• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.337-337
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• 2001

High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

• Journal of the Korean Ceramic Society
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• v.44 no.4 s.299
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• pp.214-218
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• 2007

The decrease of polarization resistance in cathode is the key point for operating at intermediate temperature SOFC (solid oxide fuel cell). In this study, the influence of Co substitution in B-site at complex perovskite on the electronic conductivity of PSCM ($Pr_{0.3}Sr_{0.7}Co_xMn_{(1-x)}$) was investigated. The PSCM series exhibits excellent MIEC (mixed ionic electronic conductor) properties. The ASR (area specific resistance) of PSCM3773 was $0.174{\Omega}{\cdot}cm^2\;at\;700^{\circ}C$. The activation energy of PSCM3773 was also lower than other compositions of PSCM. The TEC(thermal expansion coefficient) was decreased by addition of Mn. The ASR values were increased gradually during the thermal cycling test of PSCM37773 due to the delamination between electrolyte and cathode materials. The delamination was caused by the difference of TEC.

• Progress in Superconductivity and Cryogenics
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• v.16 no.4
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• pp.49-52
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• 2014

REBCO coated conductor (CC) tapes with superior mechanical and electromechanical properties are preferable in applications such as superconducting coils and magnets. The CC tapes should withstand factors that can affect their performance during fabrication and operation of its applications. In coil applications, CC tapes experience different mechanical constraints such as tensile or compressive stresses. Recently, the critical current ($I_c$) degradation of CC tapes used in coil applications due to delamination were already reported. Thermal cycling, coefficient of thermal expansion mismatch among constituent layers, screening current, etc. can induce excessive transverse tensile stresses that might lead to the degradation of $I_c$ in the CC tapes. Also, CC tapes might be subjected to very high magnetic fields that induce strong Lorentz force which possibly affects its performance in coil applications. Hence, investigation on the delamination mechanism of the CC tapes is very important in coiling, cooling, operation and design of prospect applications. In this study, the electromechanical properties of REBCO CC tapes fabricated by reactive co-evaporation by deposition and reaction (RCE-DR) under transversely applied loading were investigated. Delamination strength of the CC tape was determined using the anvil test. The $I_c$ degraded earlier under transverse tensile stress as compared to that under compressive one.

• Progress in Superconductivity and Cryogenics
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• v.16 no.1
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• pp.14-18
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• 2014

The mechanical, electrical and thermal characteristics of insulating materials may significantly affect the performance and reliability of electrical devices using superconductors. General method to provide insulating layer between coated conductors is wrapping coated conductor with Kapton tape. But uniform and compact wrapping without failure or delamination in whole coverage for long length conductor is not a simple task and need careful control. Coating of insulating layer directly on coated conductor is desirable for providing compact insulating layer rather than wrapping insulating layers around conductor. Ceramic added polymer has been widely used as an insulating material for electric machine because of its good electrical insulating properties as well as excellent heat resistance and fairy good mechanical properties. The insulating layer of coated conductor should have high breakdown voltage and possesses suitable mechanical strength and maintain adhesiveness at the cryogenic temperature where it is used and withstand stress from thermal cycling. The insulating and mechanical properties of polymer can be improved by adding functional filler. In this study, insulating layer has been made by adding ceramic particles such as $SiO_2$ to a polymer resin. The size, amount and morphology of added ceramic powder was controlled and their effect on dielectric property of the final composite was measured and discussed for optimum composite fabrication.

• Bulletin of the Korean Chemical Society
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• v.29 no.9
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• pp.1737-1741
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• 2008

The electrochemical and thermal stability of $LiNi_{0.8}Co_{0.16}Al_{0.04}O_2$ were studied before and after $Co_3(PO_4)_2$ coating. Different to conventional coating material such as $ZrO_2$ or AlPO4, the coating layer was not detected clearly by TEM analysis, indicating that the $Co_3(PO_4)_2$ nanoparticles effectively reacted with surface impurities such as $Li_2CO_3$. The coated sample showed similar capacity at a low C rate condition. However, the rate capability was significantly improved by the coating effect. It is associated with a decrease of impedance after coating because impedance can act as a major barrier for overall cell performances in high C rate cycling. In the DSC profile of the charged sample, exothermic peaks were shifted to high temperatures and heat generation was reduced after coating, indicating the thermal reaction between electrode and electrolyte was sucessfully suppressed by $Co_3(PO_4)_2$ nanoparticle coating.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.61-68
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• 2002

