• Progress in Superconductivity and Cryogenics
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• 제14권4호
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• pp.24-27
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• 2012

The measurement of the coefficient of thermal expansion (CTE) of polypropylene laminated paper (PPLP) as electric insulating material is important for its practical superconducting device application. The thermal strain induced to HTS tapes and its insulating material during cooling from room temperature might largely affect the critical current ($I_c$) of HTS tapes. In this study, the thermal contraction of PPLP material was measured during cooling from 300 K to 77 K using double extensometers. Initially, the CTE of a brass tape was measured and it was compared with a reference data. It was found that the measured thermal expansion data of the brass material approaches that of the reference one. Based on the results, it was then confirmed that the measurement technique could be applied to thin and flexible samples. Therefore, the same measurement procedure was applied to PPLP material using double extensometers. As a result, the linear CTE of the PPLP at 77 K has been measured to be ${\sim}15.3{\times}10^{-6}/K$. Also, it was found that the thermal contraction characteristics of PPLP was dominated by polypropylene on the cross direction (higher thermal contraction) while it was dominated by Kraft paper on the machine direction (lower thermal contraction). Overall, this measurement procedure could be adopted for the determination of CTE of flexible materials such as PPLP.

• Journal of Electrical Engineering and Technology
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• 제12권2호
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• pp.840-845
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• 2017

In this paper, in order to investigate the lifetime of oil-paper insulation, specimens were artificially aged with thermal and electrical multiple stresses. Accelerated ageing factors and equivalent operating years for each aging temperatures were derived from results of tensile strengths for the aged paper specimens. Also, the evaluation for the multi-stress aged specimens were carried out through the measurement of impulse breakdown voltage at high temperature of $85^{\circ}C$. The lifetimes of the oil-paper insulations were calculated with the value of 66.7 for 1.0 mm thickness specimens and 69.7 for 1.25 mm thickness specimens throughout the analysis of impulse BD voltages using equivalent operating years, which means that dielectric strengths would not be severely decreased until the mechanical lifetime limit. Therefore, for the lifetime evaluation of the oil-paper insulation, thermal aging would be considered as a dominant factor whereas electrical degradation would be less effective.

• Transactions of the Korean Society of Machine Tool Engineers
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• 제11권4호
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• pp.12-18
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• 2002

Silicon on insulator(SOI) wafer is used in a variety of microsensor applications in which thermal deformations and other mechanical effects may dominate device Performance. One of major Problems associated with the manufacturing Processes of the microaccelerometer based on the tunneling current concept is thermal deformations and thermal stresses. This paper deals with finite element analysis(FEA) of residual thermal deformations causing popping up, which are induced in micrormaching processes of a microaccelerometer. The reason for this Popping up phenomenon in manufacturing processes of microaccelerometer may be the bending of the whole wafer or it may come from the way the underetching occurs. We want to seek after the real cause of this popping up phenomenon and diminish this by changing manufacturing processes of mic개accelerometer. In microaccelerometer manufacturing process, this paper intend to find thermal deformation change of the temperature distribution by tunnel gap and additional beams. The thermal behaviors analysis intend to use ANSYS V5.5.3.

• Proceedings of the Materials Research Society of Korea Conference
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• 제28권1호
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• pp.9-15
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• 2014

This paper focuses on the heat gain of a lighting system, one of the most-used appliances in buildings, and its thermal effect within a low energy building. In this study, a dynamic thermal model of a lighting system is first established based on the first principle of thermodynamics. Then, thermal parameters of this model are estimated by experiments and an optimization process. Afterward, the obtained model of the system is validated by comparing simulation results to experimental one. Finally it is integrated into a low energy building model in order to quantify its thermal influence within a low energy building. As a result, heat flux of the lighting system, indoor temperature and heating energy demands of the building are obtained and compared with the results obtained by the conventional model of a lighting system. This paper helps to understand thermal dynamics of a lighting system and to further apply lighting systems for energy management of low energy buildings.

• Journal of Applied Reliability
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• 제13권3호
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• pp.207-216
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• 2013

This paper, we classified LED failure mechanisms that occur due to the delamination and analyzed each of the mechanism that gives the LED PKGs the effect. Usually, the LED is composed of several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost and moisture be absorbed easily, a thermal resistance be increased attendantly. In this paper, we experimented to investigate failure mechanism of the thermal resistance and failure mechanism of the decrease of luminance that occur due to the delamination. A thermal shock test was performed to reproduce this phenomena by subjecting samples to a cold-hot cyclling process between $-30^{\circ}C$(15min) and $110^{\circ}C$(15min). The samples were inspected at 200, 600 and 1,000 cycles. We measured feature of LED using the spatial analyzer, optical microscope, thermal resistance, photometer, scanning electron microscope (SEM). As a result, the progression of the crack and the thermal resistance and decrease in luminance are proportional to number of thermal shock.

• Earthquakes and Structures
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• 제26권4호
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• pp.251-259
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• 2024

In this paper, the thermal post-buckling behavior of graphene platelets reinforced metal foams (GPLRMFs) plate with initial geometric imperfections on nonlinear elastic foundations are studied. First, the governing equation is derived based on the first-order shear deformation theory (FSDT) of plate. To obtain a single equation that only contains deflection, the Galerkin principle is employed to solve the governing equation. Subsequently, a comparative analysis was conducted with existing literature, thereby verifying the correctness and reliability of this paper. Finally, considering three GPLs distribution types (GPL-A, GPL-B, and GPL-C) of plates, the effects of initial geometric imperfections, foam distribution types, foam coefficients, GPLs weight fraction, temperature changes, and elastic foundation stiffness on the thermal post-buckling characteristics of the plates were investigated. The results show that the GPL-A distribution pattern exhibits the best buckling resistance. And with the foam coefficient (GPLs weight fraction, elastic foundation stiffness) increases, the deflection change of the plate under thermal load becomes smaller. On the contrary, when the initial geometric imperfection (temperature change) increases, the thermal buckling deflection increases. According to the current research situation, the results of this article can play an important role in the thermal stability analysis of GPLRMFs plates.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• 제15권6호
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• pp.524-532
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• 2003

In this paper, a personal air-conditioning system considering the human thermal adaptability is analyzed. Although the conventional personal air-conditioner was proofed to be satisfactory in providing for the thermal comfort, it is being questioned on the term of its energy efficiency. Therefore, it is important and urgent to develop new types of personal air-conditioning system with sustainable control strategy that can ensure energy saving and thermal comfort simultaneously. In this study, we first examined the problems of the conventional personal air-conditioning system with field interview and laboratory experiment in terms of usage, management and thermal comfort, and proposed the energy-saving personal air-conditioning system considering the human thermal adaptation. Then a laboratory experiment was performed to analyze the characteristics of the human thermal comfort under severe indoor thermal conditions, which were controlled using a new personal air-conditioning unit designed according to the proposal. The results help to illustrate the alleviation effect of the new personal air-conditioning system, and indicate that the thermal alleviation time is useful to maintain the thermal comfort with efficient usage of energy.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• 제12권2호
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• pp.25-33
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• 2016

The thermal stratification phenomenon in the nuclear power plant can cause abnormal deformation of the piping, contact with the support, damage to the support system. Repetition of the thermal stratification phenomenon or variation of the thermal boundary layer can cause thermal fatigue. Thermal stratification phenomenon in nuclear power plants is still an ongoing issue and active research has been carried out. In this paper, the current situation in Korean nuclear power plants is described, followed by the status of research and the future problems on the thermal stratification phenomenon in Korea.

• Journal of Information Display
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• 제13권1호
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.