• Journal of Advanced Marine Engineering and Technology
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• v.33 no.7
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• pp.987-993
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• 2009

An experimental study is performed to investigate unsteady mixed convection in a horizontal channel with a heat source. Particle image velocimetry (PIV) with thermo-sensitive liquid crystal (TLC) tracers is used for visualization and analysis. This method allows simultaneous measurement of velocity and temperature fields at a given instant of time. Quantitative data of the temperature and velocity are obtained by applying the color-image processing to a visualized image, and neural network is applied to the color-to-temperature calibration. It is found that the periodic flow of mixed convection in a cavity appears at very low Reynolds numbers (Re<0.4), and the period decreases with increasing Reynolds numbers and increases with increasing aspect ratio.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.183-186
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• 2003

A finite element-based, integrated process model is presented for a three dimensional, coupled analysis of the thermal and mechanical behavior of type 304 stainless slab during hot charge rolling (HCR) and cold charge rolling (CCR) processes. The validity of the proposed model is examined through comparison with measurements. The susceptibility on micro-crack initiation or propagation due to the thermal stress in these two different process conditions was examined. The model's capability of revealing the effect of diverse process parameters is demonstrated through a series of process simulation.

• Advanced Composite Materials
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• v.16 no.4
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• pp.335-347
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• 2007

Green composites composed of long maize fibers and poly $\varepsilon$-caprolactone (PCL) biodegradable polyester matrix were manufactured by the thermo-mechanical processing termed as 'Sequential Molding and Forming Process' that was developed previously by the authors' research group. A variety of processing parameters such as fiber area fraction, molding temperature and forming pressure were systematically controlled and their influence on the tensile properties was investigated. It was revealed that both tensile strength and elastic modulus of the composites increase steadily depending on the increase in fiber area fraction, suggesting a general conformity to the rule of mixtures (ROM), particularly up to 55% fiber area fraction. The improvement in tensile properties was found to be closely related to the good interfacial adhesion between the fiber and polymer matrix, and was observed to be more pronounced under the optimum processing condition of $130^{\circ}C$ molding temperature and 10 MPa forming pressure. However, processing out of the optimum condition results in a deterioration in properties, mostly fiber and/or matrix degradation together with their interfacial defect as a consequence of the thermal or mechanical damages. On the basis of microstructural observation, the cause of strength degradation and its countermeasure to provide a feasible composite design are discussed in relation to the optimized process conditions.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.10
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• pp.3334-3343
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• 1996

A quantitative flow visualization technique was developed to measure velocity and temperature fields simultaneously in a two-dimensional cross section of thermo-fluid flows. Thermochromic liquid crystal(TLC) particles are used as temperature sensor and velocity tracers. Illuminating a thermo-fluid flow with a thin sheet of white light, the reflected colors from the TLC particles in the flow were captured simultaneously by two CCD cameras; a 3-chip CCD color camera for temperature field measurement and a black and white CCD camera for velocity field measurement. Variations of temperature field were measured by using a HSI true color image processing system and TLC solution. The relationship between the hue values of TLC color image and real temperature was obtained and this calibration curve was used to measure the true temperature under the same camera and illumination condition. The velocity field was obtained by using a 2-frame PTV technique using the concept of match-probability to track true velocity vectors from two consecutive image frames. These two techniques were applied at the same time to the unsteady thermal-fluid flow in a Hele-Shaw cell to measure the temperature and velocity field simultaneously and some results are discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Carbon letters
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• v.6 no.3
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• pp.148-157
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• 2005

Carbon/Carbon Composites due to their far superior thermo-mechanical properties are used in a number of demanding applications. However, the material still is used only in specific high tech applications with few exceptions in general industrial applications. The material is extremely expensive and the major challenge is to reduce its cost. Various innovative processing routes are outlined to reduce the cost of processing.

• Transactions of Materials Processing
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• v.22 no.3
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• pp.123-132
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• 2013

Hot stamping, which is the hot pressing of special steel sheet using a cold die, can combine ease of shaping with high strength mechanical properties due to the hardening effect of rapid quenching. In this paper, a thermo-mechanical analysis of hot stamping using the finite element method in conjunction with phase transformations was performed in order to investigate the plastic deformation behavior, temperature history, and mechanical properties of the stamped car part. We also conducted a fully coupled thermo-mechanical analysis during the stamping and rapid quenching process to obtain the mechanical properties with the consideration of the effects of plastic deformation and phase transformation on the temperature histories at each point in the part. The finite element analysis could provide key information concerning the temperature histories and the sheet mechanical properties when the phase transformation is properly considered. Such an analysis can also be used to determine the effect of cyclic cooling on the tooling.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.123-126
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• 2003

A high strength aluminum alloy bolt (A7050, T7 temper treatment) has been developed by the authors. The bolt has a small grain size in the whole area of the bolt because of the large equivalent strain followed by thermo-mechanical treatment. As the bolt made of A 7050 has a risk of stress corrosion cracking, each grain should be strengthened the grain inside than the grain boundary in order to improve the stress corrosion cracking resistance. It has been confirmed that the nano-indentation hardness at each grain inside increased with the increasing equivalent strain by thermo-mechanical treatment processing.

• Transactions of Materials Processing
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• v.23 no.8
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• pp.475-481
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• 2014

Water quenching is one method of cooling after hot forming, which is presently being used for the manufacturing of automobile parts. The formed parts at room temperature are heated and then cooled rapidly in a water bath to produce high strength. The formed parts may undergo excessive thermal distortion during the water quench. In order to predict the distortion during water quenching, a coupled thermo-mechanical simulation is needed. In the current study, the simulation of heating and cooling of boron steel cylinders was performed. The material properties for the simulation were calculated from JMatPro, and the convective heat transfer coefficient was obtained from experimental tests. The results show that the thermal distortion and the residual stresses are well predicted by the coupled simulation.