• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.19 no.1
• /
• pp.64-75
• /
• 2009

The shipbuilder's requirement for a higher power output rating has led to the development of a super large two stroke low speed diesel engines. Usually a large-sized bore engine ranging from $8{\sim}14$ cylinders, this engine group is capable of delivering power output of more than 100,000 bhp at maximum continuous rating(mcr). Other positive aspects of this engine type include higher thermal efficiency, reliability, durability and mobility. This plays a vital role in meeting the propulsion requirement of vessels, specifically for large container ships, of which speed is a primary concern to become more competitive. Consequently, this also resulted in the modification of engine parameters and new component designs to meet the consequential higher mean effective pressure and higher maximum combustion pressure. Even though the fundamental excitation mechanisms unchanged, torsional vibration stresses in the propulsion shafting are subsequently perceived to be higher. As such, one important viewpoint in the initial engine design is the resulting vibration characteristic expected to prevail on the propulsion shafting system(PSS). This paper investigated the torsional vibration characteristics of these super large engines. For the two node torsional vibration with a nodal point on the crankshaft, a tuning damper is necessary to reduce the torsional stresses on the crankshaft. Hence, the tuning torsional vibration damper design and compatibility to the shafting system was similarly reviewed and analyzed.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2018.06a
• /
• pp.140-140
• /
• 2018

The 3D interconnect technologies have been appeared, as the density of Integrated Circuit (IC) devices increases. Through Silicon Via (TSV) process is an important technology in the 3D interconnect technologies. And the process is used to form a vertically electrical connection through silicon dies. This TSV process has some advantages that short length of interconnection, high interconnection density, low electrical resistance, and low power consumption. Because of these advantages, TSVs could improve the device performance higher. The fabrication process of TSV has several steps such as TSV etching, insulator deposition, seed layer deposition, metallization, planarization, and assembly. Among them, TSV metallization (i.e. TSV filling) was core process in the fabrication process of TSV because TSV metallization determines the performance and reliability of the TSV interconnect. TSVs were commonly filled with metals by using the simple electrochemical deposition method. However, since the aspect ratio of TSVs was become a higher, it was easy to occur voids and copper filling of TSVs became more difficult. Using some additives like an accelerator, suppressor and leveler for the void-free filling of TSVs, deposition rate of bottom could be fast whereas deposition of side walls could be inhibited. The suppressor was adsorbed surface of via easily because of its higher molecular weight than the accelerator. However, for high aspect ratio TSV fillers, the growth of the top of via can be accelerated because the suppressor is replaced by an accelerator. The substitution of the accelerator and the suppressor caused the side wall growth and defect generation. The suppressor was used as Single additive electrodeposition of TSV to overcome the constraints. At the electrochemical deposition of high aspect ratio of TSVs, the suppressor as single additive could effectively suppress the growth of the top surface and the void-free bottom-up filling became possible. Generally, copper was used to fill TSVs since its low resistivity could reduce the RC delay of the interconnection. However, because of the large Coefficients of Thermal Expansion (CTE) mismatch between silicon and copper, stress was induced to the silicon around the TSVs at the annealing process. The Keep Out Zone (KOZ), the stressed area in the silicon, could affect carrier mobility and could cause degradation of the device performance. Cobalt can be used as an alternative material because the CTE of cobalt was lower than that of copper. Therefore, using cobalt could reduce KOZ and improve device performance. In this study, high-aspect ratio TSVs were filled with cobalt using the electrochemical deposition. And the filling performance was enhanced by using the suppressor as single additive. Electrochemical analysis explains the effect of suppressor in the cobalt filling bath and the effect of filling behavior at condition such as current type was investigated.

• Economic and Environmental Geology
• /
• v.34 no.6
• /
• pp.555-571
• /
• 2001

The dynamic evolution of the Chugaryeong fault valley is studied by paleomagnetic works on 163 samples at 16 sites from Late Cretaceous and Quaternary volcanic rocks in the valley. Conglomerate test and stepwised thermal/alternating field demagnetization indicate that all the characteristic directions are of primary origin. Paleomagnetic pole ponsition(216.8$^{\circ}$E/7l .6$^{\circ}$N; dp=7.1$^{\circ}$, dm=10.0$^{\circ}$) for the upper par of the Jijangbong Volcanic Complex Is indistinguishable from the coeval retference pole position from the Gyeongsang Basin, which further substanciates the reliability of the Paleomagnetic data. This indicates the study area has not undergone any tectonic rotation since Late Cretaceous by uy significant reactivation of the Chugaryeong fault valley. The Quaternary pole position (134.2$^{\circ}$E/86.5$^{\circ}$N; $A_{95}$=7.1 $^{\circ}$) from the Jeongog Basalt reflects the present geocentric axial dipole field for the area, supporting the above conclusion. Unlike the upper part, paleomasnelic directions of the lower part of the Jijangbong Volcanic Complex show random distrinution between sites. We interpret that the early stage of the volcanic activity was created by sinistral strike slip motion of the Chugaryeong fault during early Late Cretaceous. The creation and evolution of the Chugaryeong fault valley emphasize the significance of the kinematic FR (folding ruler) model in east Asia.

