• v.17 no.6
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• pp.379-387
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• 2009

The aim of this investigation was to examine the influence of extrusion on dietary fiber profile and the content of bioactive compounds, rutin and quercetin in young sprout, whole seed, and matured stem of Tartary buckwheat. WSI(water soluble index) is increased by a function of both screw profile and process temperature, compared to control in different parts of Buckwheat. Also, WSI of ME is increased more than 5.2 times in grain, compared to that of control. The effect of precooking by extrusion on the dietary fiber profile of buckwheat flour was evaluated. Precooking by extrusion significantly increased SDF in flour, although in most cases extrusion decrease in TDF a little. The thermo-mechanical treatment undergone by the buckwheat flour during extrusion led to redistribute part IDF fraction to SDF, leading to an increase in the latter. The content of rutin was increased about two fold in extruded flour of sprout, compared to in control. This increase maybe why these compounds are released from cell wall by high shear processing under high temperature.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4066-4076
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• 2023

Pressure resistance welding is usually used to seal the connection between the cladding tube and the end plug made of zirconium alloy. The seal welded joint has a direct effect on the service performance of the fuel rod cladding structure. In this paper, the pressure resistance welded joints of zirconium alloy tube-plug structure were obtained by thermal-mechanical simulation experiments. The microstructure and microhardness of the joints were both analyzed. The effect of processing parameters on the microstructure was studied in detail. The results showed that there was no β-Zr phase observed in the joint, and no obvious element segregation. There were different types of Widmanstätten structure in the thermo-mechanically affected zone (TMAZ) and heat affected zone (HAZ) of the cladding tube and the end plug joint because of the low cooling rate. Some part of the grains in the joint grew up due to overheating. Its size was about 2.8 times that of the base metal grains. Due to the high dislocation density and texture evolution, the microhardnesses of TMAZ and HAZ were both significantly higher than that of the base metal, and the microhardness of the TMAZ was the highest. With the increasing of welding temperature, the proportion of recrystallization in TMAZ decreased, which was caused by the increasing of strain rate and dislocation annihilation.

• Polymer(Korea)
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• v.39 no.3
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• pp.453-460
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• 2015

Engineering the polylactide via stereocomplexation with supercritical fluid (SCF) technology paved way to fabricate polymers with enhanced thermal and mechanical properties. We aimed to establish a SCF medium with excellent solubility for PLA without any additional solvent/co-solvent. We, therefore, employed supercritical dimethyl ether to synthesize 100% stereocomplex polylactide from high molecular weight homopolymers with an excellent yield. The remarkable solubility of the homopolymers in dimethyl ether is the key for quick conversion to s-PLA. This study proves a rapid synthesis route of dry s-PLA powder with sc-DME at 250 bar, $70^{\circ}C$ and 1.5 h, which are reasonably achievable processing parameters compared to the conventional methods. The degree of stereocomplexation was evaluated under the effect of pressures, temperatures, times, homopolymer-concentrations and molecular weights. An increment in the degree of stereocomplexation was observed with increased temperature and pressure. Complete conversion to s-PLA was obtained for PLLA and PDLA with $M_n{\sim}200kg{\cdot}mol^{-1}$ with a total homopolymer to total DME ratio of 6:100% w/w at prescribed reaction conditions. The degree of stereocomplexation was determined by DSC and confirmed by XRD. Considerable improvement in thermo-mechanical properties of s-PLA was observed. DSC and TGA analyses proved a $50^{\circ}C$ enhancement in melting transition and a high onset temperature for thermal degradation of s-PLA respectively.