• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2000년도 춘계학술대회논문집
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• pp.106-111
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• 2000

The residual stresses in molded plastic parts can be divided into the flow induced residual stresses produced in flowing stages and the thermally induced residual stresses produced in cooling state. Reducing residual stresses in the final parts is one of the goals in recent study. The present study focused on comparing the predicted values for thermal residual stresses in freely and constrained quenched plastic plates with and without free volume theory. As a result the final residual stresses showed the opposite pattern in thickness direction. furthermore by applying free volume theory the predicted residual stress at the center showed about 50% of the values without free volume theory for constrained quenched case.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.28-32
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.

• 한국표면공학회지
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• 제24권4호
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• pp.196-205
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• 1991

Multi-level thin films are very important in ULSI applications because of their high electromigration resistance. This study presents the effects of titanium, titanium nitride and titanium tungsten underlayers of the stability of multi-aluminum thin films during isothermal annealing. High purity Al(99.999%) films have been electron-beam evaporated on Ti, TiN, TiW films formed on SiO2/Si (P-type(100))-wafer substrates by RF-sputtering in Ar gas ambient. The hillock growth was increased with annealing temperatures. Growth of hillocks was observed during isothermal annealing of the thin films by scanning electron microscopy. The hillock growth was believed to appear due to the recrystallization process driven by stress relaxation during isothermal annealing. Thermomigration damage was also presented in thin films by grain boundary grooving processes. It is shown that underlayers of Al/TiN/SiO2, Al/TiW/SiO2 thin films are preferrable to Al/SiO2 thin film metallization.

• 한국정밀공학회지
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• 제14권12호
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• pp.153-159
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• 1997

A thermally-driven polysilicon microactuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS(tetraethylorthosilicate) oxide as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And newly developed HF GPE(gas-phase etching) process was also employed to eliminate the troublesome stiction problem using anhydrous HF gas and CH$_{3}$OH vapor, and successfully fabricated the microactuators. The actuation is incurred by the thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon microactuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10V and 50Hz square wave. The actuating characteris- tics are also compared with the simulalted results considering heat transfer and thermal expansion in the polysilicon layer. This microactuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

• 열처리공학회지
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• 제28권2호
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• pp.68-74
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• 2015

The low cycle fatigue (LCF) and creep-fatigue (hold time tension fatigue, HTTF) tests were performed on the modified 25Cr-13Ni cast stainless steel, which was selected as a candidate material for exhaust manifold in automotive engine. The exhaust manifold is subjected to an environment in which heating and cooling cycle occur due to the running pattern of automotive engine. Several types of fatigue behaviour such as thermal fatigue, thermal mechanical fatigue and creep-fatigue are belong to the main failure mechanisms. High temperature tensile test was firstly carried out to compare the sample with the traditional cast steel for the component. The low cycle fatigue and HTTF tests were carried out under the strain controlled condition with the total strain amplitude from ${\pm}0.6%$ to ${\pm}0.7%$ at $800^{\circ}C$. The hysteresis loops of HTTF tests showed significant stress relaxation during tension hold time. With the increase of tension hold time, the fatigue life was remarkably deceased which caused from the formation of intercrystalline crack by the creep failure mechanism.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.45-52
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• 2009

The research on miniature devices based on non-silicon materials, in particular polymeric materials has been attracting more and more attention in the research field of the micro/nano fabrication in recent years. Lost of applications and many literatures have been reported. However, the study on the micro thermal imprint process of glassy polymer is still not systematic and inadequate. The aim of this research I to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature (Tg). An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model form the test data. As a result, the feasibility of the established viscoelastic model for PC near Tg was confirmed and this material model can be used in FE analysis for the prediction and improvement of the micro thermal imprint process for pattern replication.

• Journal of Welding and Joining
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• 제20권2호
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• pp.109-115
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• 2002

In the case of using high temperature by coating ceramic/metal, large stress was produced due to difference of thermal expansion coefficient between those. And then lead to delamination. In order to relaxation of the stress A1$_2$O$_3$/SS316 composite powders with $10wt.%Al_2O_3$ compositional gradient and $10wt.%Al_2O_3$ agglomerated powder were made by spray drying method. These powders were sintered to improve the strength and to be plasma sprayed in order to fabricate the FGC(functionally graded coating). The influence of gun power, working distance and Ar pressure on the microstructure of the coating layer was studied in order to optimize the plasma spray conditions. It was proven that the optimum conditions were 40kw gun power, 5cm working distance and $100ft^3/h$ Ar flow for both powders. FGC with 10 compositional steps was fabricated and the total thickness was 1.3mm. FGC was heat treated at $1100^{\circ}C$for 10hours to evaluate the heat resisting characteristics.

