• Journal of Korean Society of Environmental Engineers
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• v.29 no.12
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• pp.1400-1403
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• 2007

• Proceedings of the SAREK Conference
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• 2005.11a
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• pp.329-334
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• 2005

As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.

• International conference on construction engineering and project management
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• 2015.10a
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• pp.415-419
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• 2015

Engineering is a value-adding process applying knowledge and skills in the construction industry that includes the planning, feasibility study, project management (PM), front end engineering and design (FEED), detail design, procurement, construction, supervision, and operation. Among these engineering activities, FEED is defined as a comprehensive design practice in the early design phase focused on conceptual design and basic design. It is a particularly influencing area that determines the competitiveness of procurement and construction capability of construction firms (KNIN 2013). Nevertheless, previous studies in FEED have been limited to the design process, deliverable, or particular management technique (e.g. system engineering, collaboration, information etc.). In this context, the purpose of this study is to propose a comprehensive FEED business process structure for project management of thermal power plant construction projects encompassing the entire project life cycle. And an assessment methodology for FEED functions was developed. It is expected that the proposed structure of FEED functions and FEED evaluation methodology will contribute to improvement of competitive capability of engineering, procurement, and construction (EPC) companies.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.6
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• pp.586-591
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• 2015

This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.

• Journal of Environmental Science International
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• v.23 no.7
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• pp.1349-1358
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• 2014

This study suggests plan of green space management based on the result of research apprehending the characteristic through sorting types of city thermal environment targeting summer which thermal pollution is the most serious. Considering anthropogenic heat, development level of wind road, thermal environment, as a result of types of thermal environment process, it is appeared 36 types, and 10 types is relevant of this research subject. Type I-1, size of building is large, artificial covering area is wide, and thermal load of anthropogenic heat is high, type II-1, development condition of wind road is incomplete as IIlevel, entering cold air is difficult and thermal management and improvement is needed area. Type III-1, scale is large and it is area of origin of cold air, development level of wind road is mostly favorable, type III-2 is revealed as smaller scale than III-1, and small area of origin of cold air. Type IV, anthropogenic heat is $81{\sim}150W/m^2$, average, but development function of wind road is very favorable. Type V, large area of thermal load and the origin of cold air are distributed as similar ratio, and level of development function of wind road is revealed as II level. According to standard of type classification of thermal environment, as a result of suggesting plan of green space management and biotops area ratio, type I-1 is buffer green space and waterway creation, goal biotops area ratio 35%, type II-1 afforestation in site and goal biotops area ratio 40%, type III-1, preservation plan to display the current function continuously is requested. Type IV suggests afforestation of stream current, and type V suggests quantitative increase of green space and goal biotops area ratio 45%.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.63-66
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• 2014

In this study, we investigated the effects of Cu TSV on the thermal management of 3D stacked IC. Combination of backside point-heating and IR microscopic measurement of the front-side temperature showed evolution of hot spots in thin Si wafers, implying 3D stacked IC is vulnerable to thermal interference between stacked layers. Cu TSV was found to be an effective heat path, resulting in larger high temperature area in TSV wafer than bare Si wafer, and could be used as an efficient thermal via in the thermal management of 3D stacked IC.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.47 no.6
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• pp.57-67
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• 2010

This paper studies thermal characteristics of a mix of CPU-intensive and memory-intensive application workloads on a multi-core processor. Especially, we focus on thermal variations during program execution because thermal variations are more critical than average temperatures and their ranges for thermal management. New metrics are proposed to quantify such thermal variations for a workload. We study the thermal variations using SPEC CPU2006 benchmarks with varying cooling conditions and frequencies on an Intel Core 2 Duo processor. The results show that applications have distinct thermal variations characteristics. Such variations are affected by cooling conditions,operating frequencies and multiprogramming workload. Also, there are distinct spatial thermal variations between cores. Our new metrics and their results from this study provide useful insight for future research on multi-core thermal management.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• Journal of the Korea Safety Management & Science
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• v.10 no.4
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• pp.121-126
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• 2008

The effect of $Al(OH)_3$ on physical, thermal, and retardant property of rubber was studied. It was analyzed by statistical experimental design method with one way array to confirm the effect of factors. Physical characteristics, thermal pyrolysis temperature, and combustion time were considered as the properties. The amount of $Al(OH)_3$ addition was chosen as significant parameter. As the result of ANOVA analysis, thermal pyrolysis temperature increased and combustion time decreased with increasing of $Al(OH)_3$.

• The KIPS Transactions:PartA
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• v.19A no.2
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• pp.77-84
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• 2012

Speculative execution for improving instruction-level parallelism is widely used in high-performance processors. In the speculative execution technique, the most important factor is the accuracy of branch predictor. Unfortunately, complex branch predictors for improving the accuracy can cause serious thermal problems in 3D multicore processors. Thermal problems have negative impact on the processor performance. This paper analyzes two methods to solve the thermal problems in the branch predictor of 3D multi-core processors. First method is dynamic thermal management which turns off the execution of the branch predictor when the temperature of the branch predictor exceeds the threshold. Second method is thermal-aware branch predictor placement policy by considering each layer's temperature in 3D multi-core processors. According to our evaluation, the branch predictor placement policy shows that average temperature is $87.69^{\circ}C$, and average maximum temperature gradient is $11.17^{\circ}C$. And, dynamic thermal management shows that average temperature is $89.64^{\circ}C$ and average maximum temperature gradient is $17.62^{\circ}C$. Proposed branch predictor placement policy has superior thermal efficiency than the dynamic thermal management. In the perspective of performance, the proposed branch predictor placement policy degrades the performance by 3.61%, while the dynamic thermal management degrades the performance by 27.66%.