• Transactions of Materials Processing
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• v.28 no.5
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• pp.247-256
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• 2019

In this study, the development of annealing textures in cold rolled and annealed tantalum sheets was analyzed using electron backscatter diffraction. At $900^{\circ}C$, the textures of the recrystallized grains in the partially and completely recrystallized microstructures displayed significant similarities. The average diameter of the recrystallized grains with ${\gamma}-fiber$ orientations exceeded that of grains with different orientations, and the average growth rates were unrelated to the orientations after an initial stage of recrystallization. Additional cold rolling and annealing was done for controlled initial microstructures and textures inherited from various processes of prior cold rolling and annealing. This second cycle of the process resulted in stronger textures with major ${\gamma}-fiber$ orientations as a result of the enhanced ${\gamma}-fiber$ orientations in the preceding textures. A coarse-grained prior microstructure resulted in a weaker annealing texture than a fine grained one regardless of the stronger previous texture, which was occasioned by the sub-structures of the minor orientations at local deformation inhomogeneities such as sharp in-grain shear bands.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.68-71
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• 2003

We fabricated Ni-substrate for YBCO coated conductors and evaluated the effects of pressing and annealing time on texture. Ni substrate was fabricated by powder metallurgy technique and compacts were prepared by applying uniaxial or isostatic pressure. The texture of substrate made by applying cold isostatic pressure (CIP) was stronger than that by uniaxial pressure. The texture of substrate made by CIP had a strong 4-fold symmetry and [111] ∥ ND texture after annealing temperature of 100$0^{\circ}C$. It is to be noted that the degree of texture was almost independent of annealing time and the full-width at half-maximum (FWHM) of in-plane and out-of-plane was measured to be in the range of 9.55$^{\circ}$-10.53$^{\circ}$ and 8.57$^{\circ}$-9.85$^{\circ}$, respectively. Development of strong cube texture of Ni-substrate made by powder metallurgy technique in our study is considered to be suitable for the application of YBCO coated conductors.

• Korean Journal of Metals and Materials
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• v.56 no.12
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• pp.861-869
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• 2018

To determine the origin of the inhomogeneous microstructure and texture observed in drawn and annealed high purity copper wires, two kinds of drawing process conditions and their influence was investigated. The regular condition, based on a symmetric die, and a condition designed intentionally to produce an inhomogeneous shear deformation using an asymmetric die were employed. The difference in intensity of <111>-<100> distributed texture between the two wires confirmed that the wire drawn under the asymmetric die condition experienced a higher amount of shear deformation. The extensive shear strain in the wire drawn under the asymmetric die condition gave rise to inhomogeneous primary and secondary recrystallization behavior. After annealing at $200^{\circ}C$, grains with <100> texture, which were larger than the surrounding recrystallized grains, were extensively present on one half circle of the wire drawn under the asymmetric die condition, while larger grains with <100> were sparsely observed around the middle region of the wire drawn under the regular condition. Interestingly, the area where the larger grains with <100> texture existed was identical to the area where the high shear strain occurred during drawing in both wires. During annealing at $400^{\circ}C$, grains with <112> texture started to grow abnormally at the center of both wires as a result of secondary recrystallization. After annealing at $900^{\circ}C$ grains with <112> due to secondary recrystallization occupied the entire region of the wire drawn under the regular condition. On the other hand, in the wire drawn under the asymmetric die condition and then annealed at $900^{\circ}C$, the <100> oriented grains as a result of the normal grain growth of the larger <100> grains which were observed after annealing at $200^{\circ}C$, coexisted with the abnormally grown <112> grains. These results indicate that dynamic recrystallization induced by the shear strain during drawing plays an important role in the inhomogeneity of the microstructure and texture of wires after annealing.

• Transactions of Materials Processing
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• v.9 no.2
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• pp.193-202
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• 2000

The influence of rolling draughts on the formation of through-thickness textures in aluminum 5000X sheet was investigated by X-ray texture measurements and microstructure observations. In order to intensify the deformation inhomogeneities, cold rolling was performed without lubrication. Applying a large draught gave rise to the formation of the shear texture at the surface, whereas a normal plane strain testure formed at the surface after deformation with a small draught. The orientation density along the $\beta$-fiber orientations which developed in the center layer of the rolled specimen was also dependent on the strain gradients in a roll gap. Upon annealing, the deformed substructure of sample surfaces was transformed into a fine grained recrystallized microsturcture through extended recovery reaction. However, coarse grains developed after the discontinuous recrystallization which gave rise to the development of the Cube-texture.

