• 제목/요약/키워드: thermal vapor deposition

검색결과 541건 처리시간 0.029초

Plasma nitridation of atomic layer deposition-Al2O3 by NH3 in PECVD

  • Cha, Ham cho rom;Cho, Young Joon;Chang, Hyo Sik
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.304.1-304.1
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    • 2016
  • We have investigated the effect of plasma nitridation of atomic layer deposited-Al2O3 films of monocrystalline Si wafers and the thermal properties of nitridated Al2O3 films. Nitridation was performed on Al2O3 to form aluminum oxynitride (AlON) using NH3 plasma treatment in a plasma-enhanced chemical vapor deposition and it was conducted at temperature of $400^{\circ}C$ with various plasma power condition. After nitridation, we performed firing and forming gas annealing (FGA). For each step, we have observed the minority carrier lifetime and the implied Voc by using quasi-Steady-State photoconductance (QSSPC). We confirmed a tendency to increase the minority carrier lifetime and the implied Voc after the nitridation. On the other hand, the minority carrier lifetime and the implied Voc was decreased after Firing and forming gas annealing (FGA). To get more information, we studied properties of the plasma treated Al2O3 films by using Secondary Ion Mass Spectroscopy (SIMS) and X-ray Photoelectron Spectroscopy (XPS).

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Characteristics of Plasma Polymerized Low-dielectric Constant SiCOH Films Deposited with Tetrakis(trimethylsilyloxy)silane and Cyclohexane Precursors

  • Kim, Hoonbae;Oh, Hyojin;Lee, Chaemin;Jung, Donggeun;Boo, Jin-Hyo
    • Bulletin of the Korean Chemical Society
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    • 제35권10호
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    • pp.2941-2944
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    • 2014
  • The electrical and mechanical properties of the plasma polymerized low dielectric constant SiCOH films were investigated. The SiCOH films were produced with tetrakis(trimethylsilyloxy)silane and cyclohexane as precursors by using a plasma enhanced chemical vapor deposition. When the deposition plasma powers were changed from 10 to 50 W, the relative dielectric constant of the SiCOH film increased from 2.09 to 2.76 and their hardness and elastic modulus were changed from 1.6 to 5.6 GPa and from 16 to 44 GPa, respectively. After thermal annealing at $500^{\circ}C$, the annealed SiCOH films showed relative dielectric constants of 1.80-2.97, a hardness of 0.45-0.6 GPa and an elastic modulus of 6-7 GPa. And then, the chemical structures of as-deposited and annealed SiCOH films were analyzed by using Fourier transform infrared spectroscopy.

Investigation on Reaction Pathways for ZnO Formation from Diethylzinc and Water during Chemical Vapor Deposition

  • Kim, Young-Seok;Won, Yong-Sun
    • Bulletin of the Korean Chemical Society
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    • 제30권7호
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    • pp.1573-1578
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    • 2009
  • A computational study of the reactions between Zn-containing species, the products of the thermal decomposition of diethylzinc (DEZn) and water was investigated. The Zn-containing species – $C_2H_5)_2,\;HZnC_2H_5,\;and\;(ZnC_2H_5)_2$ – were assumed to react with water during ZnO metal organic chemical vapor deposition (MOCVD). Density functional theory (DFT) calculations at the level of B3LYP/6-311G(d) were employed for the geometry optimization and thermodynamic property evaluation. As a result dihydroxozinc, $Zn(OH)_2$, was the most probable reaction product common for all three Zn-containing species. A further clustering of $Zn(OH)_2$ was investigated to understand the initial stage of ZnO film deposition. In experiments, the reactions of DEZn and water were examined by in-situ Raman scattering in a specially designed MOCVD reactor. Although direct evidence of $Zn(OH)_2$ was not observed, some relevant reaction intermediates were successfully detected to support the validity of the gas phase reaction pathways proposed in the computational study.

Thermodynamic analysis on the chemical vapor deposition process of Ta-C-H-Cl system

  • Kim, Hyun-Mi;Shim, Kwang Bo;Lee, Jung-Min;Lee, Hyung-Ik;Choi, Kyoon
    • Journal of Ceramic Processing Research
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    • 제19권6호
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    • pp.519-524
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    • 2018
  • Carbon/carbon composites (C/C) have been widely studied in the aerospace field because of their excellent thermal shock resistance and specific strength at high temperature. However, they have the problems that is easily oxidized and deteriorated under atmospheric environment. In order to overcome these shortcomings, the CVD coating of ultra-high-temperature ceramics to C/C has become an important technical issue. In this study, thermodynamic calculations were performed to TaC CVD coating on C/C by FactSage 6.2 program. The Ta-C phase diagrams were constructed with the results of thermodynamic calculations in the Ta-C-H-Cl system. Based on the Ta-C phase diagram, the experimental conditions were designed to confirm the deposition of various phases such as TaC single phase, TaC + C and $TaC+Ta_2C$ by varying the composition of Ta/C ratio. The deposited films were found to be in good agreement with the predicted phases.

