• Title/Summary/Keyword: temperature reliability

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Measuring System for Evaluating Sensing Reliability of Infrared Temperature Sensors

  • 박준혁;이민철;부광석
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.169-173
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    • 1997
  • In this paper, auto measuring system for evaluating sensing reliability of infrared temperature sensors is developed. A developed system is composed of temperature controller, measuring sysytem and operating S/W. A constant temperature control of a chamber is accomplished by multi-heater using PI control. It is shown that the control resulte of temperature are well followed to the desired temperature value. The developed untegrated measuring system will increase reliability and productivity of products.

Analysis for luminescence property about an increase quantity of silicate phosphor and reliability (Silicate 형광체 증가에 대한 발광 특성 및 신뢰성 분석)

  • Yoon, Yanggi;Jang, Joongsoon
    • Journal of Applied Reliability
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    • v.12 no.4
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    • pp.275-285
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    • 2012
  • This paper presents a changes of luminescence property for converted white LEDs with the commercially available silicate phosphor. If silicate phosphor's quantity increase step by step. luminescence property will be changing. we analyze luminescence property for these change and carry out the high temperature aging test for 7,000 hours, the high temperature and humidity aging test for 7,000 hours for reliability. LED degradation not only results in reduced light output but also in color changes. so we monitor correlated color temperature (CCT), chromaticity coordinates(x, y) and spectrum intensity. Those results suggest that humidity factor more bad effect in color changes than temperature factor and Lighting quality is related with quantity of phosphor.

Reliability Assessment of Temperature Indicator for Simplified Measurement on Conservation Environment of Cultural Heritage (문화재 보존환경 간이 측정을 위한 온도지시카드 신뢰성 평가)

  • Lim, Bo-A;Shin, Eun-Jeong;Lee, Sun-Myung
    • 보존과학연구
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    • s.31
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    • pp.59-68
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    • 2010
  • Cultural heritages are damaged by surrounding several environmental factors. Main factors are temperature, humidity, light, atmosphere and indoor pollutant, organism, etc. Therefore, to prevent damage of cultural heritage from such environmental factor, conservation environment monitoring becomes more important. Indicator is one of the simple method for environment monitoring. It can be used without expensive and complex equipments. However, it should be performed scientific examination for application to cultural heritage. In this study, some Temperature Indicators were chosen and reliability assessment was carried out for application to cultural heritage. Brightness($L^*$) is selected for reliability assessment factor. As a result of lab test, Temperature Indicators were not influenced greatly in humidity change. When they were exposed to setting temperature, the color was changed in setting temperature area and ${\pm}2^{\circ}C$ part of setting temperature. Especially brightness value was high in setting temperature area. Also, Temperature Indicators were stabilized after about 16 minutes when were exposed to temperature difference of $10^{\circ}C$ and when temperature difference with exposure environment is smaller, stabilization time shortened. Therefore, it is a possible to confirm that selected Temperature Indicator is reliable product through measurement of color difference value and naked eye observation.

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A Study on the Accelerated Life Test for Evaluating the Reliability of Nickel-Cadmium Batteries

  • Kwon, Soo-Ho;Huh, Yang-Hyun;Lim, Tae-Jin
    • International Journal of Reliability and Applications
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    • v.1 no.1
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    • pp.89-104
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    • 2000
  • Accelerated testing consists of a variety of test methods for shortening the life of products or hastening the degradation of their performance. This paper presents practical, modern statistical methods for evaluating the reliability of Nickel-Cadmium batteries at their design temperature of 2$0^{\circ}C$ by accelerated life test. Batteries have been life tested at three high temperature conditions, 50, 60, 7$0^{\circ}C$, respectively to yield failures quickly. The failures have been observed and judged by means of charge and discharge current integration. Analyses of life data from those conditions resulted in the Weibull distribution, which has been verified on the ground of the Kolmogorov-smirnov test and the pairwise t-test. Life data are modeled according to the Arrhenius life-temperature relationship. The mean life of tested batteries is assessed at about 590 cycles, and the activation energy of this chemical reaction is concluded to be 0.39eV as results. This study provides procedures for estimating the reliability of batteries in a short period, which has little been possible in domestic industries. The results can be applied in many fields such as proof testing, acceptance testing, and estimating assurance periods.

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High Temperature Reliability Study of Low Frequency In-door Electrodeless Lamp (무전극형광램프의 고온 신뢰성 연구)

  • Jeong, Ui-Hyo;Hyung, Jae-Phil;Lim, Seong-Yong;Lim, Hong-Woo;Jang, Joong-Soon
    • Journal of Applied Reliability
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    • v.14 no.3
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    • pp.203-207
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    • 2014
  • Electrodeless lamp is famous for its long life. But its reliability is dependent not only on electrodes but also on materials and structures. To evaluate end product's reliability, we studied high temperature durability by $60^{\circ}C$, $75^{\circ}C$ and $90^{\circ}C$ temperature tests, and predicted failure times by an exponential model through regression analysis. However, the test showed that temperature does not affect degradation of electrodeless lamps. Their luminous outputs degrade during the early time of the test (till 250 hours) and then converge to a saturation points. Also, '410nm ~ 530nm' spectrum degrades more than other spectra.

