• Journal of Biosystems Engineering
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• v.22 no.1
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• pp.59-67
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• 1997

An experimental apparatus was developed for the rapid determination of thermal conductivity by transient probe method. The theoretical basis for transient probe method has been investigated. The mathematical model for this method is the Carslaw and Jaeger model which is used perfect line source theory. The small needle probe which is equipped with thermocouple and heating element is constructed. A software that performs data analysis and acquisition is programmed. The influence of the power dissipated per unit length of the probe has been assessed for glycerin. The result showed no significant correlation between thermal conductivity and power input. Determination made with this experimental apparatus were found to agree well with the recommended thermal conductivity data.

• Progress in Superconductivity and Cryogenics
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• v.13 no.2
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• pp.29-32
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• 2011

The thermal properties of insulation material are essential to develop a high-temperature superconducting (HTS) power cable to be operated at around liquid nitrogen temperature. Unlike metallic materials, nonmetallic materials have a high thermal resistance; therefore special attention needs to be paid to estimate heat flow correctly. Thus, we have developed a precise instrument for measuring the thermal conductivity of insulating materials over a temperature range from 40 K to near room temperature using a cryocooler. Firstly, the measurement of thermal conductivity for Teflon is carried out for accuracy confirmation. For a supplied heat flux, the temperature difference between warm and cold side is measured in steady state, from which the thermal conductivity of Teflon is calculated and compared with published result of NIST. In addition, the apparent thermal conductivity of Polypropylene laminated paper (PPLP) is presented and its temperature dependency is discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.172-173
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• 2007

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The thermal analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained experimental and simulation results by using finite element simulator, Ansys and by using photographic infrared thermometer, we compared experimental date with simulation result. and got good agreement. Also this paper provided thermal distribution of IGBT connected to heat sinks. and this results will be good information to design optimal heat sink for IGBT.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.43-49
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• 2006

Nowadays, the thermal environments of classrooms are usually adjusted by the ceiling type air-conditioning system with a temperature sensor installed on inlet of an air-conditioner. However, it is not clear that the conventional temperature sensor position is proper to satisfy both thermal comport and energy saving in summer especially. Therefore, this study is aimed at finding out the best position of the temperature sensor on the purpose of the comfort thermal environment and energy saving. The different 5 positions for the temperature sensor are supposed in this paper to analyze thermal environment by CFD. From the analysis through the CFD simulations, the best position of the temperature sensor satisfying for both comfort thermal environment and energy saving is obtained.

• Journal of Mechanical Science and Technology
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• v.19 no.12
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• pp.2245-2252
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• 2005

Thermal stratification in the branch piping of power plants can be generated by turbulent penetration or by valve leakage. In this study, a numerical analysis was performed to estimate the thermal stratification phenomenon by in-leakage in the SIS branch piping of nuclear power plant. Leakage rate, leakage area and leakage location were selected as evaluation factors to investigate the thermal stratification effect. As a result of the thermal stratification effect according to leakage rate, the maximum temperature difference between top and bottom of the horizontal piping was evaluated to be about 185K when the valve leakage rate was about 10 times as much as the allowed leakage rate. For leakage rate more than 10 times the allowed leakage rate, the temperature difference was rapidly decreased due to the increased mixing effect. In the result according to leakage area, the magnitude of temperature difference was shown in order of $3\%,\;1\%\;and\;5\%$ leakage area of the total disk area. In the thermal stratification effect, according to the leakage location, temperature difference when leakage occurred in the lower disk was considerably higher than that of when leakage occurred in the upper disk.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Journal of Mechanical Science and Technology
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• v.17 no.9
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• pp.1380-1387
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• 2003

When a cold HPSI (High pressure Safety Injection) fluid associated with an overcooling transient, such as SGTR (Steam Generator Tube Rupture), MSLB (Main Steam Line Break) etc., enters the cold legs of a stagnated primary coolant loop, thermal stratification phenomena will arise due to incomplete mixing. If the stratified flow enters the downcomer of the reactor pressure vessel, severe thermal stresses are created in a radiation embrittled vessel wall by local overcooling. As general thermal-hydraulic system analysis codes cannot properly predict the thermal stratification phenomena, RG 1.154 requires that a detailed thermal-mixing analysis of PTS (pressurized Thermal Shock) evaluation be performed. Also. previous PTS studies have assumed that the thermal stratification phenomena generated in the stagnated loop side of a partially stagnated primary coolant loop are neutralized in the vessel downcomer by the strong flow from the unstagnated loop. On the basis of these reasons, this paper focuses on the development of a 3-dimensional thermal-mixing analysis model using PHOENICS code which can be applied to both partial and total loop stagnated cases. In addition, this paper verifies the fact that, for partial loop stagnated cases, the cold plume generated in the vessel downcomer due to the thermal stratification phenomena of the stagnated loop is almost neutralized by the strong flow of the unstagnated loop but is not fully eliminated.

• Proceedings of the KSRS Conference
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• 2002.10a
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• pp.229-234
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• 2002

Under the hostile influence of the extreme space environmental conditions due to the deep space and direct solar flux, the thermal control in space applications is especially of major importance. There are tight temperature range restrictions for electro-optical elements while on the other hand there are low power consumption requirements due to the limited energy sources on the spacecraft. So, we usually have strong requirement of thermal and power control module in space applications. In this paper, the design concept of a thermal and power control module in the MSC(Multi-Spectral Camera) system which will be a payload on KOMPSATII is described in terms of H/W & S/W. This thermal and power control module, called THTM(Thermal and Telemetry Module) in MSC, resides inside the PMU(Payload Management Unit) which is responsible for the proper management of the MSC payload for controlling and monitoring the temperature insides the EOS(Electro-Optic System) and gathering all the analog telemetry from all the MSC sub-units, etc. Particularly, the designed heater controller has the special mode of "duty cycle" in addition to normal closed loop control mode as usual. THTM controls heaters in open loop according to on/off set time designed through analysis in duty cycle mode in case of all thermistor failure whereas it controls heaters by comparing the thermistor value to temperature based on closed loop in normal mode. And a designed THTM provides a checking and protection method against the failure in thermal control command using the test pulse in command itself.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.625-627
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• 2002

High precision voltages. currents. power factor and electrical power measurements wide range of frequency can be achieved by using the thermo-elements (thermal converters). This paper describes the development wattmeter. based on a thermal principle. The instrument has been performed measurement in the range of currents from 0 to 50 A, voltages up to 600 V, power factor 0.5. 1 and frequencies from 45 Hz to 3 kHz. The thermal converters with two heater are used in the functional element of the wattmeter.

• Journal of Environmental Impact Assessment
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• v.6 no.2
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• pp.81-92
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• 1997

This paper presents the results from the comparison analysis and evaluation between the air pollutant dispersion modeling results and the observation data in the area within a 10 km radius from the Boryong thermal power plants. The observation data used in this study were the air pollutant concentrations which had been continuously measured from 8 locations around the Boryong power plants by TMS(tele-monitoring system) for 3 months from September to November, 1996. The short-term and long-term predictions were carried out using ISC3 model and LPDM(Lagrangian Panicle Dispersion Model). The results of ISC3 modeling in a short-term showed highly as 0.7 in a correlation coefficient, but in a long-term showed just 0.54. On the other hand, LPDM showed 0.78 in a correlation coefficient for a long-term, but in a short-term showed highly value than the observation concentrations.