• Steel and Composite Structures
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• v.50 no.6
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• pp.609-625
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• 2024

This paper presents an in-depth analysis of the nonlinear vibration of microbeams, with a particular emphasis on their application in sports monitoring systems. The research utilizes classical beam theory, modified couple stress theory, and von-Kármán nonlinear parameters to explore the behavior of microbeams. These microbeams are characterized by a non-uniform geometry, with materials that continuously change along the beam radius and a thickness that varies along the beam length. The main contribution lies in its exploration of the stability of smart sensors in sports structures, particularly those with non-uniform geometries. The research findings indicate that these non-uniform microbeams, when used in smart systems made of functionally graded temperature-dependent materials, can operate effectively in thermal environments. The smart system developed in this study demonstrates significant potential for use in sports applications, particularly in monitoring and gathering information. The insights gained from this research contribute to the understanding of the performance and optimization of microbeams in sports applications, particularly in the context of non-uniform geometries. This research, therefore, provides a foundation for the development of advanced, reliable, and efficient monitoring systems in sports applications.

• Tunnel and Underground Space
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• v.31 no.4
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• pp.289-308
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• 2021

This study conducts coupled thermo-hydro-mechanical numerical modeling to investigate the maximum temperature and conditions for securing mechanical stability of the high-level radioactive waste repository when temperature criteria of bentonite buffer are 100℃ and 125℃, respectively. In case of temperature criterion of buffer as 100℃, the maximum temperatures at the interface between canister and buffer are calculated to be 99.4℃ and 99.8℃, respectively for a case with disposal tunnel spacing of 40 m and deposition hole spacing of 5.5 m and for the other case with disposal tunnel spacing of 30 m and deposition hole spacing of 6.5 m. In case of temperature criterion of buffer as 125℃, spacings of disposal tunnel and deposition hole could be decreased to 30 m and 4.5 m, respectively, which reduces the disposal area up to 55% compared to the disposal area of KRS⁺. According to analysis of mechanical stability for various disposal spacings, RMR of rock mass for KRS⁺ should be larger than 72.4 which belongs to good rock in RMR classification to prevent failure of rock mass. As disposal spacing is decreased, required RMR of rock mass is increased. In order to prevent failure of rock mass for a case with disposal tunnel spacing of 30 m and deposition hole spacing of 4.5 m, RMR larger than 87.3 is needed. However, mechanical stability of the repository is secured for all cases with RMR over 75 considering the enhancement of rock strength due to confining stress induced by swelling of the bentonite buffer and backfill.

• Journal of the Korea Convergence Society
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• v.9 no.4
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• pp.151-160
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• 2018

Waxes currently used as a coating material to preserve surfaces of outdoor iron sculptures tend to face lower coating strength and efflorescence due to the aging from air pollution and acid rains. Consequently, they are subjected to repeated corrosions shortly after the treatment. And the sculptures face the problem losing their original nature because of the changes of colors and lusters, so this convergence study aims at developing wax with better performance than the existing materials. For this reason, the study identified the effects of physical property using the environmental experiments such as the tests of salt spray and gas corrosion as well as the analysis of luster level and thermo-gravimetry. As this study result, the developed ISC wax showed the excellent blocking effect from salt water and coating durability more than five times compared with the existing waxes, better acid resistance by two-four times, sun block effect by 2-10 times, improved luster variance by 3-16 times, improved thermo-stability and durability by 0.5-5 times, and therefore demonstrating far better coating effect than the existing waxes. In the light of these findings, this study contributes for this new development which can replace the existing waxes used so far in order to preserve the outdoor iron sculptures.

• Polymer(Korea)
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• v.36 no.4
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• pp.525-530
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• 2012

In this study, silane-crosslinked organic/inorganic composite membranes were prepared by simultaneous irradiation grafting of binary monomer mixtures (styrene and 3-(trimethoxysilyl)propyl methacrylate (TMSPM)) with various compositions onto a poly(ethylene-alt-tetraethylene) (ETFE) film and followed by sol-gel processing and sulfonation to provide a silane-crosslinked structure and a proton conducting ability, respectively. The Fourier transform infrared spectroscopy (FTIR) and thermo gravimetric analysis (TGA) were utilized to confirm the crosslinking of ETFE-g-PS/PTMSPM films. The prepared membranes with similar ion exchange capacity but a different TMSPM content were selected and their membrane properties were compared. The ETFE-g-PSSA/PTMSPM membranes were characterized by water uptake, dimensional stability, and proton conductivity after sulfonation. The membrane electrode assemblies (MEA) of the prepared membranes were fabricated and their single cell performances were measured.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.882-892
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• 2011