A quantitative approach for reliability growth of electronics units (전자장비 신뢰도 향상을 위한 정량적 접근 연구)

  • Kim, Joo-Nyun;Kim, Bo-Gwan
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.35 no.3
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    • pp.268-274
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    • 2007
  • In general, rocket or satellite circuit designers focus on reducing temperature of electronic devices in order to enhance electronic unit's reliability. This paper describes the quantitative analysis result of activation energy as well as device temperature effects to the system reliabilities. The quantitative analysis result shows that activation energy of device has more effects on system reliability than temperature does. And this paper suggests a strategy for enhancement of reliability during devices placement on PCB with simulation results.

A Study of the Life Characteristic of Hydraulic Hose Assembly by Adopting Temperature-Nonthermal Acceleration Model (온도.비열 가속모형을 적용한 유압호스조립체 수명특성 연구)

  • Lee, Gi-Chun;Kim, Hyoung-Eui;Cho, You-Hee;Sim, Sung-Bo;Kim, Jae-Hoon
    • Journal of Applied Reliability
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    • v.11 no.3
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    • pp.235-244
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    • 2011
  • Hydraulic hose assemblies deliver a fluid power in various oil pressure equipment such as construction machinery, automobile, aircraft, industrial machinery, machine tools and machinery for ships. Also, they are widely used as pipes in oil pressure circuit. When we estimate their lifetime, it is essential to conduct an accelerated life test by choosing the factor that suits the usage condition of the test object since traditional test method for estimating lifetime under the influence of various external factors incurs hardship in terms of time and expenses. The objective of this study is to propose an acceleration model that takes both temperature and pressure without flexing condition into consideration. The lifetime is estimated by applying the proposed temperature-nonthermal acceleration model to the test data. And we compare the proposed temperature-nonthermal acceleration model and the accelerated life equation suggested by John(1994).

Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package (실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험)

  • Kim, Young-Pil;Ko, Seok-Cheol
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.29 no.4
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    • pp.1-10
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    • 2015
  • The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

Comparative Reliability Analysis of DC-link Capacitor of 3-Level NPC Inverter Considering Mission-Profiles of PV Systems (태양광 시스템의 미션 프로파일 고려한 3-레벨 NPC 인버터의 DC-link 커패시터 신뢰성 비교 분석)

  • Jae-Heon, Choi;Ui-Min, Choi
    • The Transactions of the Korean Institute of Power Electronics
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    • v.27 no.6
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    • pp.535-540
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    • 2022
  • DC-link capacitors are reliability-critical components in a photovoltaic (PV) inverter. Typically, the lifetime of a DC-link capacitor is evaluated by considering the voltage and hot-spot temperature of the capacitor under the specific operating condition of the PV inverter. However, the output of the PV inverter is determined by solar irradiation and ambient temperature, which vary with the seasons; accordingly, the hot-spot temperature of the capacitor also changes. Therefore, the mission profile of the PV system should be considered to effectively evaluate the reliability of the DC-link capacitor. In this study, the reliability of the DC-link capacitor of a three-level NPC inverter is comparatively analyzed with and without considering the mission profiles of the PV system, where two mission profiles recorded in Arizona and Iza are considered. The accumulated damage of the DC-link capacitor is calculated based on the lifetime model by analyzing its thermal loading. Afterward, a reliability evaluation of the DC-link capacitor is performed at the component level and then at the system level by considering all capacitors by means of Monte Carlo analysis. Results reveal the importance of performing a mission-profile-based reliability evaluation during the design of high-reliability PV inverters to achieve the target reliability performance.

Lifetime Estimation of a Bluetooth Module using Accelerated Life Testing (가속수명시험을 이용한 블루투스 모듈의 수명 예측)

  • Son, Young-Kap;Chang, Seog-Weon;Kim, Jae-Jung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.55-61
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    • 2008
  • This paper shows quantitative reliability evaluations of a Bluetooth module through extending previous qualitative methods limited to structure reliability tests and solder joint reliability tests for Bluetooth modules. Accelerated Life Testing (ALT) of the modules using temperature difference in temperature cycling as an accelerated stress was conducted for quantitative reliability evaluation under field environment conditions. Lifetime distribution parameters were estimated using the failure times obtained through the ALT, and then Coffin-Manson model was implemented. Results of the ALT showed that the failure mode of the modules was open and the failure mechanisms are both crack and delamination. The ALT reproduced the failure mode and mechanisms of failed Bluetooth modules collected from the field. Further, a quantitative reliability evaluation method with respect to various temperature differences in temperature cycling was proposed in this paper. $B_{10}$ lifetime of the module for the temperature difference $70^{\circ}C$ using the proposed method would be estimated as about 4 years.

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