• Bulletin of the Society of Naval Architects of Korea
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• v.19 no.4
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• pp.19-29
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• 1982

Galerkin's finite element method is applied to a two-dimensional heat convection-diffusion problem arising in the hydrodynamic lubrication of thrust bearings used in naval vessels. A parabolized thermal energy equation for the lubricant, and thermal diffusion equations for both bearing pad and the collar are treated together, with proper juncture conditions on the interface boundaries. it has been known that a numerical instability arises when the classical Galerkin's method, which is equivalent to a centered difference approximation, is applied to a parabolic-type partial differential equation. Probably the simplest remedy for this instability is to use a one-sided finite difference formula for the first derivative term in the finite difference method. However, in the present coupled heat convection-diffusion problem in which the governing equation is parabolized in a subdomain(Lubricant), uniformly stable numerical solutions for a wide range of the Peclet number are obtained in the numerical test based on Galerkin's classical finite element method. In the present numerical convergence errors in several error norms are presented in the first model problem. Additional numerical results for a more realistic bearing lubrication problem are presented for a second numerical model.

• Journal of the Korean Society of Combustion
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• v.18 no.2
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• pp.42-50
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• 2013

Linear stability analysis of radiating counterflow diffusion flames is numerically conducted to examine the instability characteristics of cellular patterns. Lewis number is assumed to be 0.5 to consider diffusional-thermal instability. Near kinetic limit extinction regime, growth rates of disturbances always have real eigen-values and neutral stability condition of planar disturbances perfectly falls into quasi-steady extinction. Cellular instability of disturbance with transverse direction occurs just before steady extinction. However, near radiative limit extinction regime, the eigenvalues are complex and pulsating instability of planar disturbances appears prior to steady extinction. Cellular instability occurs before the onset of planar pulsating instability, which means the extension of flammability.

• Journal of the Korean Solar Energy Society
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• v.33 no.1
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• pp.57-65
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• 2013

The temperatures with the ground depth, the positions of circulation water in ground heat exchanger were measured and thermal diffusion characteristics with the distances of the direction normal to the borehole was analysed. The deeper the depth of ground, the less the influences of outdoor temperature, but below 10m of ground, there was no influences of ground temperature. When the depth of trench pipe was below the depth of 2m, there was no influence. In the ground of 10m when the distances between the pipe and the other places were above 0.5m, the variations of temperature were less than $1.6^{\circ}C$ and above 2.5m they were less than $0.1^{\circ}C$. When the distances of bore hole were above 5m, there were no. influences of the nearest ground heat exchanger.

• Korean Journal of Optics and Photonics
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• v.12 no.5
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• pp.394-400
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• 2001

We studied thermal diffusion properties diffusion properties of multi-layered Ge-Sb-Te alloy thin films for optical recording media by solving the thermal equation. Based on the numerical analysis of optical energy distribution and absorption inside multi-layered films including temperature gradient and heat transfer simultaneously, we proposed the optimum parameters of the input laser power and the multi-layer structure as follow. i) Input laser power is 18 mW, ii) laser exposure time is 60 ns, iii) the thicknesses of the lower and the upper ZnS-SiO$_2$are 140 nm and 20~30 nm respectively, and iv) thickness of Ge-Sb-Te recording film is 20 nm.

• Journal of Hydrogen and New Energy
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• v.18 no.3
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• pp.265-274
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• 2007

A study has been conducted to clarify NO emission behavior through preferential diffusion effects of $H_2$ and H in methane-hydrogen diffusion flames. A comparison is made by employing three species diffusion models. Special concerns are focused on what is the deterministic role of the preferential diffusion effects in flame structure and NO emission. The behavior of maximum flame temperatures with three species diffusion models is not explained by scalar dissipation rate but the nature of chemical kinetics. The preferential diffusion of H into reaction zone suppresses the populations of the chain carrier radicals and then flame temperature while that of $H_2$ produces the increase of flame temperature. These preferential diffusion effects of $H_2$ and H are also discussed about NO emissions through the three species diffusion models.

• Bulletin of the Korean Chemical Society
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• v.17 no.4
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• pp.365-373
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• 1996

Time profile of the transient grating signal induced by a nanosecond pulsed laser excitation of methyl red is investigated in alcohols and toluene at several solvent temperatures. The signal decays biexponentially with well-separated time constants; the faster decay is identified as due to thermal diffusion of the solvents and the slower one as mainly due to translational diffusion of the solute. The measured translational diffusion constants of methyl red in toluene are close to a hydrodynamic prediction with a slip boundary condition while those in alcohols are larger by 30% and increase slightly with the size of alcohols. We compare the results with modified hydrodynamic models.

• Journal of the Korean Magnetics Society
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• v.15 no.2
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• pp.133-136
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• 2005

In the case of contacts between semiconductor and metal in semiconductor devices, they tend to be unstable because of thermal budget. To prevent these problems we deposited W-C-N diffusion barrier for preventing the interdiffusion between metal and semiconductor. The thickness of the barrier is $1,000{\AA}$ and the pressure is 3 mTorr during the deposition. In this work we coated LSMO (CMR material) on W-C-N diffusion barrier and then we studied the interface effects between LSMO layer and W-C-N diffusion barrier. We got results that the magnetic characteristics of LSMO thin film are still maintained after annealing at $800^{\circ}C$ for 3 hr because W-C-N thin diffusion barrier was prevented the diffusion of oxygen between LSMO and Si substrate.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.3
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• pp.349-356
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• 1986

For the extension of application in flash method measuring the thermophysical properties of materials, the heat diffusion equation with the heat transfer loss from front, rear, and circumferential surfaces of two layer cylinderical sample is mathematically analyzed by means of Green's function for axially symmetric pulse heating on the front of samples. The solutions are applied to determine the unknown thermal diffusivity of the two materials and analyzed the measurement error due to heat loss and finite pulse time effects.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.