터빈블레이드 형상 mock-up의 기하학적 배치조건에 따른 전자빔 물리기상증착법으로 제조된 7 wt% YSZ 열차폐 코팅의 코팅 균일성 (Deposition uniformity of 7 wt% YSZ as a thermal barrier coating with different configurational arrangement for turbine blade shape mock-up by electron beam physical vapor deposition)

  • 오윤석;채정민;류호림;한윤수;안종기;손명숙;김홍규
    • 한국결정성장학회지
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    • 제29권6호
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    • pp.308-316
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    • 2019
  • 전자빔 물리기상증착기술(EBPVD)은 주상형 성장거동과 같이 고온에서의 구조 안정성에 기여할 수 있는 특성으로 인해 터빈블레이드 등과 같은 항공기 엔진 고온부품의 열차폐 코팅(TBC) 제조기술로 개발되어 상용화된 기술이다. 전자빔 증착으로 열·기계적 특성이 상용화 가능한 수준에 만족하는 고품질 열차폐 코팅제조를 위해서는 성장거동, 균일두께형성 등과 같은 구조적 요소의 제어가 반드시 수반되어야 한다. 본 연구에서는 실품형상에 근사한 터빈 블레이드 mock-up에 대한 기하학적 코팅인자 조건에 따른 7YSZ(7 wt% 이트리아 안정화 지르코니아) 열차폐 코팅의 성장거동과 구조변화를 고찰하였으며, 전산모사 기법을 활용한 기하학적 코팅인자 조건에 따른 코팅성장거동 모델링을 수행하여 실제 코팅결과와 비교하였다.

Characteristics of pentacene transistor using Organic Flow Deposition (OFD) equipment

  • Jung, Ki-Taek;An, Young-Ung;Ji, Jong-Yeoul;Choi, Jun-Young;Lee, Young-Jong;Han, Seung-Hoon;Jang, Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1611-1614
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    • 2007
  • This paper is concerned on design of organic flow deposition system and development of the deposition process for pentacene thin film by OFD and on electrical characteristics of pentacene films deposited by it. OFD will overcome vacuum thermal evaporator's limits and it will provide a large-scale mass, uniform and good electrical performance.

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MEMS 적용을 위한 비정질 상 탄소박막의 나노 스케일 마찰력 특성연구 (A study on nano-scale friction of hydrogenated amorphous carbon for application in MEMS)

  • 고명균;박종완
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1211-1214
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    • 2003
  • The film is prepared by electron cyclotron resonance chemical vapor deposition (ECRCVD) employing CH$_4$ and H$_2$ gases. It is deposited by the control of microwave plasma power, gas flow ratio, deposition pressure, and In-situ thermal treatment temperature. The structure of a-C:H (hydrogenated amorphous carbon) thin film is analysed by FT-IR spectroscopy. The fraction sp$^3$ versus sp$^2$ bonding is very important to clear up the surface and interrace of a-C:H film properties such as nano-scale friction behavior. The sp$^3$ versus sp$^2$ bonding of a-C:H thin film is dependent on the deposition conditions, therefore. nano-scale friction behavior is dependent on the deposition conditions.

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Hafnium Oxide Nano-Film Deposited on Poly-Si by Atomic Layer Deposition

  • Wei, Hung-Wen;Ting, Hung-Che;Chang, Chung-Shu
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.496-498
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    • 2005
  • We reported that high dielectric hafnium oxide nano-film deposited by thermal atomic layer deposition on the poly-silicon film (poly-Si). The poly -Si film was produced by plasma enhanced chemical vapor deposition and excimer laser annealing. We used the hafniu m chloride ($HfCl_4$) and water as the precursors and analyzed the hafnium oxide film by transmission electron microscope and secondary ion mass spectrometer. Hafnium oxide produced by the ALD method showed very good coverage on the rough surface of poly-Si film. While deposited with 200 cycles, these hafnium oxide films revealed a relatively smooth surface and good uniformity, but the cumulative roughness produced by the incomplete reaction was apparent when the amount of deposition cycle increased to 600 cycles.

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전자 빔 물리적 증착(EB-PVD)법으로 코팅된 YSZ 열차폐층의 압흔손상 거동에 대한 하부층의 영향 (Influence of Subsurface Layer on the Indentation Damage Behavior of YSZ Thermal Barrier Coating Layers Deposited by Electron Beam Physical Vapor Deposition)

  • 허용석;박상현;한인섭;우상국;정연길;백운규;이기성
    • 한국세라믹학회지
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    • 제45권9호
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    • pp.549-555
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    • 2008
  • The thermal barrier coating must withstand erosion when subjected to flowing gas and should also maintain good stability and mechanical properties while it must also protect the turbine component from high temperature, hot corrosion, creep, and oxidation during operation. In this study we investigated the influence of subsurface layer, $Al_2O_3$ or NiCrCoAIY bond coat layer, on the indentation damage behavior of YSZ thermal barrier coating layers deposited by electron beam physical vapor deposition (EB-PVD). The bond coat is deposited using different process such as air plasma spray (APS) or spray of high velocity oxygen fuel (HVOF) and the thickness is varied. Hertzian indentation technique is used to induce micro damages on the coated layer. The stress-strain behaviors are characterized by results of the indentation tests.

다결정 산화갈륨/다이아몬드 이종 박막 성장 및 열처리 효과 연구 (Growth and thermal annealing of polycrystalline Ga2O3/diamond thin films on Si substrates)

  • 서지연;김태규;신윤지;정성민;배시영
    • 한국결정성장학회지
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    • 제31권6호
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    • pp.233-239
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    • 2021
  • 본 연구에서는 산화갈륨의 방열 특성 향상을 위해 산화갈륨/다이아몬드 이종 박막 성장을 진행하였다. 먼저, 핫필라멘트 화학기상증착법을 이용하여 다결정 다이아몬드를 증착시킨 후, 미스트 화학기상증착법을 통해 450~600℃ 사이의 온도구간에서 산화갈륨 박막을 성장시켰다. 열처리 전후 비교를 통해 500℃에서 산화갈륨/다이아몬드 계면 분리 현상이 발생함을 확인하였다. 이는 비정질과 결정질이 혼재된 산화갈륨 박막이 성장된 후, 냉각 과정에서 열팽창계수의 차이로 인해 계면이 분리된 것으로 판단하였다. 따라서, 본 연구를 통한 산화갈륨/다이아몬드 계면의 물리적 안정성을 통해 산화갈륨의 열물성 보완및 고전력 반도체로의 활용이 기대된다.