• Journal of Applied Reliability
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• v.15 no.4
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• pp.241-247
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• 2015

Purpose : The demand for higher fuel economy vehicles has helped develop fuel-efficient vehicles such as a CVVL called continuous variable valve lift. Existing CVVL has been applying DC type motor to control intake valve, but recently some car parts manufacturers have been developing a BLDC type CVVL motor for improvements of endurance performance. The purpose of this study is to find the potential failure mechanism of the CVVL BLDC moto in early stage of development based on the design properties and design the accelerated life test model. Methods : CVVL BLDC is consist of brushs, coil, magnetic, PCB, bearing and so on. Each component has a latent failure mechanism caused by temperature, humidity, vibration. By analysis result of the failure mechanism, thermal fatigue is the most important factor of a durability of CVVL BLDC motor. So, we designed a new accelerated life test model for guarantee of the CVVL BLDC motor. Results : A crack occurred on via hole in test using the conditions we designed, so we did change the design to avoid this failure. The via hole dimension is changed a little larger, as a result we achieve improvements in reliability of the CVVL BLDC motor. By applying various kinds and extreme level of stresses, we can find the operating limits of products. Conclusion : In thesis, We analyzed the failure mechanism of CVVL BLDC and designed an accelerated life test method to give a guarantee for reliability. Based on the test results, we could improve the reliability of developments by change of design.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.9
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• pp.261-268
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• 2018

The use of electric cable was limited due to the installation time and large space as the increase of power demand and load quantity in side line. In order to solve these problems, the application of busway system which can supply the large current was increasing. But it was lack of methods of performance tests to evaluate the reliability and results of test for busway system. In this paper, we presented items to evaluate the reliability test for epoxy coated busway system with reference to IEC 61349-6. In addition, we proposed items to evaluate the reliability and long term life cycle test for the epoxy coated busway system. The combined acceleration deterioration test that reflects actual conditions of the survey as much as possible was conducted considering both thermal and electrical stresses. The deterioration condition was selected to satisfy fifty years life expectation and the insulation performance verification test of the busway system confirmed the long term life prediction. Furthermore, as test items for reliability assessment of compliance with the environment for the use of temperature, humidity and load current where busway system was installed, thermal overload test, water immersion test, cold shock temperature test and thermal cycle test were performed. And we examined changes in characteristics and abnormality after tests. From results, the test items presented to evaluate performance and reliability of the epoxy insulated busway system were confirmed to be appropriate in this paper, and the performance of the product was also confirmed to be excellent for reliability tests.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.3
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• pp.130-138
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• 2010

The thermal reliability of the closed-type BLDC motor for the high speed axial fans is analyzed by a numerical method in this paper. Since the module and the motor part are combined in a closed case, the heat generated from a rotor in the motor and the electronic components in the PCB module can not be effectively removed to the outside. Therefore the module will easily fail by high temperature. The accelerated-life testing was accomplished to formulate the life equation and numerical method is used to predict the inside temperature of the PCB module, which is one of the life equation parameter according to the environment. When the environment temperature of BLDC motor is 21, 35 and 50 $^{\circ}C$, the temperature in the PCB space is predicted as 73.4, 87.5 and 102.4 $^{\circ}C$. Then the life time with the temperature are calculated as 2,239, 863 and 328 hours.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.494-499
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• 2007

The thermal reliability of the closed-type BLDC motor for the high speed axial fans is analyzed by a numerical method in this dissertation. Since the module and the motor part are combined in a closed case, the heat generated from a rotor in the motor and the electronic components in the PCB module can not be effectively removed to the outside. Therefore the module will easily fail by high temperature. The accelerated-life testing was accomplished to formulate the life equation and numerical method is used to predict the inside temperature of the PCB module, which is one of the life equation parameter according to the environment. The experiment for measuring the surface heat flux of the electronic components is carried out to apply the boundary condition of numerical study. When the environment temperature of BLDC motor is 21, 35 and $50^{\circ}C$, the temperature in the PCB space is predicted as 73.4, 87.5 and $102.4^{\circ}C$. Then the life time with the temperature are calculated as 2,239, 863 and 328.

