• Title/Summary/Keyword: thermal conduction

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Device Suitability Analysis by Comparing Performance of SiC MOSFET and GaN Transistor in Induction Heating System (유도 가열 시스템에서 SiC MOSFET과 GaN Transistor의 성능 비교를 통한 소자 적합성 분석)

  • Cha, Kwang-Hyung;Ju, Chang-Tae;Min, Sung-Soo;Kim, Rae-Young
    • The Transactions of the Korean Institute of Power Electronics
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    • v.25 no.3
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    • pp.204-212
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    • 2020
  • In this study, device suitability analysis is performed by comparing the performance of SiC MOSFET and GaN Transistor, which are WBG power semiconductor devices in the induction heating (IH) system. WBG devices have the advantages of low conduction resistance, switching losses, and fast switching due to their excellent physical properties, which can achieve high output power and efficiency in IH systems. In this study, SiC and GaN are applied to a general half-bridge series resonant converter topology to compare the conduction loss, switching loss, reverse conduction loss, and thermal performance of the device in consideration of device characteristics and circuit conditions. On this basis, device suitability in the IH system is analyzed. A half-bridge series resonant converter prototype using the SiC and GaN of a 650-V rating is constructed to verify device suitability through performance comparison and verified through an experimental comparison of power loss and thermal performance.

A study on the dielectric and electrical conduction properties of$(Sr_{1-x}.Ca_x)TiO_3$ grain boundary layer ceramics ($(Sr_{1-x}.Ca_x)TiO_3$입계층 세라믹의 유전 및 전기전도특성에 관한 연구)

  • 최운식;김충혁;이준웅
    • Electrical & Electronic Materials
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    • v.8 no.5
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    • pp.611-618
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    • 1995
  • The (Sr$_{1-x}$ .Ca$_{x}$)TiO$_{3}$+0.6[mol%]Nb$_{2}$O$_{5}$ (0.05.leq.x.leq.0.2) ceramics were fabricated to form semiconducting ceramics by sintering at about 1350[.deg. C] in a reducing atmosphere(N$_{2}$ gas). Metal oxides, CuO, was painted on the both surface of the specimens to diffuse to the grain boundary. They were annealed at 1100 [.deg. C] for 2 hours. The 2nd phase formed by thermal diffusing from the surface lead to a very high apparent dielectric constant. According to increase of the frequency as a functional of temperature, all specimens used in this study showed the dielectric relaxation, and the relaxation frequency was above 106 [Hz], it move to low frequency with increasing resistivity of grain. The specimens showed three kinds of conduction mechanisms in the temperature range 25-125 [.deg. C] as the current increased: the region I below 200 [V/cm] shows the ohmic conduction. The region rt between 200 [V/cm] and 2000 [V/cm] can be explained by the Poole-Frenkel emission theory, and the region III above 2000 [V/cm] is dominated by the tunneling effect.fect.

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Numerical Modeling of Heat Transfer Due to Particle Impact on a Wall (벽면에서의 입자 고찰에 의한 열전달 수치 모델)

  • 권오붕
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.31 no.3
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    • pp.296-305
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    • 1995
  • A numerical study was undertaken to clarify the mechanisms of heat transfer in fluid-particle suspension flows. Such flows, including fluidization, are of considerable industrial importance. The present study uses 2-D numerical computations of collisions of normal incidence between a particle and a wall. By comparing the results using (a) adiabatic boundary conditions on the particle and (b) uniform, elevated temperature conditions on the particle, the contributions of fluid-mediated conduction and particle induced convection were successfully separated. Computational expedience led to the use of a transient conduction thermal layer as the background thermal field for the analysis. The results shows that the effect of particle movement is very small until the particle reaches a distance of one to one half diameter away from the wall. The gas-mediated conduction effect is dominant over the induced gas convection effect when Pe is small and the induced gas convection effect becomes significant as Pe increases.

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Thermal Analysis of Thermal Printing Head by Numerical Method (수치계산에 의한 열전사 프린팅헤드의 열해석)

  • 조창주;정우남
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.9
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    • pp.50-55
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    • 1998
  • A thermal printing head is used for heat transcription printing of facsimile or printer. The thermal printing head has multilayered thin films and heaters lined up. Thermal analysis of thermal printing head is important for a design of thermal printing head. Since the heating charateristics of thermal printing head is dependent on the thermal conductivities of multilayerd material, this study made numerical analysis for three dimensional transient heat conduction in mutilayered films by the finite difference method and investigated the effect of various thermal conductivities of thin films. The results of this study will be used to design thermal printing head and select the materials for thermal printing head.

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Transient Heat Conduction Through the Ondol Floor and Beat toss to the Ground (온돌의 구들장과 땅바닥의 비정상 열전도 해석)

  • Bae, Soon-Hoon;Kim, Doo-Chun
    • The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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    • v.4 no.1
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    • pp.6-17
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    • 1975
  • For a periodic variation of the flue gas temperature the heat conduction through the Ondol floor was analysized. Also the heat loss to the ground was estimated. The floor thermal capacity, as a function of the floor thickness, has strong influence on the time lag of the temperature variation. It is an important design parameter for intermittent heating. Even for the steady periodic variation, there was significant heat loss to the ground below the Ondol floor.

