• 소성∙가공
• /
• 제18권8호
• /
• pp.616-624
• /
• 2009

In this work we demonstrate the hot-embossing process under different forming conditions such as forming temperature, load, and holding time in pressing, in order to determine the suitable conditions required for linear patterning on polymer plates (PC). Results showed that the replicated pattern depth increased in proportion to an increase in the forming temperature, load, and time. The reduction of the workpiece thickness increased according to the holding time in the pressing process. In the process of time, the reduction ratio of the workpiece thickness decreased due to the surface area increment of the workpiece, while the pressure on the workpiece declined. In order to reduce the bulging ratio we introduced a temperature difference between the upper and the lower punch.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
• /
• pp.23-28
• /
• 2005

Microlens arrays were fabricated using a modified LIGA process based on the exposure of a PMMA (Polymethylmethacrylate) sheet to deep x-rays and subsequent thermal treatment. A successful modeling and analyses for microlens formation were presented according to the experimental procedure. A nickel mold insert was fabricated by the nickel electroforming process on the PMMA microlens arrays fabricated by the modified LIGA process. For the replication of microlens arrays having various diameters with different foci on the same substrate, the hot embossing and the microinjection molding processes have been successfully utilized with the fabricated mold insert. Fabricated microlenses showed good surface roughness than the mold insert. The focal lengths of the injection molded microlenses were successfully measured experimentally and also estimated theoretically.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 The Korea-Japan Plastics Processing Joint Seminar
• /
• pp.7-13
• /
• 2003

Microlens arrays were fabricated using a novel fabrication technology based on the exposure of a PMMA (Polymethylmethacrylate) sheet to deep X-rays and subsequent thermal treatment. X-ray irradiation causes the decrease of molecular weight of PMMA, which in turn decreases the glass transition temperature and consequently causes a net volume increase during the thermal cycle resulting in a swollen microlens. A new physical modeling and analyses for micro lens formation were presented according to experimental procedure. A simple analysis based on the new model is found to be capable of predicting the shapes of micro lens which depend on the thermal treatment. For the replication of micro lens arrays having various diameters with different foci on the same surface, the hot embossing and the microinjection molding processes has been successfully utilized with a mold insert that is fabricated by Ni-electroplating based on a PMMA microstructure of micro lenses. Fabricated microlenses showed good surface roughness with the order of 1nm.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2003년도 춘계학술대회논문집
• /
• pp.465-469
• /
• 2003

Microlens arrays were fabricated using a novel fabrication technology based on the exposure of a PMMA (Polymethylmethacrylate) sheet to deep X-rays and subsequent thermal treatment. X-ray irradiation causes the decrease of molecular weight of PMMA, which in turn decreases the glass transition temperature and consequently causes a net volume increase during the thermal cycle resulting in a swollen microlens. A new physical modeling and analyses for microlens formation were presented according to experimental procedure. A simple analysis based on the new model is found to be capable of predicting the shapes of microlens which depend on the thermal treatment. For the replication of microlens arrays having various diameters with different foci on the same surface, the hot embossing and the microinjection molding processes has been successfully utilized with a mold insert that is fabricated by Ni-electroplating based on a PMMA microstructure of microlenses. Fabricated microlenses showed good surface roughness with the order of 1 nm.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2007년도 춘계학술대회 논문집
• /
• pp.745-746
• /
• 2007

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2007년도 추계학술대회 논문집
• /
• pp.364-367
• /
• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• 한국전산유체공학회:학술대회논문집
• /
• 한국전산유체공학회 2007년도 춘계 학술대회논문집
• /
• pp.153-158
• /
• 2007

Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

• 한국재료학회지
• /
• 제16권2호
• /
• pp.99-105
• /
• 2006

This paper reports an improved bonding method using the IPA (isopropyl alcohol) assisted low-temperature bonding process for the PMMA (polymethylmethacrylate) micro CE (capillary electrophoresis) chip. There is a problem about channel deformations during the conventional processes such as thermal bonding and solvent bonding methods. The bonding test using an IPA showed good results without channel deformations over 4 inch PMMA wafer at $60^{\circ}C$ and 1.3 bar for 10 minutes. The mechanism of IPA bonding was attributed to the formation of a small amount of vaporized acetone made from the oxidized IPA which allows to solvent bonding. To verify the usefulness of the IPA assisted low-temperature bonding process, the PMMA micro CE chip which had a $45{\mu}m$ channel height was fabricated by hot embossing process. A functional test of the fabricated CE chip was demonstrated by the separation of fluorescein and dichlorofluorescein. Any leakage of liquids was not observed during the test and the electropherogram result was successfully achieved. An IPA assisted low-temperature bonding process could be an easy and effective way to fabricate the PMMA micro CE chip and would help to increase the yield.

• 반도체디스플레이기술학회지
• /
• 제19권3호
• /
• pp.30-35
• /
• 2020

A microlens has been fabricated by various methods such as a thermal reflow, hot embossing, diamond milling, etc. However, these methods require a relatively complex process to control the microlens shape. In this work, we report on a simple and cost-effective method to fabricate a cylindrical microlens (CML), which can diffuse light widely. We have employed a slot-die head with the dual plate (a meniscus guide with a protruded μ-tip and a shim with a slit channel) for coating of a narrow stripe using poly(methyl methacrylate) (PMMA). We have shown that the higher the coating gap, the lower the maximum coating speed, which causes an increase in the stripe width and thickness. The coated PMMA stripe has the concave shape. To make it in the shape of a convex microlens, we have applied the thermal reflow method. When the stripe thickness is small, however, its effect is negligible. To increase the stripe thickness, we have increased the number of repeated coating. With this scheme, we have fabricated the CML with the width of 223 ㎛ and the thickness of 7.3 ㎛. Finally, we have demonstrated experimentally that the CML can diffuse light widely, a feature demanded for light extraction efficiency of organic light-emitting diodes (OLEDs) and suppression of moiré patterns in displays.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2007년도 추계학술대회 논문집
• /
• pp.100-103
• /
• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.