• Resources Recycling
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• v.12 no.4
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• pp.44-50
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• 2003

Separation of mixed plastics is not a simple task due to similarities of specific gravity and limitations of sizes, etc. In this study, a new technique was developed to separate plastics selectively by a thermal adhesion method using the different softening or melting temperatures of various types of plastics. Tests were conducted to investigate softening or melting temperatures and adhesion probabilities of plastics with change in temperature. Tests also were conducted to analyze the operating variables, including contact times, size and color pigment. It was founded that LDPE, HDPE and PVC, PET, etc among mixed plastics could be separated selectively according to the change of temperature.

• Journal of Sensor Science and Technology
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• v.23 no.4
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• pp.234-237
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• 2014

In this paper, a copper foil-thick grapheme (thin graphite sheet)-copper foil structure is reported to achieve mechanically strong and high thermal conductive layer suitable for heat spreading components. Since graphene provides much higher thermal conductivity than copper, thick graphene embedded copper layer can achieve higher effective thermal conductivity which is proportional to graphene/copper thickness ratio. Since copper is nonreactive with carbon material which is graphene, chromium is used as adhesion layer to achieve copper-thick graphene-copper bonding for graphene embedded copper layer. Both sides of thick graphene were coated with chromium as an adhesion layer followed by copper by sputtering. The copper foil was bonded to sputtered copper layer on thick graphene. Angstrom's method was used to measure the thermal conductivity of fabricated copper-thick graphene-copper structure. The thermal conductivity of the copper-thick graphene-copper structures is measured as $686W/m{\cdot}K$ which is 1.6 times higher than thermal conductivity of pure copper.

• Korean Journal of Materials Research
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• v.26 no.10
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• pp.542-548
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• 2016

The influence of NiCrAlY bond coating on the adhesion properties of an Fe thermal coating sprayed on an Al substrate was investigated. By applying a bond coat, an adhesion strength of 21MPa was obtained, which was higher than the 15.5MPa strength of the coating without the bond coat. Formation of cracks at the interface of the bond coat and the Al substrate was suppressed by applying the bond coat. Microstructural analysis of the coating interface using EBSD and TEM indicated that the dominant bonding mechanism was mechanical interlocking. Mechanical interlocking without crack defects in the coating interface may improve the adhesion strength of the coating. In conclusion, the use of an NiCrAlY bond coat is an effective method of improving the adhesion properties of thermal sprayed Fe coatings on Al substrates.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.45-50
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• 2014

Effects of wet chemical treatment and thermal cycle conditions on the quantitative interfacial adhesion energy of $Cu/SiN_x$ thin film interfaces were evaluated by 4-point bending test method. The test samples were cleaned by chemical treatment after Cu chemical-mechanical polishing (CMP). The thermal cycle test between Cu and $SiN_x$ capping layer was experimented at the temperature, -45 to $175^{\circ}C$ for 250 cycles. The measured interfacial adhesion energy increased from 10.57 to $14.87J/m^2$ after surface chemical treatment. After 250 thermal cycles, the interfacial adhesion energy decreased to $5.64J/m^2$ and $7.34J/m^2$ for without chemical treatment and with chemical treatment, respectively. The delaminated interfaces were confirmed as $Cu/SiN_x$ interface by using the scanning electron microscope and energy dispersive spectroscopy. From X-ray photoelectron spectroscopy analysis results, the relative Cu oxide amounts between $SiN_x$ and Cu decreased by chemical treatment and increased after thermal cycle. The thermal stress due to the mismatch of thermal expansion coefficient during thermal cycle seemed to weaken the $Cu/SiN_x$ interface adhesion, which led to increased CuO amounts at Cu film surface.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.229-229
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• 2012

Adhesion of Copper film on the aluminum oxide layer formed by anodizing an aluminum plate was enhanced by applying ion beam mixing method. Forming an conductive metal layer on the insulating oxide surface without using adhesive epoxy bonds provide metal-PCB(Printed Circuit Board) better thermal conductivities, which are crucial for high power electric device working condition. IBM (Ion beam mixing) process consists of 3 steps; a preliminary deposition of an film, ion beam bombardment, and additional deposition of film with a proper thickness for the application. For the deposition of the films, e-beam evaporation method was used and 70 KeV N-ions were applied for the ion beam bombardment in this work. Adhesions of the interfaces measured by the adhesive tape test and the pull-off test showed an enhancement with the aid of IBM and the adhesion of the ion-beam-mixed films were commercially acceptable. The mixing feature of the atoms near the interface was studied by scanning electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy.

• Journal of Ocean Engineering and Technology
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• v.13 no.1 s.31
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• pp.62-69
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• 1999

67Ni-22Cr-10Al-1Y and $ZrO_2-8Y_2O_3$ were coated on the substrate surface of ST304 and Al2024 by the plasma spraying method. The adgesion of the films varies depending on the substrates and the laminating method. In the case of STS304, the cracks were observed at thermal shock temperature difference ${Delta}T$ of $900^{circ}C$ in the non functionally gradient material(NFGM) and at $1100^{circ}C$ in the functionally gradient material(FGM). The film adhesion of the FGM is better than that of the NFGM in ST304. The cumulative AE count of the FGM of STS304 increased continuously at the bending test. But the NFGM of STS304 showed discontinuity of the AE count. The total AE count for the FGM of STS304 decreased as the number of thermal shock increased, and this tendency was evident as the thermal shock temperature difference increased.

• Journal of Adhesion and Interface
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• v.6 no.4
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• pp.12-17
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• 2005

Natural fiber/phenolic biocomposites with chopped henequen fibers treated at various levels of electron beam irradiation (EBI) were made by means of a matched-die compression molding method. The interfacial property was explored in terms of interfacial shear strength measured by a single fiber microbonding test. The thermal properties were studied in terms of storage modulus, tan ${\delta}$, thermal expansion and thermal stability measured by dynamic mechanical analysis, thermomechanical analysis and thermogravimetric analysis, respectively. The result showed that the interfacial and thermal properties depend on the treatment level of EBI done to the henequen fiber surfaces. The present result also demonstrates that 10 kGy EBI is most preferable to physically modify the henequen fiber surfaces and then to improve the interfacial property of the biocomposite, supporting earlier results studied with henequen/poly (butylene succinate) and henequen/unsaturated polyester biocomposites.

• Journal of the Korean Wood Science and Technology
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• v.32 no.5
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• pp.29-38
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• 2004

In this study, we investigated the thermal properties of corn-starch filled polybutylene succinate-adipate (PBS-AD) bio-composites. Thermal analysis (TA) is used to describe the analytical method for measuring the chemical property and weight loss of composite materials as a function of temperature. The thermal stability of corn-starch was lower than that of pure PBS-AD. As corn-starch loading increased, the thermal stability and degradation temperature of the bio-composites decreased and the ash content increased. It can be seen that the degree of compatibility and interfacial adhesion of the bio-composites decreased because of the increasing mixing ratio of the corn-starch. As the content of corn-starch increased, there was no significant change in the glass transition temperature (T_g) and the melting temperature (T_m) for the bio-composites. The storage modulus (E') and loss modulus (E") of the corn-starch flour filled PBS-AD bio-composites were higher than those of PBS-AD, because of the incorporation of corn-starch increased the stiffness of the bio-composites. At higher temperatures, the decreased storage modulus (E') of bio-composites was due to the increased polymer chain mobility of the matrix polymer. From these results, we can expect that corn-starch has potential as a reinforcing filler for bio-composites. Furthermore, we recommend using a coupling agent to improve the interfacial adhesion between corn-starch and biodegradable polymer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.