• Korean Journal of Metals and Materials
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• v.46 no.7
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• pp.420-426
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• 2008

By using electrodeposition, we developed a new method to produce Ni/Invar bimetal sheets, which have been used for the present study to investigate the texture evolution during annealing. The grains of electrodeposited Ni were columnar, while those of electrodeposited Fe-Ni alloy were nanocrystalline. These different parts of the bimetal underwent different evolution of textures and microstructures during annealing. In the nanocrystalline Invar, the as-deposited textures were of fiber-type characterized by strong <100>//ND and weak <111>//ND components, and the occurrence of grain growth resulted in the strong development of the <111>//ND fiber texture with the minor <100> // ND components. On the other hand, in the columnar-structured Ni part, the as-deposited <110>//ND fiber texture transformed to the <112>//ND fiber texture due to recrystallization occurring above $550^{\circ}C$. The development of microtextures which took place during annealing in the Ni/Invar interfacial regions was investigated by using the OIM analysis, and discussed in terms of the effect of atomic diffusion across the interfaces.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.181-183
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• 2002

A new deformation process termed "continuouis confined sup shearing" (CCSS) has been developed for shear deformation of metallic sheets. The tools of CCSS were designed to provide a constant shear deformation of the order of 0.5 per pass while preserving the original sheet shape. In order to clarify the evolution of texture and microstructure during CCSS, strips of the aluminum alloy AA3004 were deformed by CCSS in up to three passes. FEM results indicated that CCSS provides a quite uniform shear deformation at thickness layers close to the strip center, although the deformation is not homogeneous in the die channel, in particular at the surface layers. The rolling texture of the initial sheet decreased during CCSS, and preferred orientations along two fibers developed. However, with an increasing number of CCSS passes the deformation texture did not develop futher. The evolution of annealing textures depended on the number of CCSS passes. A strong {112}<110> component in the deformation texture led to the formation of a strong {111}<112) orientation in the annealing texture. Observations by TEM and EBSD revealed the formation of very fine grains of ∼1.0$\mu\textrm{m}$ after CCSS.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.90-96
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• 2000

The effects of the type and thickness of underlayers on the crystallographic texture and the sheet resistance of aluminum thin films were studied. Sputtered Ti and Ti/TiN were examined as the underlayer of the aluminum films. The texture and the sheet resistance of the metal thin film stacks were investigated at various thicknesses of Ti or TiN, and the sheet resistance was measured after annealing at $400^{\circ}C$ in an nitrogen ambient. For the Ti underlayer, the minimum thickness to obtain excellent texture of aluminum <111> was 10nm, and the sheet resistance of the metal stack was greatly increased after annealing due to the interdiffusion and reaction of Al and Ti. TiN between Ti and Al could suppress the Al-Ti reaction, while it deteriorated the texture of the aluminum film. For the Ti/TiN underlayer, the minimum Ti thickness to obtain excellent texture of aluminum <111> was 20nm, and the minimum thickness of TiN to function as a diffusion barrier between Ti and Al was 20nm.

• Journal of the Korean Society for Heat Treatment
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• v.21 no.3
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• pp.144-149
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• 2008

It has been reported that copper and copper alloys have a large anisotropy of functional properties such as electrical, thermal and mechanical properties, which means that the texture of polycrystalline alloy should be considered to achieve better properties. In this study, the determination of grain growth orientation and texture formation in the cold-rolled, heat-treated and Ni-plated hybrid copper sheets was investigated. Grain growth direction and texture formation were analyzed by the X-ray pole figure. The influence of texture on the mechanical properties could be quantitatively confirmed by the results from the orientation distribution function and the tensile test. The heat-treated texture in the cold-rolled hybrid copper sheet is also investigated and discussed.

• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.320-326
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• 2000

Development of texture in SiC materials by hot-pressing and subsequent annealing was studied. Crystallographic texture type was characterized by measuring X-ray pole figures on the perpendicular plane to the hot-pressing direction. Observed all pole figures were nearly axially symmetric (fiber texture). In case of ${\beta}$-SiC materials, the pole density of basal plane (0004) increased as annealing time increased, in contrast, other planes (hkil) of ${\beta}$-SiC materials and all planes of ${\alpha}$-SiC materials nearly remained unchanged. In the case of ${\beta}$-SiC materials, therefore, a weak texture of (0001) plane at the normal direction took place in the 8h annealed samples, resulting from grian growth. The fracture toughness values of ${\alpha}$-SiC materials measured in both planes parallel and perpendicular to the hot-pressing direction were very similar. However, the fracture toughness of ${\beta}$-SiC materials measured parallel to the hot-pressing direction were higher than that measured perpendicular to the hot-pressing derection, relatively, because of the texture and the microstructure anisotropy.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.138-140
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• 2002

We fabricated textured Ni substrate for YBCO coated film and evaluated the degree of texture in terms of rolling condition and annealing time. The substrate was compacted from pure Ni powder and reduced the thickness to 100 $\mu$m by rolling followed by heat treatment. As decreasing the thickness of substrate, it was observed that the non-uniform deformation such as ‘wave edge’ or ‘wave buckle’ developed locally on it, causing reduced texture. On the other hand, uniformly deformed substrate showed better cube texture indicating the FWHM of in-plane and out-of-plane of about $11^{\circ}$ ~ $14^{\circ}$. In addition, annealing at $1000^{\circ}C$ for 1~ 8 hr did not make a remarkable difference on the texture.