• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.5
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• pp.29-36
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• 2003

Exhaust manifolds suffer from serious temperature variation during the thermal fatigue test. The spatial distribution of temperature changes at each moment. Because transient flow can not be simulated during the long period of temperature change, the simulation can not be performed by conjugate heat transfer analysis. In this study, a new procedure for transient thermal analysis is established by decoupling fluid-solid analysis. The procedure consists of (1) transient CFD calculation (2 cycles), (2) mapping heat transfer coefficient to the inner surface of solid mesh as a boundary condition of heat conduction analysis and (3) transient heat conduction analysis in the long period (30 min). The realistic temperature change can be predicted by this procedure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1092-1095
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• 2001

Steady state thermal analysis has been done by a finite element method in a diode of 12kV blocking voltage. The diode was fabricated by soldering ten pieces of 1200V diodes in series, capping a dummy wafer at the far end of diode series, and finally wire bonded for building anode and cathode terminal. In order to achieve high voltage and reliability, the edge of each diode was beveled and passivated by resin with a thickness of 25${\mu}$m. It was assumed that the generated heat which is mainly by the on-state voltage drop, 9V for 12kV diode, is dissipated by way of the conduction through diodes layers to bonding wire and of the convection at the surface of passivating resin. It was predicted by the thermal analysis that the temperature rise of a pn junction of the 12kV diode can reach at the range of 16∼34$^{\circ}C$ under the given boundary conditions. The thickness and thermal conductivity(0.3∼3W/m-K) of the passivating resin did little effect to lower thermal resistance of the diode. As the length of the bonding wire increased, which means the distance of heat conduction path became longer, the thermal resistance increased considerably. The thermal analysis results imply that the generated heat of the diode is dissipated mainly by the conduction through the route of diode-dummy wafer-bonding wire, which suggests to minimize the length of the wire for the lowest thermal resistance.

• Journal of the Korean Applied Science and Technology
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• v.23 no.3
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• pp.238-242
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• 2006

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, the electric conduction mechanism of PI Ultra-Thin Films was investigated at room temperature. At low electric field, ohmic conduction $(I{\propto}V)$ was observed and the calculated electrical conductivity was about $4.23{\times}10^{-15}{\sim}9.81{\times}10^{-15}\;S/cm$. At high electric field, nonohmic conduction $(I{\propto}V^2)$ was observed and the conduction mechanism was explained by space charge limited region effect. The dielectric constant of PI Ultra-Thin Films was about 7.0.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.4
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• pp.328-332
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• 2007

A superconducting magnetic energy storage (SMES) system has shorter response time and longer life time, and is more economical, and environment-friendly than other uninterruptible power supply (UPS). A conduction cooling system is well answer for the high temperature superconductor (HTS) SMES system. Because the conduction cooling system is simple, light and small structure. The purpose of this paper is to design and verify the effective conduction cooling system for the HTS SMES system. The analysis of heat loads in cryostat is performed. Thermal shield heat loads, temperatures of HTS coil surface and conduction Cu plate are estimated and measured.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.6
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• pp.665-670
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• 2011

In this paper, a new approach to detect surface cracks from a noisy thermal image in the infrared thermography is presented using an holomorphic characteristic of temperature field in a thin plate under steady-state thermal condition. The holomorphic function for 2-D heat flow field in the plate was derived from Cauchy Riemann conditions to define a contour integral that varies according to the existence and strength of a singularity in the domain of integration. The contour integral at each point of thermal image eliminated the temperature variation due to heat conduction and suppressed the noise, so that its image emphasized and highlighted the singularity such as crack. This feature of holomorphic function was also investigated numerically using a simple thermal field in the thin plate satisfying the Laplace equation. The simulation results showed that the integral image selected and detected the crack embedded artificially in the plate very well in a noisy environment.