• Transactions of the Korean hydrogen and new energy society
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• v.26 no.5
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• pp.431-437
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• 2015

Recently, a miniaturized measurement cell of effective thermal conductivity was developed to evaulate the heat transfer characteristics of hydrogen stroage material in the initial step of its development. In this work, the realiablity issues which can occur from this miniaturization of measurement cell were studied in detail by both experiments and numerical simulation of heat transfer. $LaNi_5$ as a reference was used for the reliability evaluation of the miniaturized measurement cell. Numerical simulations of heat transfer for this measurement system were verified through comparison with the experimental data. Under these reliablity studies, we discuss how to overcome the inherent drawbacks of this miniaturized system in order to achieve the high reliability.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.12
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• pp.1169-1176
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• 2005

In this paper, thermal reliability of a closed type BLDC (Brushless DC) motor for high speed axial fan was analyzed by the accelerated life test. The closed type BLDC (Model No. MB1-8855-J01) motor was controlled by PCB module, which was composed of various electrical components. The failure of the closed type BLDC motor happened in PCB module due to high temperature. Failure mechanism of the closed type BLDC motor appears to be electrolyte dry out of capacitor. The accelerate life test was performed in temperature stress of $85^{\circ}C\;and\;105^{\circ}C$, respectively The failure data from the accelerated life test were analyzed and the life in each stress level was estimated with 960h and 261 h. At last, both life expression according to operating temperature of PCB module and life of the closed type BLBC motor in normal condition $(50^{\circ}C)$ were suggested.

• Journal of Power System Engineering
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• v.20 no.6
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• pp.20-26
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• 2016

For power electronic devices, the thermal energy density per unit volume has seen a rapid increase in recent years, owing to the miniaturization and dense integration of electronic components, as well as the continuous development in performance and function. This research examined the validity and reliability of a thermal safety model for managing the heating conditions of TRIAC electronic components. Among the electronic components of a PCB, these can be considered as a heat source. Using the model, the heating conditions of TRIAC components were maintained at their design target levels in the process of developing an LMT motor drive board. In addition, the heating characteristics of the entire PCB were analyzed to verify its thermal safety. Finally, the reliability and validity of the thermal safety model for maintaining the heating conditions of the TRIAC electronic elements at adequate levels was verified using a numerical analysis method.

• Journal of Information Processing Systems
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• v.15 no.2
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• pp.331-343
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• 2019

Dynamic thermal rating of the overhead transmission lines is affected by many uncertain factors. The ambient temperature, wind speed and wind direction are the main sources of uncertainty. Measurement uncertainty is an important parameter to evaluate the reliability of measurement results. This paper presents the uncertainty analysis based on Monte Carlo. On the basis of establishing the mathematical model and setting the probability density function of the input parameter value, the probability density function of the output value is determined by probability distribution random sampling. Through the calculation and analysis of the transient thermal balance equation and the steady- state thermal balance equation, the steady-state current carrying capacity, the transient current carrying capacity, the standard uncertainty and the probability distribution of the minimum and maximum values of the conductor under 95% confidence interval are obtained. The simulation results indicate that Monte Carlo method can decrease the computational complexity, speed up the calculation, and increase the validity and reliability of the uncertainty evaluation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.1
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• pp.23-28
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• 2023

This paper demonstrates a novel NAND flash memory structure and annealing configuration including through-silicon via (TSV) inside the silicon substrate to improve annealing efficiency using an electro-thermal annealing (ETA) technique. Compared with the conventional ETA which utilizes WL-to-WL current flow, the proposed annealing method has a higher annealing temperature as well as more uniform heat distribution, because of thermal isolation on the silicon substrate. In addition, it was found that the annealing temperature is related to the electrical and thermal conductivity of the TSV materials. As a result, it is possible to improve the reliability of NAND flash memory. All the results are discussed based on 3-dimensional (3-D) simulations with the aid of the COMSOL simulator.