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An Estimation of the Temperature-dependent Thermal Conductivity for Hybrid-fiber Reinforced Shield Tunnel Lining (하이브리드 섬유보강 쉴드터널 라이닝의 온도의존적 열전도도 추정)

  • Lee, Chang Soo;Kim, Yong Hyok
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.16 no.4
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    • pp.99-106
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    • 2012
  • This study presents estimation method of temperature-dependent thermal conductivity by using solution of inverse heat conduction problem. Time and depth temperature distribution data from full-scale fire test were used for estimating temperature-dependent thermal conductivity on hybrid-fiber reinforced shield tunnel lining. At short heating time, estimated thermal conductivity sharply decreased within $100^{\circ}C$. On the other hand, it reflected thermal properties of concrete and effect of steel fiber at heating time of measured maximum heating temperature. Thus arbitrary time should be determined to estimate temperature-dependent thermal conductivity in time zone of measured maximum heating temperature. Estimated temperature-dependent thermal conductivity is similar to results of other study.

A GN-based modified model for size-dependent coupled thermoelasticity analysis in nano scale, considering nonlocality in heat conduction and elasticity: An analytical solution for a nano beam with energy dissipation

  • Hosseini, Seyed Mahmoud
    • Structural Engineering and Mechanics
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    • v.73 no.3
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    • pp.287-302
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    • 2020
  • This investigation deals with a size-dependent coupled thermoelasticity analysis based on Green-Naghdi (GN) theory in nano scale using a new modified nonlocal model of heat conduction, which is based on the GN theory and nonlocal Eringen theory of elasticity. In the analysis based on the proposed model, the nonlocality is taken into account in both heat conduction and elasticity. The governing equations including the equations of motion and the energy balance equation are derived using the proposed model in a nano beam resonator. An analytical solution is proposed for the problem using the Laplace transform technique and Talbot technique for inversion to time domain. It is assumed that the nano beam is subjected to sinusoidal thermal shock loading, which is applied on the one of beam ends. The transient behaviors of fields' quantities such as lateral deflection and temperature are studied in detail. Also, the effects of small scale parameter on the dynamic behaviors of lateral deflection and temperature are obtained and assessed for the problem. The proposed GN-based model, analytical solution and data are verified and also compared with reported data obtained from GN coupled thermoelasticity analysis without considering the nonlocality in heat conduction in a nano beam.

Single-Phase Bridgeless Zeta PFC Converter with Reduced Conduction Losses

  • Khan, Shakil Ahamed;Rahim, Nasrudin Abd.;Bakar, Ab Halim Abu;Kwang, Tan Chia
    • Journal of Power Electronics
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    • v.15 no.2
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    • pp.356-365
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    • 2015
  • This paper presents a new single phase front-end ac-dc bridgeless power factor correction (PFC) rectifier topology. The proposed converter achieves a high efficiency over a wide range of input and output voltages, a high power factor, low line current harmonics and both step up and step down voltage conversions. This topology is based on a non-inverting buck-boost (Zeta) converter. In this approach, the input diode bridge is removed and a maximum of one diode conducts in a complete switching period. This reduces the conduction losses and the thermal stresses on the switches when compare to existing PFC topologies. Inherent power factor correction is achieved by operating the converter in the discontinuous conduction mode (DCM) which leads to a simplified control circuit. The characteristics of the proposed design, principles of operation, steady state operation analysis, and control structure are described in this paper. An experimental prototype has been built to demonstrate the feasibility of the new converter. Simulation and experimental results are provided to verify the improved power quality at the AC mains and the lower conduction losses of the converter.

Design Sensitivity Analysis and Topology Optimization of Heat Conduction Problems (열전도 문제에 대한 설계 민감도 해석과 위상 최적 설계)

  • 김민근;조선호
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2004.04a
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    • pp.127-134
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    • 2004
  • In this paper, using an adjoint variable method, we develop a design sensitivity analysis (DSA) method applicable to heat conduction problems in steady state. Also, a topology design optimization method is developed using the developed DSA method. Design sensitivity expressions with respect to the thermal conductivity are derived. Since the already factorized system matrix is utilized to obtain the adjoint solution, the cost for the sensitivity computation is trivial. For the topology design optimization, the design variables are parameterized into normalized bulk material densities. The objective function and constraint are the thermal compliance of structures and allowable material volume, respectively. Through several numerical examples, the developed DSA method is verified to yield very accurate sensitivity results compared with finite difference ones, requiring less than 0.3% of CPU time far the finite differencing. Also, the topology optimization yields physical meaningful results.

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Topology Design Optimization of Three Dimensional Structures for Heat Conduction Problems (열전도 문제에 대한 3 차원 구조물의 위상 최적설계)

  • Moon Se-Joon;Cho Seon-Ho
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2005.04a
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    • pp.327-334
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    • 2005
  • In this paper, using an adjoint variable method, we develop a design sensitivity analysis (DSA) method applicable to 3-Dimensional heat conduction problems in steady state. Also, a topology design optimization method is developed using the developed DSA method. Design sensitivity expressions with respect to the thermal conductivity are derived. Since the already factorized system matrix is utilized to obtain the adjoint solution, the cost for the sensitivity computation is trivial. For the topology design optimization, the design variables are parameterized into normalized bulk material densities. The objective function and constraint are the thermal compliance of structures and allowable material volume, respectively, Through several numerical examples, the developed DSA method is verified to yield efficiency and accurate sensitivity results compared with finite difference ones. Also, the topology optimization yields physical meaningful results.

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