• Journal of Korea Society of Industrial Information Systems
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• v.23 no.1
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• pp.31-41
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• 2018

This paper discusses a structure design and thermal analysis of cryogenic conduction cooling system for a high current HTS DC reactor. Dimensions of the conduction cooling system parts including HTS magnets, bobbin structures, current leads, support bars, and thermal exchangers were calculated and drawn using a 3D CAD program. A finite element method model was built for determining the optimal design parameters and analyzing the thermo-mechanical characteristics. The operating current and inductance of the reactor magnet were 1,500 A, 400 mH, respectively. The thermal load of the HTS DC reactor was analyzed for determining the cooling capacity of the cryo-cooler. Hence, we carried out the operating test of conduction cooling system of the 1st stage area with high current flow. The cooper bars was cooled down to 40 K and HTS leads operated stably. As a experiment result, the total heat load of the 1st stage area is 190 W. The study results can be effectively utilized for the design and fabrication of a commercial HTS DC reactor.

• Tunnel and Underground Space
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• v.9 no.1
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• pp.27-35
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• 1999

The characteristics of heat conduction for the heat source boundary like an arch shape cavern are different from those for the semi-infinite or circular boundary which can be driven theoretically. A new form of transient heat conduction equation in rock mass around the arch shape cavern is evaluated with analyzing the pattern of the rock temperature distribution measured at the cold storage pilot plant. The new equation, which is driven by adopting a shape function, $SF=\sqrt{logx_0/log(x_0+x)}$ to the solution for a semi-infinite boundary, has the semi-radial form of temperature variation with distance. And, thermal properties of rock mass are estimated by comparing the rock temperature distributions by this equation with those by measurement. Thermal conductivity and specific heat of rock mass are estimated as giving the difference of 20~25% compared to those of laboratory scale. This difference seems to be caused by discontinuity like joint and water content in rock mass.

• Progress in Superconductivity and Cryogenics
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• v.4 no.2
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• pp.73-77
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• 2002

In order to derive the detailed design of Thermal Shield Cryopanel. which plays a role to make the Tokamak Nuclear Fusion Equipment work at both static and efficient conditions the commercially available software package FLUENT Version 5.3, was utilized. This study investigated the effects of thermal sources and distributions on the temperatures of Lid. Body. Base. and EH-Port Cryopanel by the numerical technique whose grid generations cover the solid and 9as region of the panel. The physical model of the Thermal Shield Cryopanel is that the 10mm diameter of the pipe with 1mm thickness is soldered on the Stainless steel Panel with 4mm thickness. The heat fluxes to the panel are assumed to be by thermal radiation in the vacuum space and by conduction through the supporters. The inlet conditions of Helium gas are 20 atmospheric Pressures and 60K temperature. The panel shapes with cooling Pipes and the operational conditions to keep appropriate temperature distribution of Thermal Shield Cryopanel Have been found and suggested.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.11
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• pp.146-159
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• 2002

An efficient method to predict the convection heat transfer coefficients on the top surface of the engine piston is proposed. The method is based on the inverse method of the thermal conduction problem and uses a numerical optimization technique. In the method, the heat transfer coefficients are numerically obtained so that the difference between analyzed temperatures from the finite element method and measured temperatures is minimized. The method can be effectively used to analyze the temperature distribution of engine pistons in case when application of prescribed-temperature boundary condition is not reasonable because of insufficient number of measured temperatures. A hollow sphere problem with an analytic solution is taken as a simple example and accuracy and efficiency is demonstrated. The method is applied to a practical large liquid petroleum gas(LPG) engine piston and the heat transfer coefficients on the top surface of the piston is successfully calculated. Resulting analyzed temperature favorably coincides with measured temperature.

• Progress in Superconductivity and Cryogenics
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• v.5 no.2
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• pp.30-35
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• 2003

The inductive superconducting fault current limiter (SFCLJ limits the fault current with its dc reactor. To fabricate the optimal dc reactor for inductive SFCL, several design and manufacturing technologies are necessary. In this paper, the manufacturing technology for dc reactor and cryogenic cooling method are described in detail. GM-cryocooler was used enlarge the critical current of dc reactor by cooling down the temperature of dc reactor about 20 K. Moreover, the results of short circuit test were described. Finally, the thermal characteristics of conduction-cooled system were discussed and then, sub-cooled nitrogen system was proposed to enhance the thermal stability of dc reactor.