• 한국전기전자재료학회논문지
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• 제25권7호
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• pp.543-551
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• 2012

In this study, transparent conducting Al-doped Zinc Oxide (AZO) films with a thickness of 150 nm were prepared on corning glass substrate by the RF magnetron sputtering with using a Al-doped zinc oxide (AZO), ($Al_2O_3$: 2 wt%) target at room temperature. This study investigated the effect of rapid thermal annealing temperature and oxygen ambient on structural, electrical and optical properties of Al-doped zinc oxide (AZO) thin films. The films were annealed at temperatures ranging from 400 to $700^{\circ}C$ by using Rapid thermal equipment in oxygen ambient. The effect of RTA treatment on the structural properties were studied by x-ray diffraction and atomic force microscopy. It is observed that the Al-doped zinc oxide (AZO) thin film annealed at $500^{\circ}C$ at 5 minute oxygen ambient gas reveals the strongest XRD emission intensity and narrowest full width at half maximum among the temperature studied. The enhanced UV emission from the film annealed at $500^{\circ}C$ at 5 minute oxygen ambient gas is attributed to the improved crystalline quality of Al-doped zinc oxide (AZO) thin film due to the effective relaxation of residual compressive stress and achieving maximum grain size.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.233-233
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• 2010

CdS thin films were deposited on glass substrates by R.F. magnetron sputtering method and some of the samples were treated by rapid thermal annealing (RTA) process. Effects of thermal annealing on structural and optical properties were investigated at different temperatures ranging from 100 to $600^{\circ}C$. The crystallographic structure of the films and the size of the crystallites in the films were studied by X-ray diffraction. The crystallite sizes were found to increase, and the X-ray diffraction patterns were seen to sharpen by annealing. Optical properties of the films were calculated using the envelope method and the photoluminescence measurements. The optical properties of the films were seen to be dependent on the film thicknesses. The energy gap of the films was found to decrease by annealing. The band edge sharpness of the optical absorption was seen to oscillate by thermal annealing. Annealing over $400^{\circ}C$ was seen to degrade the optical properties of the film. The best annealing temperature for the films was found to be $400^{\circ}C$ from the optical properties. It is observed that the CdS film annealed at $400^{\circ}C$ reveals the strongest UV emission intensity and narrowest full width at half maximum among the temperature ranges studied. The enhanced UV emission from the film annealed at $400^{\circ}C$ is attributed to the improved crystalline quality of CdS thin film due to the effective relaxation of residual compressive stress and achieving maximum grain size. The results show that heat treatments under optimal annealing condition can provide significant improvements in the properties of CdS thin films.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.94.2-94.2
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• 2010

Indium tin oxide (ITO) Thin films were grown on Non-alkarai glass Substrates by PVD method and Subsequently Subjected to ($100^{\circ}C-350^{\circ}C$) Thermal Annealing (TA) In Nitr Oxygen ambinent. Most of all, The effect of TA treatment on the structural properties were studied by using X-Ray diffraction and atomic force microscopy, while optical properties were studied by UV-Transmittance measurements. After TA treatment, the XRD spectra have shown an effective relaxation of the residual compressive stress, As a result, XRD peaks increase of the intensity and narrowing of full width at half-maximun (FWHM). In addtion The microstructure, The surface morphology, the optical transmittance changed and improved, and we investigated The effects of temperature, Time and atmosphere during the TA on the structural and electrical properties of the ITO/glass on TA at $300^{\circ}C$. As a results, the films are highly transparent (80%～89%) in visible region. AFM analysis shows that the films are very smooth with root mean square surface roughness 0.58nm -2.75nm thickness film. It is observed that resistivity of the films drcreases T0 $1.05{\times}10^{-4}{\Omega}cmt$ $6.06{\times}10^{-4}{\Omega}cm$, while mobility increases from $152cm^2/vs$ to $275cm^2/vs$.