• 한국분말재료학회지
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• 제22권6호
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• pp.413-419
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• 2015

Lanthanum zirconate, $La_2Zr_2O_7$, is one of the most promising candidates for next-generation thermal barrier coating (TBC) applications in high efficient gas turbines due to its low thermal conductivity and chemical stability at high temperature. In this study, bulk specimens and thermal barrier coatings are fabricated via a variety of sintering processes as well as suspension plasma spray in lanthanum zirconates with reduced rare-earth contents. The phase formation, microstructure, and thermo-physical properties of these oxide ceramics and coatings are examined. In particular, lanthanum zirconates with reduced rare-earth contents in a $La_2Zr_2O_7-4YSZ$ composite system exhibit a single phase of fluorite or pyrochlore after fabricated by suspension plasma spray or spark plasma sintering. The potential of lanthanum zirconate ceramics for TBC applications is also discussed.

• 한국응용과학기술학회지
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• 제31권1호
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• pp.83-91
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• 2014

본 연구에서는 졸-겔, 용매치환, 표면개질, 상압건조 공정과 계면활성제에 의한 템플레이팅(templating) 공법 및 소결 공정을 이용하여 실리카 에어로겔 모노리스와 메조포러스 실리카 모노리스를 각각 합성하였다. 제조된 두 종류의 실리카 모노리스는 균열이 없이 비교적 투명하였으며, 매우 높은 기공율(92-94%) 및 비표면적($800-840m^2/g$)과 수 십 nm 수준의 기공 크기를 갖는 것으로 확인되었다. 표면개질을 적용한 실리카 에어로겔 샘플이 스피링백 효과로 인하여 메조포러스 실리카 모노리스에 비해 더욱 미세하고 균질한 나노 기공 구조를 보였을 뿐만 아니라, 그 단열 성능도 더욱 우수한 것으로 나타났다. 본 연구를 통해 합성된 두 종류의 실리카 모노리스를 중간층으로 적용한 복층 창유리의 단열 성능을 측정된 모노리스의 열전도도와 이론식을 근거로 조사한 결과, 기존의 상업적으로 응용되는 공기층 삽입 복층 창유리에 비해 우수한 단열 성능을 보이는 것으로 나타났다.

• Computers and Concrete
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• 제15권1호
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• pp.103-126
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• 2015

Thermal effects are significant loads for assessing concrete dam behaviour during operation. A new methodology to estimate thermal loads on concrete dams taking into account processes which were previously unconsidered, such as: the evaporative cooling, the night radiating cooling or the shades, has been recently reported. The application of this novel approach in combination with a three-dimensional finite element method to solve the heat diffusion equation led to a precise characterization of the thermal field inside the dam. However, that approach may be computationally expensive. This paper proposes the use of a new one-dimensional model based on an explicit finite difference scheme which is improved by means of the reported methodology for computing the heat fluxes through the dam faces. The improved model has been applied to a case study where observations from 21 concrete thermometers and data of climatic variables were available. The results are compared with those from: (a) the original one-dimensional finite difference model, (b) the Stucky-Derron classical one-dimensional analytical solution, and (c) a three-dimensional finite element method. The results of the improved model match well with the observed temperatures, in addition they are similar to those obtained with (c) except in the vicinity of the abutments, although this later is a considerably more complex methodology. The improved model have a better performance than the models (a) and (b), whose results present larger error and bias when compared with the recorded data.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• 대한기계학회논문집B
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• 제38권11호
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• pp.907-914
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• 2014

본 연구는 센서식 및 프로그램식의 태양추적장치를 이용하여 집광형 태양전지의 발전효율을 증가시키는 연구를 진행하였다. 또한 집광형 태양전지에서 발생된 열은 히트파이프를 포함한 흡열기로 회수함으로써 온수나 난방에 사용할 수 있었다. 실험 결과 집광형 태양전지의 평균 전기효율은 16%, 히트파이프를 포함한 흡열기의 열효율은 62% 로 복합효율이 78%를 나타내었다. 태양위치에 따른 실시간 추적, 일몰 이후 난방장치의 동쪽방향 원상복귀, 원상복귀후 자동종료는 Simulink 프로그램으로 구현하였다. 히트파이프 유무, 집광비, 흡열기 입구 속도에 따른 집광형 태양전지 및 흡열기 온도를 해석하였으며 실험결과와 일치하였다.

• 한국재료학회지
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• 제29권9호
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• pp.567-577
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• 2019

Aluminum nitride (AlN) has versatile and intriguing properties, such as wide direct bandgap, high thermal conductivity, good thermal and chemical stability, and various functionalities. Due to these properties, AlN thin films have been applied in various fields. However, AlN thin films are usually deposited by high temperature processes like chemical vapor deposition. To further enlarge the application of AlN films, atomic layer deposition (ALD) has been studied as a method of AlN thin film deposition at low temperature. In this mini review paper, we summarize the results of recent studies on AlN film grown by thermal and plasma enhanced ALD in terms of processing temperature, precursor type, reactant gas, and plasma source. Thermal ALD can grow AlN thin films at a wafer temperature of $150{\sim}550^{\circ}C$ with alkyl/amine or chloride precursors. Due to the low reactivity with $NH_3$ reactant gas, relatively high growth temperature and narrow window are reported. On the other hand, PEALD has an advantage of low temperature process, while crystallinity and defect level in the film are dependent on the plasma source. Lastly, we also introduce examples of application of ALD-grown AlN films in electronics.

