• Journal of the Korean Applied Science and Technology
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• v.24 no.3
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• pp.278-286
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• 2007

As a part of enhancing the performance of wood-plastic composites (WPC), polypropylene (PP)/ nanoclay (NC)/ wood flour (WF) nanocomposites were prepared using melt blending and injection molding process to evaluate their thermal stability. Thermogravimetric analysis (TGA) was employed to investigate thermal degradation kinetics of the nanocomposites both dynamic and isothermal conditions. Dynamic scans of the TGA showed an increased thermal stability of the nanocomposites at moderate wood flour concentrations (up to 20 phr, percentage based on hundred percent resin) while it decreased with the addition of 30 phr wood flour. The activation energy $(E_a)$ of thermal degradation of nanocomposites increased when nanoclay was added and the concentration of wood flour increased. Different equations were used to evaluate isothermal degradation kinetics using the rate of thermal degradation of the composites, expressed as weight loss (%) from their isothermal TGA curves. Degradation occurred at faster rate in the initial stages of about 60 min., and then proceeded in a gradual manner. However, nanocomposites with wood flour of 30 phr heated at $300^{\circ}C$ showed a drastic difference in their degradation behavior, and reached almost a complete decomposition after 40 min. of the isothermal heating. The degree of decomposition was greater at higher temperatures, and the residual weight of isothermal degradation of nanocomposites greatly varied from about 10 to 90%, depending on isothermal temperatures. The isothermal degradation of nanocomposites also increased their thermal stability with the addition of 1 phr nanoclay and of wood flour up to 20 phr. But, the degradation of PP100/NC1/MAPP3/WF30 nanocomposites with 30 phr wood flour occurs at a faster rate compared to those of the others, indicating a decrease in their thermal stability.

• Fibers and Polymers
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• v.2 no.2
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• pp.75-80
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• 2001

The thermal degradation of poly(ethylene terephthalate-co-isophthalate)s (PETIs) is investigated by using isothermal thermogravimetric analysis at the temperature range of 280-31$0^{\circ}C$. The degradation rate of PETIs is increased as the mole ratio of ethylene isophthaloyl (EI) units in PETIs increases. The activation energies for the thermal degradation of poly(ethylene terephthalate), PETI(5/5), and poly(ethylene isophthalate) are 33.4, 16.6, and 8.9 kcal/mole, respectively. The degradation rate of PETIs is influenced by their volatile cyclic oligomer components formed during the polymerization and the thermal degradation. It is simulated by the rotational isomeric state model that the content of cyclic dimer in PETIs, which is the most volatile cyclic oligomer component, increases with the EI units in PETIs.

• Nuclear Engineering and Technology
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• v.56 no.4
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• pp.1277-1283
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• 2024

This study presents a radiation-induced thermal conductivity degradation (TCD) model of zirconium as compared to the conventional UO2 TCD model. We derived the governing factors of the radiation-induced TCD model, such as maximum TCD value and temperature range of TCD. The maximum TCD value was derived by two methods, in which 1) experimental result of 32 % TCD was directly utilized as the maximum TCD value and 2) a theoretical approach based on dislocation was applied to derive the maximum TCD value. Further, the temperature range of TCD was determined to be 437-837 K by 1) experimental results of post-annealing of irradiation hardening as compared to 2) the rate theory and thermal equilibrium. Consequently, the radiation-induced TCD model of zirconium was derived to be $f_r=1-{\frac{0.32}{1+{\exp}\,\{(T-637)/45\}}}$. Because the thermal conductivity of zirconium is one of the factors determining the storage and transport system, this newly proposed model could improve the safety analysis of spent fuel storage systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.208-214
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• 2011

In this thesis, the partial discharge according to applied voltage and variations of cross-sectional area and length of the conductor related to general condition for using cable was measured in order to study degradation diagnosis for 2-Core cable of the PVC insulator used in industrial fields for other safety installations. Also the thermal degradation conditions under various installation circumstances of cables were studied by assuming degradation conditions with each different degradation rate (50%, 67%, 100%) such as variation in degradated temperature, thermal exposure time, normal state, partially degradated state and overall degradated state for thermal degradation diagnosis. The quantity of electric discharge (V-Q) according to applied voltage was measured for measurement of inception voltage and extinction voltage. The quantity of electric discharge and the number of electric discharge (Q-N) were measured with applied voltage kept constantly. In addition, pictures were taken using SEM (scanning electron microscope) to compare the surface of external insulator to degradated state of internal insulator according to thermal degradation temperature and also compare the surface of external insulator to degradated surface state of internal insulator according exposure time of cables to thermal stress.

