• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.9-9
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• 2009

본 연구에서는 MLCC 그린칩의 예열공정에서 나타난 수축 열변형 현상을 관찰하기 위해 각 구간별 온도를 달리하여 열-기계분석 Thermo-mechanical Anlaysis(TMA)으로 크립 특성 실험이 진행되었다. 수축 변형이 없는 안정화 구간을 확인하였으며, 분석결과를 바탕으로 제조기술에 적용가능한 간단한 수식을 이끌어내었다.

• 열처리공학회지
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• 제9권2호
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• pp.147-158
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• 1996

Generally, analytical consideration on the behaviour of metallic structures during quenching process, and analysis on the thermal stress and deformation after heat treatment are very important in presumption of crack and distorsion of quenched material. In this study a set of constitute equations relevant to the analysis of thermo elasto-viscoplastic materials with strain hysteresis during quenching process way presented on the basis of contimuum thermo-dynamics mechanics. The thermal stresses were numerically calculated by finite element technique of weighted residual method and the principle of virtual work. In the calculation process, the temperature depandency of physical and mechaniclal properties of the material in consideration. On the distribution of elasto-viscoplastic thermal stresses according to radial direction, axial and tangential stress are tensile stress(50MPa, 1.5GPa and 300MPa) in surface and compressive stress(-1.2GPa, -1.14GPa and -750MPa) in the inner part on the other hand, radial stress is tensile stress(900MPa) in area of analysis. According to axial direction, tangential stress gradients are average 60MPa/mm on the whole. The reversion of stress takes place at 11.5 to 16.8mm from the center in area of analysing.