Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2007.06a
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- Pages.172-173
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- 2007
Thermal Characteristics and Heatsink Modeling. for IGBT
IGBT의 열 특성 및 히트싱크 모델링
- Ryu, Se-Hwan (Konkuk Univ.) ;
- Bea, Kyung-Kuk (Konkuk Univ.) ;
- Shin, Ho-Chul (Konkuk Univ.) ;
- Ahn, Hyung-Keun (Konkuk Univ.) ;
- Han, Deuk-Young (Konkuk Univ.)
- Published : 2007.06.21
Abstract
As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The thermal analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained experimental and simulation results by using finite element simulator, Ansys and by using photographic infrared thermometer, we compared experimental date with simulation result. and got good agreement. Also this paper provided thermal distribution of IGBT connected to heat sinks. and this results will be good information to design optimal heat sink for IGBT.