• Polymer(Korea)
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• v.29 no.5
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• pp.508-517
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• 2005

The thermal degradation behavior and reliability analysis were investigated using dynamic thermogravimetric analysis (TGA) and accelerated degradation test (ADT) to characterize the dynamic parameters related to thermal degradation of plastic meterials for household electric appliances. In addition, the weathering of the plastic were performed by ADT using Xenon uc, and the color difference of the samples after ADT were measured with Color Eye 3010 specoophotometer. he activation energy for thermal degradation of the samples increased with increasing the rate of weight loss. The Kim-Park method was found to be more effective analysis in describing thermal degradation of plastic meterials. Plastic materials were very sensitive to ultra-violet rays in faster degradation.

• Journal of the Korean Chemical Society
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• v.11 no.2
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• pp.70-76
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• 1967

Structural changes attending polyacrylonitrile(PAN) upon heating and treating with nucleophilic reagents have been studied for some time and a few authors have studied on the thermal degradation, particularly on the characterization of degradation products in PAN. It is the purpose of this paper to report the kinetic study on the thermal degradation above $250^{\circ}C$ and make some suggestions as to the degradation process and mechanism in PAN. The degradation process in PAN is considered that three reactions are combined in two steps. Random chain scission accompanying the naphthylidine-type ring formation is the first step and the degradation of naphthylidine-type ring occurred as the next step. The reactions in the first step are competitive so that the maximum weight loss on pyrolysis of PAN, under such a condition that the degradation of naphthylidine-type ring is negligible, is depended on the relative reaction rate of these two competitive reactions.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• KIEAE Journal
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• v.15 no.6
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• pp.11-18
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• 2015

Purpose: The current study analyzed trends in thermal insulation performance with aging, and condensation characteristics caused by the former. Method: Thermal insulation and condensation prevention performance of an architecture were assessed using Temperature Difference Ration Inside, or TDRi. Subjects of this quantitative analysis in thermal insulation performance change due to aging included recently constructed apartments and aged apartments older than 40 years. Time series comparison and analysis were conducted to observed changes in the thermal insulation performance and condensation characteristics. Result: Analysis showed that wall insulation performance degraded with aging regardless of fortified insulating material usage or insulating material type, which caused increased danger of condensation. In addition, when fortified insulating material was installed on the connection between the walls, insulation performance degradation was lower compared to cases in which fortified materials were not used. In all cases from 1 to 10, the rate of thermal insulation performance degradation increased after 20 years of aging.

• Journal of the Korean Chemical Society
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• v.11 no.2
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• pp.77-80
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• 1967

Radiolysis of polyacrylonitrile(PAN) has been studied. Parameters for crosslinking and scission induced by gamma-ray irradiation were obtained by means of sol-gel partitioning method. G-value of crosslinking in PAN ($\bar{M}n=6{\times}10^5$) was 0.038 and the gel dose 21.6 Mrad. The effects of irradiation on the thermal degradation rate in PAN was also studied. No appreciable changes in thermal degradation rate observed up to 81.8 Mrad of irradiation dose.

• Journal of the Korean Wood Science and Technology
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• v.42 no.6
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• pp.682-690
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• 2014

In order to improve the thermal stability of wood plastic composites (WPC), thermal degradation behavior of WPC in this study was investigated by the addition of wood flour and fire retardant after hybridization of wood flour and ammonium polyphosphate (APP) into polypropylene (PP) matrix. Thermal degradation behavior of all formulations was analyzed with thermogravimetric analyzer under nitrogen environment at heating rate of $10^{\circ}C/min$. As the thermal degradation temperature of wood flour is lower than that of PP, char layer formed by the wood flour decreases the speed of heat transfer to PP. In addition, the char layer increases the 2nd thermal degradation temperature and decreases the 2nd thermal degradation speed. The WPC treated with APP increases the 1st and 2nd degradation temperatures. In the case of WPC with high loading level of wood flour, the 1st thermal degradation temperature and 2nd thermal degradation rate were increased by the addition of APP, and then the amount of remnants at high temperature was increased by the increase of the APP loading level. In the case of WPC treated with APP, the amount of the remnants at high temperature was increased with the increase of wood flour content from 10 wt% to 50 wt%, indicating that char formation of the APP and wood flour occurred at the same time, resulting in high thermal stability effect by the increase of wood flour content.