• Title/Summary/Keyword: thermal modeling

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Thermal modeling of microcellular foamed polymer matrix (초미세 발포 성형 고분자 물질의 열전달 모델링)

  • Moon, Byeong_Gi;Cha, Sung-Woon;Oh, Sei-Woong
    • Proceedings of the KSME Conference
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    • 2000.04b
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    • pp.367-372
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    • 2000
  • By the means of microcellular (earning, we can make polymers with $10{\mu}m$ sized gas bubbles. After the $CO_2$ gas bubbles solve, diffuse and leave the polymer matrix, the thermal properties of polymer matrix are changed. Expecially, thermal conductivity becomes low. So, the polymer matrixes with gas bubbles can be used as insulator In this paper, we make model after microcellular foamed polymer matrix to know the change of thermal properties. Most of all, the purpose of this paper is the mlcrocellular foamed polymer matrix's availability as a insulator Beside of thermal properties the surface of microcellular foamed polymer is polished and easy to be colored. Above all the mechanical properties are better than the other insulator. So, microcellular foamed polymer can be used as exterior of building or it can be replaced as a tile.

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On thermal stability of plates with functionally graded coefficient of thermal expansion

  • Bousahla, Abdelmoumen Anis;Benyoucef, Samir;Tounsi, Abdelouahed;Mahmoud, S.R.
    • Structural Engineering and Mechanics
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    • v.60 no.2
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    • pp.313-335
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    • 2016
  • In this article, a four-variable refined plate theory is presented for buckling analysis of functionally graded plates subjected to uniform, linear and non-linear temperature rises across the thickness direction. The theory accounts for parabolic distribution of the transverse shear strains, and satisfies the zero traction boundary conditions on the surfaces of the plate without using shear correction factor. Young's modulus and Poisson ratio of the FGM plates are assumed to remain constant throughout the entire plate. However, the coefficient of thermal expansion of the FGM plate varies according to a power law form through the thickness coordinate. Equilibrium and stability equations are derived based on the present theory. The influences of many plate parameters on buckling temperature difference such ratio of thermal expansion, aspect ratio, side-to-thickness ratio and gradient index will be investigated.

Thermal Modeling of Comet-Like Asteroids

  • Park, Yoonsoo Bach;Ishiguro, Masateru;Usui, Fumihiko
    • The Bulletin of The Korean Astronomical Society
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    • v.41 no.1
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    • pp.81.4-82
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    • 2016
  • Recent analysis on asteroidal thermophysical property revealed that there is a tendency that their thermal inertia decrease with their sizes at least for main belt asteroids. However, little is known about the thermal properties of comet-like bodies. In this work we utilized a simple thermophysical model to calculate the thermal inertia of a bare nucleus of comet P/2006 HR30 (Siding Spring) and an asteroid in comet-like orbit 4015 Wilson-Harrington from AKARI observation data. It is also shown that the determination of their thermal inertia is very sensitive to their spin vector, while the diameter is rather easy to be constrained to a certain range by combining multi-wavelength observational data. Thus, we set diameter and hence the geometric albedo as fixed parameters, and inferred the spin vector and thermal inertia of the targets. Further detailed analyses on these cometary bodies will shed light on our understanding of the detailed surfacial characteristics of them.

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Optimal Thermal Resistance Extraction Method for the Current Source Model of HBT (HBT의 전류원 모델을 위한 최적 열 저항값 추출 방법)

  • 서영석;김인성;송재성;남효덕
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.4
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    • pp.367-372
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    • 2004
  • Two new extraction methods for the thermal Resistance of HBT(Heterojunction Bipolar Transistors) are proposed. First, the analytical expression, based on the thermal characteristics that the base to emitter junction voltage drops with the increase of junction temperature, is derived. Second, the thermal resistance equation that can predict the measured DC(Direct Current) data optimally is derived. These optimal thermal resistance expression is applied to the 2 finger 2${\times}$20${\mu}{\textrm}{m}$-AlGaAs/GaAs HBT and shows the good agreement with the measured data.

Effect of thermal gradients on stress/strain distributions in a thin circular symmetric plate

  • Aleksandrova, Nelli N.
    • Structural Engineering and Mechanics
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    • v.58 no.4
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    • pp.627-639
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    • 2016
  • The analysis of thermally induced stresses in engineering structures is a very important and necessary task with respect to design and modeling of pressurized containers, heat exchangers, aircrafts segments, etc. to prevent them from failure and improve working conditions. So, the purpose of this study is to investigate elasto-plastic thermal stresses and deformations in a thin annular plate embedded into rigid container. To this end, analytical research devoted to mathematically and physically rigorous stress/strain analysis is performed. In order to evaluate the effect of logarithmic thermal gradients, commonly applied to structures which incorporate thin plate geometries, different thermal parameters such as temperature mismatch and varying constraint temperature were introduced into the model of elastic perfectly-plastic annular plate obeying the von Mises yield criterion with its associated flow rule. The results obtained may be used in sensitive to temperature differences aircraft structures where the thermal effects on equipment must be kept in mind.

