• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.239-244
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• 2011

Nano Imprint Lithography(NIL) is technique for copying a pattern from stamp with nano size pattern in order to replicated the materials. It is very important to demold in order to make NIL process effectively. Self Assembled Monolayers(SAM) coater is manufactured by means of decreasing surface energy with the stamp surface treatment to improve release characteristics. Manufactured device contains tilting and rotation option for increasing process life time by coating on the sidewall of the pattern in stamp. The stamp coated with optimized tilting angle $30^{\circ}$ and rotation speed of 10rpm has more imprinting cycles than the stamping coated without tilting and rotation. Effective SAM coating on the sidewall of the pattern in stamp will improve by 50% of process life time.

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.781-785
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• 2001

The thermal behavior of Flow Pattern Defect (FPD) and Large Pit (LP) in Czochralski Silicon crystal was investigated by applying high temperature annealing ($\geq$$1100^{\circ}C$) and non-agitated Secco etching. For evaluation of the effect of LP upon device performance/yield, commercial DRAM and ASIC devices were fabricated. The results indicated that high temperature annealing generates LPs whereas it decreases FPD density drastically. However, the origins of FPD and LP seemed to be quite different by not showing any correspondence to their density and the location of LP generation and FPD extinction. By not showing any difference between the performance/yield of devices whose design rule is larger than 0.35 $\mu\textrm{m}$, LP seemed not to have detrimental effects on the performance/yield.

• Macromolecular Research
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• v.15 no.5
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• pp.482-485
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• 2007

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Journal of Applied Reliability
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• v.5 no.4
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• pp.439-450
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• 2005

Thermal deformation of Digital Television effect friction noise directly. However there was no methods to find and to solve the thermal friction noise which is huge problem in Digital Television In this study, to figure out occurrence cause of friction noise of the product, we measured thermal deformation of the product to organize a triggering device united with Laser Doppler Vibrometer(LDV) which turned occurrence moment of thermal friction noise into a possibility to measure. In conclusion, we could offer an effective information of design, and ensured ESPI(Electronic Speckle Pattern Interferometry) measure technique which is more detailed than the past way.

• Journal of Adhesion and Interface
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• v.15 no.1
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• pp.14-21
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• 2014

In the present work, PLA/PBS blends with poly(lactic acid) (PLA) and poly(butylene succinate) (PBS) at different contents were processed by using a twin-screw extruder and an injection molding machine, and then their mechanical, thermal and morphological properties were investigated. The mechanical properties such as flexural strength, flexural modulus, tensile strength and tensile modulus and thermal properties such as melting behavior, dynamic mechanical thermal properties and thermal stability significantly depended on the contents of PLA and PBS. However, the heat deflection temperature of the blends was not significantly influenced by the contents of PLA and PBS. Also, the fracture surfaces of PLA/PBS blends were changed from a brittle pattern to a ductile pattern with increasing the PBS contents.

• Journal of Korea Foundry Society
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• v.40 no.1
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• pp.1-6
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• 2020

Many studies involving a thermal stress analysis using computational methods have been conducted, though there have been relatively few experimental attempts to investigate thermal stress phenomena. Casting products undergo thermal stress variations during the casting process as the temperature drops from the melting temperature to room temperature, with gradient cooling also occurring from the surface to the core. It is difficult to examine thermal stress states continuously during the casting process. Therefore, only the final states of thermal stress and deformations can be detemined. In this study, specimens sensitive to thermal stress, were made by a casting process. After which the residual stress levels in the specimens were measured by a hole drilling method with Electron Speckle-Interferometry technique. Subsequently, we examined the thermal stresses in terms of deformation during the casting process by means of a numerical analysis. Finally, we compared the experimental and numerical analysis results. It was found that the numerical thermal stress analysis is an effective means of understanding the stress generation mechanism in casting products during the casting process.

• Steel and Composite Structures
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• v.46 no.5
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• pp.649-658
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• 2023

Although some scholars have studied the thermal post-buckling of graphene platelets strengthened metal foams (GPLRMFs) plates, they have not considered the influence of initial geometrical imperfection. Inspired by this fact, the present paper studies the thermal post-buckling characteristics of GPLRMFs plates with initial geometrical imperfection. Three kinds of graphene platelets (GPLs) distribution patterns including three patterns have been considered. The governing equations are derived according to the first-order plate theory and solved with the help of the Galerkin method. According to the comparison with published paper, the accuracy and correctness of the present research are verified. In the end, the effects of material properties and initial geometrical imperfection on the thermal post-buckling response of the GPLRMFs plates are examined. It can be found that the presence of initial geometrical imperfection reduces the thermal post-buckling strength. In addition, the present study indicates that GPL-A pattern is best way to improve thermal post-buckling strength for GPLRMFs plates, and the presence of foams can improve the thermal post-buckling strength of GPLRMFs plates, the Foam- II and Foam- I patterns have the lowest and highest thermal post-buckling strength. Our research can provide guidance for the thermal stability analysis of GPLRMFs plates.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Journal of Technologic Dentistry
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• v.30 no.2
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• pp.17-22
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• 2008

The purpose of this study was to observe the thermal expansion of the inlay waxes at temperature. Inlay pattern wax shows not only a high coefficient of expansion but also a tendency to warp or distort when allowed to stand unrestrained. The thermal expansion of inlay waxes was tested according to the treatment conditions for 10 minutes at $40^{\circ}C$ The thermal expansion of inlay waxes at various temperatures was measured with an electro dial gauge. The results were as fellows: 1. It is shown that the rate of thermal expansion of wax A is 0.2%, wax B is 0.29%, wax C is 0.38%, and wax D is 0.22% at $40^{\circ}C$ 2. It is shown that the coefficient of thermal expansion of wax A is $106{\times}10^{-6}/^{\circ}C$, wax B is $152{\times}10^{-6}/^{\circ}C$, wax C is $199{\times}10^{-6}/^{\circ}C$, and wax D is $116{\times}10^{-6}/^{\circ}C$ at $40^{\circ}C$ 3. The thermal expansion of the inlay waxes at $40^{\circ}C$ was shown to increase in the order of wax C, B, D, A.