• 대한화학회지
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• 제41권7호
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• pp.329-336
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• 1997

광음향 분광법을 이용하여 GaAs와 Si 반도체에서 운반자 운송특성을 연구하고 열확산도를 측정하였다. 변조주파수에 따른 반도체에 광음향신호와 위상으로부터 반도체에서의 운반자 특성이 낮은 주파수영역에서는 주로 순간적인 열원에 의하며, 높은 주파수영역에서는 비방사 벌크재결합과 비방사 표면재결합에 의한 효과임을 관찰하였다. GaAs와 같은 직접전이 밴드갭을 갖는 반도체의 경우 위의 세가지 광음향효과를 모두 나타내는 반면, Si과 같은 간접전이 밴드갭을 갖는 반도체의 경우 순간적인 열원에 의한 효과와 비방사 벌크재결합에 의한 효과만을 볼 수 있었다. 이러한 효과로 변조주파수에 따른 광음향신호의 위상에서 GaAs 반도체는 극소값을 보이는 반면 Si 반도체에서는 단조감소하는 것을 관찰할 수 있다. 아울러 광음향신호로부터 반도체 시료의 열확산도 ${\alpha}_s$는 GaAs의 경우 0.35 $\textrm{cm}^2/s$ 이고 Si의 경우 1.24 $\textrm{cm}^2/s$ 를 얻었다. 또한 광음향신호의 위상을 curve fitting하여 열확산도를 측정한 결과 광음향신호로부터 구한 값과 유사한 열확산도를 구할 수 있었다.

• Ocean and Polar Research
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• 제31권4호
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• pp.339-347
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• 2009

It is possible to obtain accurate temperature and salinity profiles of the oceans using a SBE 911plus CTD and accompanying data conversion packages. To obtain highly accurate results, CTD data needs to be carefully processed in addition to proper and regular maintenance of the CTD itself. Since the manufacturer of the CTD provides tools that are necessary for post processing, it is possible to conduct proper processing without too much effort. Some users, however, are not familiar with all of the processes and inadvertently ignore some of these processes at the expense of data quality. To draw attention to these and other similar issues, we show how it is possible to improve data quality by utilizing a few extra processes to the standard or default data process procedures with CTD data obtained from the equatorial Eastern Pacific between 2001 and 2005, and 2007. One easy step that is often ignored in the standard data process procedure is "wild edit", which removes abnormal values from the raw data. If those abnormal values are not removed, the abnormality could spread vertically during subsequent processes and produce abnormal salinity in a range much wider than that of the raw data. To remove spikes in salinity profiles the "align CTD" procedure must be carried out not with the default values included in the data processing software but with a proper time constant. Only when "cell thermal mass" correction is conducted with optimal parameters, we can reduce the difference between upcast and downcast, and obtain results that can satisfy the nominal accuracy of the CTD.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.69-69
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• 2017

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. There effluents are mainly treated by conventional technologies such are aerobic, anaerobic treatment and chemical coagulation. But, there processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These techniques include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that show higher purification results and low toxic sludge. There are many kinds of electrode materials for electrochemical process, among them, boron doped diamond (BDD) attracts attention due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD, among them, researches are focused BDD on Si substrate. But, Si substrate is hard to apply electrode application due to the brittleness and low life time. And other substrates are also not suitable for wastewater treatment electrode due to high cost. To solve these problems, Ti has been candidate as substrate in consideration of cost and properties. But there are critical issues about adhesion that must be overcome to apply Ti as substrate. In this study, to overcome this problem, TiN interlayer is introduced between BDD and Ti substrate. TiN has higher electrical and thermal conductivity, melting point, and similar crystalline structure with diamond. The TiN interlayer was deposited by reactive DC magnetron sputtering (DCMS) with thickness of 50 nm, $1{\mu}m$. The microstructure of BDD films with TiN interlayer were estimated by FE-SEM and XRD. There are no significant differences in surface grain size despite of various interlayer. In wastewater treatment results, the BDD electrode with TiN (50nm) showed the highest electrolysis speed at livestock wastewater treatment experiments. It is thought to be that TiN with thickness of 50 nm successfully suppressed formation of TiC that harmful to adhesion. And TiN with thickness of $1{\mu}m$ cannot suppress TiC formation.

• 패션비즈니스
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• 제16권6호
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• pp.21-35
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• 2012

In consideration of the injuries and deaths occurring at manufacturing sites due to the use of inappropriate work clothes or safety devices, this study aims to categorize manufacturing work processes to develop functional work clothes for heavy industries including the automobile, machine and shipbuilding industries in South Korea. Defining the features of the work environments and work postures of these industries provided for a categorization of the work processes which would enable the development of suitable work clothes for each work process' category. The results of the study based on a questionnaire survey are as follows: Work process category 1, including steel panel pressing and auto body assembly, final inspection (in automobile) and inspection (in machine), requires work clothes with upper body and arm mobility and performance to protect from the toxic fume factor. Work process category 2, consisting of welding (in automobile), cutting-and-forming (in machine) and attachment-and-construction (in shipbuilding), requires clothing elasticity, durability and heat and fire resistance. Work process category 3 comprising welding and grinding in the machine and shipbuilding industries, requires work clothes' tear resistance and elasticity, particularly for lateral bending mobility, and work clothes' sleeves' and pants' hemlines with sealed designs to defend against iron filing penetration, as well as incombustible and heat-resistant material performance. Finally, work process category 4, including painting in machine and shipbuilding, requires work clothes with waterproofing, air permeability, thermal performance, elasticity, durability and abrasion resistance.