• Journal of information and communication convergence engineering
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• v.7 no.2
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• pp.215-218
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• 2009

In this paper, temperature stable current and voltage references using simple CMOS bias circuit are proposed. To obtain temperature stable characteristics of bias circuit a bandgap reference concept is used in a conventional circuit. The parasitic bipolar transistors or MOS transistors having different threshold voltage are required in a bandgap reference. Thereby the chip area increase or the extra CMOS process is required compared to a standard CMOS process. The proposed reference circuit can be integrated on a single chip by a standard CMOS process without the extra CMOS process. From the simulation results, the reference current variation is less than ${\pm}$0.44% over a temperature range from - $20^{\circ}C$ to $80^{\circ}C$. And the voltage variation is from - 0.02% to 0.1%.

• YAKHAK HOEJI
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• v.43 no.6
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• pp.793-797
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• 1999

Salmonella typhi Ty21a is an attenuated strain of S. typhimurium and used for oral typhoid vaccine. In an attempt to increase the stability of Ty21a manufacturing typhoid vaccine, we studied about the stability of freeze-dried Th21a including additives at various temperature conditions. In order to investigate the freeze-drying rate of Ty21a according to various absorbance, we lyophilized Ty21a by using 8% sucrose as a stabilizer. The optimal freeze-drying rate of Ty21a was appeared when OD (optical density) value of the growth was between 2.5 and 3.0. To investigate the stability of Ty21a at various temperature, the viability was measured after storaging the freeze-dried Ty21a at the room temperature, cold and freezing condition for 1 week. The viability of Ty21a in cold and freezing storage condition was 5 times more stable than in room temperature. To search the most stable additives for the freeze-dried Ty21a, the viability of Ty21a including additives at the various storage condition was estimated. Mannitol and loctose were the most stable additives. Theses results suggest that the OD value of Ty21a growth, low temperature, mannitol and lactose are important factors for the optimal freeze-drying rate, the stable storage and the most stable additives, respectively.

• Journal of Korean Society on Water Environment
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• v.27 no.4
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• pp.438-444
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• 2011

Magnesium is one of the abundant natural resources in the earth crust and seawater, which is directly related to various organisms activities interconnecting with water-rock system. In aqueous system, magnesium is known to predominantly exist in the form of $Mg^{2+}$ ion which is verified in its $E_h-pH$ diagram. When it is at equilibrium in aqueous system, temperature takes an essential role to complete equilibrium states. This study represents the change of the stable region of magnesium ion according to temperature, and how the consequences would affect aquatic organisms. It was revealed that there is a noticeable tendency shrinking the stable region of magnesium ion in a diagram as temperature increases, and as a result, aquatic bio-species presumably have difficulties to absorb the nutrient. Also, it was considered that the water system would be acidified by decreasing alkalinity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.169-172
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• 2004

The effect of the process parameters on the stable lifetime in rapid thermal firing(RTF) was investigated in order to optimize the process for the Cz-silicon. The process temperature was varied between $700^{\circ}C\;and\;950^{\circ}C$ while the process time was chosen 1 s and 10 s. At below $850^{\circ}C$ the stable lifetime for 10 s is higher than that for 1 s and increases with increasing by the process temperature. However, at over $850^{\circ}C$ the improved stable lifetime is not dependent on the process time and temperature. On the other hand, two high temperature processes in solar cell fabrics are combined with the optimized process and the non-optimized process. The last process determines the stable lifetime. Also, the degraded stable lifetime could be increased by processing in optimized process. The decreased lifetime can increase using the optimized oxidation process, which is a final process in solar cells. Finally, the optimized and non-optimized processes are applied solar cells.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1757-1760
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• 2007

Moving a droplet by electrowetting is the basis of our novel displays. This enables mechanical bistable and high reflective monochrome as well as color systems. Since no high temperature process is required, plastic substrates can be used. Our prototypes show promising performance in terms of a wide temperature range, contrast ratio and color.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.611-614
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• 2005

In this paper, investigated is the relationship between the formation temperature and the thermal stability of Ni silicide formed with Ni-V (Nickel Vanadium) alloy target. The sheet resistance after the formation of Ni silicide with the Ni-V showed stable characteristic up to RTP temperature of $700\;^{\circ}C$ while degradation of sheet resistance started at that temperature in case of pure-Ni. Moreover, the Ni silicide with Ni-V indicated more thermally stable characteristic after the post-silicidation annealing. It is further found that the thermal robustness of Ni silicide with Ni-V was highly dependent on the formation temperature. With the increased silicidation temperature (around $700\;^{\circ}C$), the more thermally stable Ni silicide was formed than that of low temperature case using the Ni-V.

• Journal of information and communication convergence engineering
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• v.8 no.2
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• pp.197-200
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• 2010

The FLL(frequency locked loop) circuit is used to generate an output signal that tracks an input reference signal. The locking time of FLL is short compared to PLL(phase locked loop) circuit because the output signal of FLL is synchronized only in frequency. Also the FLL is designed to allow the circuit to be fully integrated. In this paper, the temperature stable FLL circuit is designed by using full CMOS transistors. When the temperature is varied from $-20^{\circ}C$ to $70^{\circ}C$, the variation of output frequency is about from -2% to 1.6% from HSPICE simulation results.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2001.10a
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• pp.264-268
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• 2001

In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature, low temperature and high temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room, and high temperature at $25^{\circ}C,\; 50^{\circ}C, \;100^{\circ}C,\; 150^{\circ}C,\; and\; 180^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range $\DeltaK_{th}$ in the early stage of fatigue crack growth (Region I ) and stress intensity factor range $\Delta$K in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• Journal of Ocean Engineering and Technology
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• v.16 no.5
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• pp.80-87
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• 2002

In this study, CT specimens were prepared from spring steel(SUP9) which was used in suspension of automobile for room temperature and low temperature service. We got the following characteristics from fatigue crack growth test carried out in the environment of room temperature and low temperature at $25^{\circ}C$, ­3$0^{\circ}C$, ­5$0^{\circ}C$, ­7$0^{\circ}C$ and ­10$0^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I) and stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It is assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.83-90
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• 2004

In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature and low temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room temperature and low temperature at $25^{\circ}C$, $-30^{\circ}C$, $-50^{\circ}C$, $-70^{\circ}C$,$-100^{\circ}C$, and $-150^{\circ}C$, in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range ΔKth in the early stage of fatigue crack growth (Region I)was increased but stress intensity factor range ΔK in the stable of fatigue crack growth (Region II) was decreased in proportion to decrease temperature. It is assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerably higher than that of room temperature in the early stage and stable of fatigue crack growth region.