Modeling on thermal conductivity of MOX fuel considering its microstructural heterogeneity

  • Lee, Byung-Ho;Koo, Yang-Hyun;Sohn, Dong-Seong
    • Proceedings of the Korean Nuclear Society Conference
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    • 1999.10a
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    • pp.247-247
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    • 1999
  • This paper describes a new mechanistic thermal conductivity model considering the heterogeneous microstructure of MOX fuel. Even though the thermal conductivities of MOX have been investigated numerously by experimental measurements and theoretical analyses, they show the large scattering making the performance analysis of MOX fuel difficult. Therefore, a thermal conductivity model that depends on the heterogeneous microstructure of MOX fuel has been developed by using a general two-phase thermal conductivity model. In order to apply this model for developing the thermal conductivity for heterogeneous MOX fuel, the fuel is assumed to consist of Purich particles and U02 matrix including Pu02 in solid solution. Since little relevant data on Purich particles is available, FIGARO and SiemensKWU results are only used to characterize the microstructure of unirradiated and irradiated fuel. Philliponneaus and HALDEN models are selected for the local thermal conductivities for Purich particles and matrix, respectively. Then by combining the two models, overall thermal conductivity of MOX fuel is obtained. The new proposed model estimates the MOX thermal conductivity about 10% less than the value of U02 fuel, which is in the range of MOX thermal conductivity from HALDEN. The developed thermal conductivity model has been incorporated into KAERIs fuel performance code, COSMOS, and then verified using the measured data in the FIGARO program. Comparison of predicted and measured temperatures shows the reasonable agreement within acceptable error bounds together with satisfactory results for the fission gas release and gap pressure.essure.

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Analysis and modeling of thermal resistance of multi fin/finger FinFETs (멀티 핀/핑거 FinFET 트랜지스터의 열 저항 해석과 모델링)

  • Jang, MoonYong;Kim, SoYoung
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.8
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    • pp.39-48
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    • 2016
  • In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

One-Dimension Thermal Modeling of NiMH Battery for Thermal Management of Electric Vehicles (전기 자동차용 니켈수소 배터리 1차원 열전달 모델링)

  • Han, Jaeyoung;Park, Jisoo;Yu, Sangseok;Kim, Sung-Soo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.38 no.3
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    • pp.227-234
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    • 2014
  • Fuel consumption rates of electric vehicles strongly depend on their battery performance. Because the battery performance is sensitive to the operating temperature, temperature management of the battery ensures its performance and durability. In particular, the temperature distribution among modules in the battery pack affects the cooling characteristics. This study focuses on the thermal modeling of a battery pack to observe the temperature distribution among the modules. The battery model is a prismatic model of 10 NiMH battery modules. The thermal model of the battery consists of heat generation, convective heat transfer through the channel and conduction heat transfer among modules. The heat generation is calculated by the electric resistance heat during the charge/discharge state. The model is used to determine a strategy for proper thermal management in Electric vehicles.

Preliminary Thermal-Hydraulic Analysis of the CANDU Reactor Moderator Tank using the CUPID Code (CUPID 코드를 이용한 CANDU 원자로 칼란드리아 탱크 내부유동 열수력 예비 해석)

  • Choi, Su Ryong;Lee, Jae Ryong;Kim, Hyoung Tae;Yoon, Han Young;Jeong, Jae Jun
    • Journal of Energy Engineering
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    • v.23 no.4
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    • pp.95-105
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    • 2014
  • The CUPID code has been developed for a transient, three-dimensional, two-phase flow analysis at a component scale. It has been validated against a wide range of two-phase flow experiments. Especially, to assess its applicability to single- and two-phase flow analyses in the Calandria vessel of a CANDU nuclear reactor, it was validated using the experimental data of the 1/4-scaled facility of a Calandria vessel at the STERN laboratory. In this study, a preliminary thermal-hydraulic analysis of the CANDU reactor moderator tank using the CUPID code is carried out, which is based on the results of the previous studies. The complicated internal structure of the Calandria vessel and the inlet nozzle was modeled in a simplified manner by using a porous media approach. One of the most important factors in the analysis was found to be the modeling of the tank inlet nozzle. A calculation with a simple inlet nozzle modeling resulted in thermal stratification by buoyance, leading to a boiling from the top of the Calandria tank. This is not realistic at all and may occur due to the lack of inlet flow momentum. To improve this, a new nozzle modeling was used, which can preserve both mass flow and momentum flow at the inlet nozzle. This resulted in a realistic temperature distribution in the tank. In conclusion, it was shown that the CUPID code is applicable to thermal-hydraulic analysis of the CANDU reactor moderator tank using the cost-effective porous media approach and that the inlet nozzle modeling is very important for the flow analysis in the tank.

Solid Modeling of UBM and IMC Layers in Flip Chip Packages (플립칩 패키지에서 UBM 및 IMC 층의 형상 모델링)

  • Shin, Ki-Hoon;Kim, Joo-Han
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.6
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    • pp.181-186
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    • 2007
  • UBM (Under Bump Metallurgy) of flip chip assemblies consists of several layers such as the solder wetting, the diffusion barrier, and the adhesion layers. In addition, IMC layers are formed between the solder wetting layers (e.g. Cu, Ni) and the solder. The primary failure mechanism of the solder joints in flip chips is widely known as the fatigue failure caused by thermal fatigues or electromigration damages. Sometimes, the premature brittle failure occurs in the IMC layers. However, these phenomena have thus far been viewed from only experimental investigations. In this sense, this paper presents a method for solid modeling of IMC layers in flip chip assemblies, thus providing a pre-processing tool for finite element analysis to simulate the IMC failure mechanism. The proposed modeling method is CSG-based and can also be applied to the modeling of UBM structure in flip chip assemblies. This is done by performing Boolean operations according to the actual sequences of fabrication processes