• 제어로봇시스템학회논문지
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• 제14권6호
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• 대한기계학회논문집A
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• 제20권2호
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• pp.488-499
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• 1996

SMC(Sheet molding compound) is a thermosetting material reinforced with chopped fiberglass. The compression molding of SMC was analyzed based on a rigid thermo-viscoplastic approach using a three dimensional finite element program coupled with temperatures. Only the temperature analysis part was tested in this paper by solving one-dimensional heat transfer problem and comparing with the exact solutions available in the literature. Based on this comparison the program was proved to be valid and was further applied in solving compression molding of SMC between flat dies. To investigate the usefulness of a rigid thermo-viscoplastic approach in the compression molding analysis of SMC charge, compression of rectangular shaped SMC charge at plane strain and three dimensionalde formation condition was analyzed under the same condition as given in the literature. From this comparison it was found out that the rigid thermo-viscoplastic approach was useful in analyzing SMC compression molding between flat dies.

• Food Science and Biotechnology
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• 제18권5호
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• pp.1155-1160
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• 2009

Poly(lactide) (PLA)-coated paperboards were prepared by solution coating and thermo-compression coating methods and their effect of coating on the packaging properties such as tensile, water resistance, water vapor barrier, and heat sealing properties was tested. Compared with uncoated control paperboard, tensile strength (TS) of PLA-coated paperboard increased profoundly (2.2-2.6 folds) with slight increase in elongation at break (E). Water absorptiveness (WA) of the paperboard decreased 74-170 folds and water vapor permeability (WVP) decreased 6.3-22.1 folds by coating with PLA, which indicates an increase in the hydrophobicity of the surface of paperboard. Compared with polyethylene (PE)-coated paperboard, both PLA-coated paperboard exhibited 2.3 time higher heat sealing strength. In addition, the PLA-coated paperboards showed equal or higher wet TS than PE-coated paperboard. All the test results showed that the paperboard coated by the thermo-compression coating method was similar to or better than those of coated by the solution coating method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.47-48
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.933-934
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• 2008

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• Food Science and Biotechnology
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• 제16권1호
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• pp.62-66
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• 2007

Four different biopolyester films, two aliphatic polyesters including polylactides (PLA) and poly(3-hydroxy-butyrate-co-3-hydroxyvalerate (PHBV), and two aliphatic-aromatic copolyesters including Ecoplex and Biomax, were prepared using by thermo-compression, and their tensile and water barrier properties were determined. Among the films tested, PLA film was the most transparent (T: 95.8%), strongest, and stiffest (TS, 40.98 MPa; E, 1916 MPa), however it was rather brittle. In contrast, Ecoplex film was translucent while being the most flexible and resilient (EB, 766.8%). Biomax film was semitransparent and was the most brittle film tested (EB, 0.03%). All biopolyester films were water resistant exhibiting very low water solubility (WS) values ranging from 0.0.3 to 0.36%. PHBV film showed the lowest water vapor permeability (WVP) value ($1.26{\times}10^{-11}\;g{\cdot}m/m^2{\cdot}sec{\cdot}Pa$) followed by Biomax, PLA, and Ecoflex films, respectively. The water vapor barrier properties of each film were approximately 100 times higher than those of carbohydrate or protein-based films, but about 100 times lower than those of commodity polyolefin films such as low-density polyethylene (LDPE) or polypropylene (PP).

• Design & Manufacturing
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• 제14권3호
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• Elastomers and Composites
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• 제50권1호
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• pp.30-34
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• 2015

Thermo-mechanical treatment process of a compressed open-cell rigid polyurethane foam (OC-RPUF), which was fabricated for the vacuum insulation panel (VIP), was studied to obtain an optimum condition for the dimensional stability by the relaxation of compressive stress. Thermo-mechanical deformation of the sample OC-RPUF was shown to occur from about $120^{\circ}C$. Yield stress of 0.36 MPa was shown at about 10% yield strain. And, densification of the foam started to occur from 75% compressive strain and could be continued up to max. 90%. Compression set of the sample restored after initial compression to 90% at room temperature was ca. 82%. Though the expansion occurred to about twice of the originally compressed thickness in case of temperature rise to $130^{\circ}C$, it could be overcome and the dimensional stability could be maintained if the constant load of 0.3 MPa was applied. As the result, a thermo-mechanical treatment process, i.e, annealing process at temperature of $130{\sim}140^{\circ}C$ for about 20 min as is the maximum compressed state at room temperature, should be required for dimensional stability as an optimum condition for the use of VIP core material.

• 마이크로전자및패키징학회지
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• 제20권2호
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• pp.17-22
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• 2013

본 연구에서는 Sn-58Bi 솔더를 이용한 경성 인쇄 회로 기판 (Rigid printed circuit board, RPCB)과 연성 인쇄회로 기판 (Flexible printed circuit board, FPCB) 간의 열압착 접합 시, 접합 조건에 따른 기계적 특성에 대하여 연구하였다. 접합 온도와 접합 시간을 변수로 열압착 접합을 실시하여 $90^{\circ}$ 필 테스트(Peel test)를 통해 접합 강도를 측정하고, 단면과 파단면을 관찰하였다. 접합 온도가 증가할수록 접합 강도가 증가하였으며, 접합 시간에 따른 접합 강도의 변화 또한 관찰할 수 있었다. 접합 시간이 증가하면서 접합부의 파괴에 영향을 미치는 요인이 솔더 층에서 금속간 화합물(Intermetallic compound, IMC) 층으로 변화하는 것을 관찰할 수 있었다. 필 테스트 과정의 F-x(Force-distance) curve를 통해 파괴 에너지를 계산하여 금속간 화합물이 접합 강도에 미치는 영향을 평가하였으며, 본 연구에서 $195^{\circ}C$, 7초 조건이 접합 강도와 파괴 에너지가 가장 높게 나타나는 최적 접합 조건으로 도출되었다.