The influence of rhenium (Re) and ruthenium (Ru) addition on the solidification and solute redistribution behaviors in advanced experimental Ni-base superalloys has been investigated. A series of model alloys with different levels of Re and Ru were designed based on the composition of Ni-6Al-8Ta and were prepared by vacuum arc melting of pure metallic elements. In order to identify the influence of Re and Ru addition on the thermo-physical properties, differential scanning calorimetry analyses were carried out. The results showed that Re addition marginally increases the liquidus temperature of the alloy. However, the ${\gamma}^{\prime}$ solvus was significantly increased at a rate of $8.2^{\circ}C/wt.%$ by the addition of Re. Ru addition, on the other hand, displayed a much weaker effect on the thermo-physical properties or even no effect at all. The microsegregation behavior of solute elements was also quantitatively estimated by an electron probe microanalysis on a sample quenched during directional solidification of primary ${\gamma}$ with the planar solid/liquid interface. It was found that increasing the Re content gradually increases the microsegregation tendency of Re into the dendritic core and ${\gamma}^{\prime}$ forming elements, such as Al and Ta, into the interdendritic area. The strongest effect of Ru addition was found to be Re segregation. Increasing the Ru content up to 6 wt.% significantly alleviated the microsegregation of Re, which resulted in a decrease of Re accumulation in the dendritic core. The influence of Ru on the microstructural stability toward the topologically close-packed phase formation was discussed based on Scheil type calculations with experimentally determined microsegregation results.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Geomechanics and Engineering
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• v.16 no.4
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• pp.363-373
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• 2018

The evaluation of Thermo-Hydro-Mechanical (THM) coupling behavior is important for the development of underground space for various purposes. For a high-level radioactive waste repository excavated in a deep underground rock mass, the accurate prediction of the complex THM behavior is essential for the long-term safety and stability assessment. In order to develop reliable THM analysis techniques effectively, an international cooperation project, Development of Coupled models and their Validation against Experiments (DECOVALEX), was carried out. In DECOVALEX-2015 Task B2, the in situ THM experiment that was conducted at Horonobe Underground Research Laboratory(URL) by Japan Atomic Energy Agency (JAEA), was modeled by the research teams from the participating countries. In this study, a THM coupling technique that combined TOUGH2 and FLAC3D was developed and applied to the THM analysis for the in situ experiment, in which rock, buffer, backfill, sand, and heater were installed. With the assistance of an artificial neural network, the boundary conditions for the experiment could be adequately implemented in the modeling. The thermal, hydraulic, and mechanical results from the modeling were compared with the measurements from the in situ THM experiment. The predicted buffer temperature from the THM modelling was about $10^{\circ}C$ higher than measurement near by the overpack. At the other locations far from the overpack, modelling predicted slightly lower temperature than measurement. Even though the magnitude of pressure from the modeling was different from the measurements, the general trends of the variation with time were found to be similar.

• KSBB Journal
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• v.13 no.5
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• pp.502-510
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• 1998

Stabilization of antibody, which is specific to Salmonella typhimurium antigens, present in dry states on membranes was accomplished, and its shelf-life, i.e., duration for maintaining minimum 90% of the initial activity, under optimal conditions was determined. To prepare two major components of an immuno-strip, the antibody was not only immobilized on nitrocellulose membrane surfaces but also placed within the pores of glass fiber membrane after conjugating it with old colloids as signal generator. Among potential stabilizers of the immuno-components, a disaccharide, trehalose, showed a significant protection effect of immunoglobulin structure from thermal energy. Optimal concentrations of trehalose for the respective component were significantly different (8-fold higher for the antibody-gold conjugate than for the immobilized antibody), which probably resulted from distinct densities and configurations of antibody present on the membranes. An additional requirement for the gold conjugate was freeze-drying of this substance such that the conjugate can be readily resolubilized upon contact with aqueous medium. By using the components prepared under optimal conditions, immuno-strips were constructed and exposed to thermal energy. Signals with less than 10% decrease in the intensity were maintained for approximately 21 days at 60$^{\circ}C$. Compared to previous reports, this result represented a 2-year shelf-life at room temperature. it was, however, two times longer if determined from thermal acceleration tests based on the theory of inactivation rate of protein. Such discrepancy between the two estimates could be mainly attributed to errors in accurately controlling temperatures and also to changes in the physical properties of membranes due to a high thermal energy.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.10
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• pp.952-958
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• 2011

On-board IR calibration device has been developed for calibration of spaceborne image sensor. It is composed of a blackbody to provide two different radiance temperatures, tilt mirror with a function of stow and deploy to view the blackbody during the calibration and on-board calibration control unit to control the function of the blackbody and tilt mirror. In this paper, to guarantee the structural safety of the unit, the structural and thermal analysis including a thermo-elastic analysis for verifying structural safety on the soldered part of chips have been performed. In addition, safety margin of the chips on the PCB obtained from the conventional analytical method has been compared to the results from the FEM analysis.