• Journal of IKEEE
• /
• v.20 no.3
• /
• pp.220-225
• /
• 2016

In this paer, low on-resistance and high-power trench gate MOSFET (Metal-Oxide-Silicon Field Effect Transistor) incorporating current sensing FET (Field Effect Transistor) is proposed and evaluated. The trench gate power MOSFET was fabricated with $0.6{\mu}m$ trench width and $3.0{\mu}m$ cell pitch. Compared with the main switching MOSFET, the on-chip current sensing FET has the same device structure and geometry. In order to improve cell density and device reliability, self-aligned trench etching and hydrogen annealing techniques were performed. Moreover, maintaining low threshold voltage and simultaneously improving gate oxide relialility, the stacked gate oxide structure combining thermal and CVD (chemical vapor deposition) oxides was adopted. The on-resistance and breakdown voltage of the high density trench gate device were evaluated $24m{\Omega}$ and 100 V, respectively. The measured current sensing ratio and it's variation depending on the gate voltage were approximately 70:1 and less than 5.6 %.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.7-15
• /
• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of the Korean Geosynthetics Society
• /
• v.17 no.4
• /
• pp.169-177
• /
• 2018

Glass fiber reinforced polyester (GFRP) composites are widely used as structural materials in harsh environment such as underground pipes, tanks and boat hulls, which requires long-term water resistance. Especially, these materials might be damaged due to delamination between gelcoat and composites through an osmotic process when they are immersed in water. In this study, GFRP laminates were prepared by surface treatment of UPE (unsaturated polyester) gelcoat by vacuum infusion process to improve the durability of composite materials used in underground pipes. The composite surface coated with gelcoat was examined for surface defects, cracking, and hardness change characteristics in water-immersion environments (different temperatures of $60^{\circ}C$, $75^{\circ}C$, and $85^{\circ}C$). The penetration depth of cracks was investigated by micro CT imaging according to water immersion temperature. It was confirmed that cracks developed into the composites material at $75^{\circ}C$ and $85^{\circ}C$ causing loss of durability of the materials. The point at which the initial crack initiated was defined as the failure time and the life expectancy at $23^{\circ}C$ was measured using the Arrhenius equation. The results from this study is expected to be applied to reliability evaluation of various industrial fields where gelcoat is applied such as civil engineering, construction, and marine industry.

• Journal of Climate Change Research
• /
• v.4 no.4
• /
• pp.349-358
• /
• 2013

In this study, the newest technology available to reduce GHG emissions, which can be applicable in energy industries of the future that has large reduction obligations by energy target management and large intensity of GHG emissions, has been investigated by searching the technical characteristics of each technology. The newest technology to reduce GHG emissions in the field of power generation and energy can be mainly classified into the improvement of efficiency, CCS, and gas combined-cycle technology. In order to improve the reliability of the GHG emission factor obtained from the investigation process, it has been compared to the technology-specific GHG emission factor derived from the estimated amount of emissions. Then the GHG abatement measures, using the derived estimation of factor, by using the newest technology to reduce GHG emissions have been predicted. As a result, the GHG reduction rate by technology of CCS development has been expected to be the largest more than 30%, and the abatement rate by technology of coal gasified fuel cell and pressurized fluidized-bed thermal power generation has been showed more than 20%. If the effective introduction of the newest technology and the study of its characteristics is continued, and properly applied for future GHG emissions, it can be prospected that the national GHG reduction targets can be achieved in cost-efficient way.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.20 no.3
• /
• pp.638-644
• /
• 2019

In this study, the fluid flow and heat transfer characteristics within sandwich panels are investigated using computational fluid dynamics. Within the sandwich panels having periodic cellular cores, air can freely move inside the core section so that the structure is able to perform multi-functional roles such as simultaneous load bearing and heat dissipation. Thus, there needs to examine the thermal and flow analysis with respect to design variables and various conditions. In this regard, ANSYS Fluent was utilized to explore the flow and heat transfer within the pyramidal truss sandwich structures by varying the truss angle and inlet velocity. Without the entry effect in the first unitcell, the constant rate of pressure and the constant rate of Nusselt number was observed. As a result, it was demonstrated that Nusselt number increases and friction factor decreases as the inlet velocity increases. Moreover, the rate of Nusselt number and friction factor was appreciable in the range of V=1-5m/s due to the transition from laminar to turbulent flow. Regarding the effect of design variable, the variation of truss angle did not significantly influence the characteristics.

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.7 no.1
• /
• pp.82-91
• /
• 2019

In this study, in order to evaluate Hydration Heat Characteristics of mass concrete using ternary blended cement for large underground structures, the analysis considering the temperature history and the thermal characteristics inside the actual structure was performed. The results of the analysis are compared with the measured values to verify the reliability of the analysis and to evaluate the crack resistance performance. As a result of the measured the actual structure temperature, The adiabatic temperature rise coefficients K and ${\alpha}$ of the slab were $35.1^{\circ}C$ and 0.72, respectively, and the wall was analyzed as $29.3^{\circ}C$ and 0.67. The analytical results and the correlation coefficients(r) were 0.95 and 0.98, respectively. As a result of evaluating the crack resistance of slab and wall, the minimum crack index of slab and wall was 1.22 and 1.20, respectively. These results were found to satisfy the site management standards.

• Journal of Aerospace System Engineering
• /
• v.13 no.2
• /
• pp.34-42
• /
• 2019

The existence of different thermodynamic properties results in various undesirable effects, such as thermal deformation and residual stress, in heat-welding processes. The solid-state junction, by using explosive or electromagnetic forces, i.e., high-velocity impact welding without employing heat is advantageous in joining materials with different thermodynamic properties. In the solid-state junction, the joining is performed within a short time, a high velocity and large deformations are accompanied by interfacial surfaces. The numerical analysis models play an important role in the understanding of the mechanism of high-velocity impact welding. However, in the analysis of high velocity and large deformations, the conventional Lagrangian method has low reliability due to the occurrence of entanglements. In this study, high-velocity impact welding between Cu and CP-Ti with different thermodynamic properties was performed using a un-gridded numerical method, SPH (Smoothed Particle Hydrodynamics), and interfacial morphology occurred. As a result of the analysis, the interfacial morphology was confirmed and the compared degree of shape (straight, vortex), period, length, and so on appeared differently depending on the relationship between the parameters (impact angle and speed).