• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.25-26
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• 2008

Electrical properties of Pt/Ti/Au/Pt contacts to n-GaAs were characterized as the V/III ratio of GaAs grown by metalorganic chemical vapor deposition were 25, 50, and 100, respectively. The samples have been annealed during 30sec at 350 and $450^{\circ}C$ in rapid thermal annealing, and those specific contact resistance investigated by using transmission line method. According to experimental results, the specific contact resistance between p-metal and GaAs was decreased as the V/III ratio was lower. These results indicate that Si doping concentration of GaAs increased as the vacancy of V-series of GaAs was high.

• Journal of the Korean institute of surface engineering
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• v.23 no.3
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• pp.173-182
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• 1990

In order to prevent the thermal and enviromenatal degradation of contact materials a nickel layer was plated as an undercoat of gold plating on the surface phosphorous bronze. The thickness of nikel and gold coating and chemical resistance of the coatings were measured at various conditions. Variation of morphology and chemical composition was studied by SEM, EDS and ESCA, respectively. Nickel layer was found to act as a thermal diffusion barrier and to retard the diffusion of copper from substrate to gold coating in the temperature $200^{\circ}C$~$400^{\circ}C$. below $200^{\circ}C$gold coated contacts showed a stable and low contanct resistance, while above $200^{\circ}C$ rapid diffusion of copper formed copper oxide on the surface layer and raised the contact resistance. With the nickel thinkness of abount 5$\mu$m as an undercoat the gold thinkness of $0.5\mu$m, showed satistactory (less than 1 m$\Omega$) contact resistance below 20$0^{\circ}C$ and corresponding gold thinkness increased to 1.0 m at $300^{\circ}C$~$400^{\circ}C$.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.780-783
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• 2004

The two-dimensional modeling of the non-stationary thermal state and voltage responsivity of the sensitive elements usually used in solid-state pyroelectric focal plane arrays are presented. Temperature distributions under periodical thermal excitation and the response of the thermal imaging device, which is composed of the pyroelectric sensitive elements mounted on a single silicon substrate, are numerically calculated. The sensitive element consists of a covering metal layer, infrared polymer absorber, front metal contact, sensitive pyroelectric element, the interconnecting column and the bulk silicon readout. The results of the numerical modeling show that the thermal crosstalk between sensitive elements to be critical especially at low frequency (f < 10Hz) of periodically modulated light. It is also shown that the use of our models gives the possibility to improve the design, operating regimes and sensitivity of the device.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.439-444
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• 2004

The important problem in high speed spindle is to reduce and minimize the thermal effect by motor and ball bearings. In this study. the effects of bearing preload and cooling for high speed spindle with high frequency motor are investigated. A high speed spindle is composed of angular contact ball bearings, high frequency motor, grease lubrication, oil jacket cooling, and so on. Heat generation of the bearing and the high frequency motor are estimated from the theoretical and experimental data. The thermal analyses of high speed spindle to minimize the thermal effect and maximize the cooling effect are carried out under the various cooling conditions and preload. Method of variable bearing preload and cooling can be useful to design the high speed motor spindle. The results show that the optimal preload and cooling are very effective to minimize the thermal displacement by motor and ball bearing.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.5
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• pp.716-723
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• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.96-101
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• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1997.10a
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• pp.200-210
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• 1997

This paper presents the thermal behaviours of a solid type disk brake for a high-speed train. The thermal behaviours of a brake disk with 50mm thickness shows good performance compared with 45mm thickness of a disk because of a high specific heat capacity and thermal expansion ratio. The FEM results show that the thickness of the d!sk with a same weight of the brake disk should be increased for a good flexibility of the contact thermal problems. Therefore, the ratio between the pad and disk in diameter may be reduced and the thickness of a disk increased.

• Journal of Mechanical Science and Technology
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• v.14 no.5
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• pp.477-482
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• 2000

This study discusses a non-contact optical technique (electronic speckle pattern interferometry) that is well suited for thermal deformation measurement without any surface preparation and compensating process. Fiber reinforced plastics ($[0]_{16},\;[0/90]_{8S}$) were analyzed by ESPI to determine their thermal expansion coefficients. The thermal expansion coefficient of the transverse direction of a uniaxial composite is evaluated as $48.78{\times}10^{-6}(1/^{\circ}C)$. Also, the thermal expansion coefficient of the cross-ply laminate $[0/90]_{8S}$ is numerically estimated as $3.23{\times}10^{-6}(1/^{\circ}C)$ that is compared with that measured by ESPI.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2106-2109
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• 2008

Nanofluids have been studied as possible alternatives for heat transfer fluids to improve the efficiency of heat exchangers. There are deviations of measured effective thermal conductivities between research-groups, and the mechanisms of the effective thermal conductivity enhancement of nanofluids are not confirmed yet. In this study, the effects of particle shape on the effective thermal conductivity enhancement are discussed and presented as a possible explanation of the deviations. The particle motion effect is found to be negligible for nanofluids of high aspect ratio cylindrical particles, which is believed to be important for nanofluids of spherical particles, while the percolation network formation and contact resistance play dominant roles in determining the effective thermal conductivity.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.11
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• pp.968-972
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• 2008

Ni/Ti/Al multilayer system ('/'denotes the deposition sequence) was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Ni 30 nm / Ti 50 nm / Al 300 nm layers were sequentially deposited by e-beam evaporation on the 4H-SiC samples which were implanted with Al (norminal doping concentration = $4\times10^{19}cm^{-3}$) and then annealed at $1700^{\circ}C$ for dopant activation. Rapid thermal anneal (RTA) temperature for ohmic contact formation was varied in the range of $840\sim930^{\circ}C$. Specific contact resistances were extracted from the measured current vs. voltage (I-V) data of linear- and circular transfer length method (TLM) patterns. In constrast to Ni contact, Ni/Ti/Al contact shows perfectly linear I-V characteristics, and possesses much lower contact resistance of about $2\sim3\times10^{-4}\Omega{\cdot}cm^2$ even after low-temperature RTA at $840^{\circ}C$, which is about 2 orders of magnitude smaller than that of Ni contact. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance. X-ray diffraction (XRD) analysis indicated the existence of intermetallic compounds of Ni and Al as well as $NiSi_{1-x}$, but characteristic peaks of $Ti_{3}SiC_2$, a probable narrow-gap interfacial alloy responsible for low-resistance Ti/Al ohmic contact formation, were not detected. Therefore, Al in-diffusion into SiC surface region is considered to be the dominant mechanism of improvement in conduction behavior of Ni/Ti/Al contact.