Thermal shock testing was used to evaluate reliability that appeared in the solder joints of electronic devices when they were subjected to thermal cycling. Recently, mobile devices have come smaller and multi-functional, with the increasing need for high-density packaging, BGA or CSP has become the main trend for surface mounting technology, and therefore mechanical stress life for solder joints in BGA/CSP type packages has required. Reliability of BGA/CSP solder joints was evaluated with electric resistivity change of daisy chain pattern and stress-strain curve measured using strain gage attached on the surface of PCB under mechanical impact loading. In this report, applications of PCB Universal Testing Machine we have developed and experimental datum of SONY estimating dynamic behavior of mechanical stress in BGA/CSP solder joints are introduced.

• Journal of the Korean Society for Heat Treatment
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• v.7 no.3
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• pp.169-174
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• 1994

The reaction layer formed at interface between matrix and fiber has significant effects on the mechanical properties and behaviors of deformation m FRM. In this study, the mechanical properties and interfacial behaviors according to surface finishing on the fibers and according to heat treatment in FRM were investigated. FRM was fibricated by diffusion bonding method. In W/Al alloy composite and W/Al composite, W of which was coated with $WO_3$, the heat treatment was carried out thermal cycling method from 373K to 673K. In W/Al composite, W of which was coated with $WO_3$, growth of interface layer was hardly occured in spite of the increasing various thermal cycles. It was exhibited that oxidized W/Al composite were higher strength than non-oxidezed W/Al composite with the increasing thermal cycles. The compounds of fiber/matrix interface were analyzed into $WAl_{12}$, $WAl_7$, and $AlWO_3$, respectivly. Therefore the interfacial compounds of fiber/matrix seriously affected the mechanical properties and behaviors of deformation in FRM.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.199-204
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Journal of the KSME
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• v.33 no.8
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• pp.739-745
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• 1993

60년대 이후 경제개발과 더불어 건설된 화력발전소는 장기사용 및 주기 운전 (cycling operation)에 따라 경년열화가 상당히 진행된 상태로 가동되고 있다. 또한 설비운용 기 술도 고장보수(failure maintenance), 예방보수(protective maintenance) 단계를 거쳐 80년대 후 반기부터는 예측보수(predictive maintenance)에 주안점을 두게 되었으며 사회변화에 따른 신규 발전설비의 건설부지 확보, 환경 규제의 엄격 등이 당면 과제로 대두되었다. 따라서 경년화력의 장수명화, 고효율, 저공해 발전방식의 실용화 등이 현실적인 대책이므로 경년화력의 정밀진단 및 평가기술의 고도화 신형발전설비의 개발 등이 연구개발의 주측이 되고 있다. 이 글에서는 국내 에서 추진되고 있는 이들 기술개발의 현황과 향후계획을 제시하여 산 . 학 . 연의 보다 긴밀한 연구활동에 기여하고자 한다.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1686-1687
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• 2011

A microfabricated chip with in-channel electrochemical cell using interdigitated gold electrode was fabricated for sensitive electrochemical analysis. The gold electrodes were fabricated on glass wafer using thermal evaporator and were covered using PDMS mold containing microchannel for analyte and electrolyte. The active area of each electrode was $250\;{\mu}m{\times}200\;{\mu}m$ with a gap of 200 ${\mu}m$ between the electrodes. Microelectrodes results in maximum amplification of signal, since the signal enhancement effect due to cycling of the reduced and oxidized species strongly depends on the inter electrode distance. Analytes such as methylene blue and guanosine were characterized using the fabricated electrodes and their electrochemical characteristics were compared with conventional bulk electrodes. The device so developed shall find use as disposable electrochemical cell for rapid and sensitive analysis of electroactive species.