• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Journal of the Korean Data and Information Science Society
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• v.28 no.6
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• pp.1437-1445
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• 2017

This paper suggests a temperature guidance which must be addressed in the preparation of specifications for military equipment used in ocean/coastal environment of the Korean peninsula. It would often be costly to design materiel to operate under the most extreme environmental conditions ever recorded. Therefore, military planners usually accept equipments designed to operate under environmental stresses for all the time except a certain small percentage of the time. In this study, an 1-percent frequency of occurrence is recommended. Pohang and Shineiju are chosen to represent the hottest and coldest regions, respectively, based on surface weather observations among 28 costal regions from 1904 to 2015. The 1st and 99th percentile temperatures for Pohang and Shineiju are $37.7^{\circ}C$ and $-23.7^{\circ}C$, respectively. Diurnal cycles, including solar radiation, relative humidity and wind-speed are also provided.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1703-1706
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• 1996

The purpose of this study is to research and develop polypyrrole(PPy) positive for thin film rechargeable lithium battery. We investigated cyclic voltammetry, AC impedance response and charge/discharge cycling of PPy/SPE/Li cells as a function of temperature. The redox capacity of $PPy/CF_{3}SO_{3}$ film was the most large. The discharge capacity of PPy/SPE/Li cell with $PPy/CF_{3}SO_{3}$ film was higher than those of $PPy/ClO_{4}$ and $PPy/AsF_6$ films at all cycles. The energy density of PPy/SPE/Li cells during 1st cycle was 73, 90 and 101Wh/kg at $25^{\circ}C$, $45^{\circ}C$ and $60^{\circ}C$, respectively. The improvement of energy density is due to reduction of charge-transfer resistance associated doping-undoping process in PPy film with Increasing temperature. $PPy/CF_{3}SO_{3}$ film shows a good property on charge/discharge cycling in PEO-$LiClO_4$-PC-EC electrolyte.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.1-10
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• 2020

This study deals with the fabrication and thermal characterization of planar heating elements attached to the backside of the reflector used in the electrodeless lamp of a freezer. We tried to solve the problem of the local heat generation of the linear heating element that occurs about 50℃. The homogeneous dispersion and manufacturing excellence of the planar heating element produced were confirmed through SEM and EDS. In addition, the test specimens was prepared according to the change in the ratio of carbon fiber to the basis weight of the planar heating element, and a sample having a basis weight of 50g/㎡ having a content ratio of carbon fiber of 70% was selected. That sample showed low surface resistance of 4.3Ω/sq and high temperature of about 81℃ at 6V. Durability was confirmed by performing repeated bending evaluation of 3000 cycles for the sample. Large area test specimens were prepared to be applied to the actual reflector, insulated by EVA film and analyzed for their thermal characteristics. From 13V application, the temperature of the linear heating element was higher than 50℃ and the average temperature of 68℃ was maximum at 18V.

• Asian-Australasian Journal of Animal Sciences
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• v.17 no.12
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• pp.1758-1763
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• 2004

This study was carried out to investigate gel forming and degradation properties (suwari and modori phenomena) of chicken surimi from mechanically deboned chicken meat (MDCM) at various setting temperatures and time. Chicken surimi was manufactured by a continuous process including chopping of MDCM, washing with 5% NaCl solution or pure water, standing, straining and centrifuging etc. Total process of washing for the MDCM from chopping to centrifuging was repeated over 3 cycles. Gel from prepared surimi were formed at $90^{\circ}C$ for 30 min after various setting treatments. The textural properties of gels were measured at the temperature ranges of low (10$^{\circ}C$), medium (25$^{\circ}C$ and $30^{\circ}C$) and high (45 to 70$^{\circ}C$). The compressive force (CF), hardness and fracturability of surimi gel at 10$^{\circ}C$ increased as setting time increased, and showed the highest value at 30 h of setting time. The CF and hardness of chicken surimi gel at 25$^{\circ}C$ and 30$^{\circ}C$ showed the highest values at 10 h of setting time. Most of gel strengths including CF, and texture profile analysis (TPA) values showed the highest levels in the range 47.5 to 52.5$^{\circ}C$ (p<0.05). The gel strength at 60$^{\circ}C$ increased slightly at 30 min, but then continued to decrease with longer setting times. There was no increase of gel strength at $70^{\circ}C$, but only a continuous decrease over setting time. In conclusion, suwari (gel setting) and modori (gel degradation) phenomena occur during the gel formation of surimi from MDCM. The temperature range in chicken surimi was 47.5 to 52.5$^{\circ}C$ for suwari and 60 to 70$^{\circ}C$ for modori.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.2
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• pp.182-188
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• 2011

In this paper, analysis on the performance characteristics of R744-R404A cascade refrigeration system is presented to offer the basic design data for the operating parameters of the system. The operating parameters considered in this study include subcooling and superheating degree, compressor efficiency, and condensing and evaporating temperature in R404A high- and R744 low-temperature cycle, respectively. The main results were summarized as follows : It was observed that the highest COP of the system is achieved by higher superheating degree in R744 cycle than that in R404A cycle. The COP of the system increased by giving the subcooling degree in both cycles. The COP of the cascade system is the highest value when the system is operated at an optimum evaporation temperature.

• Explosives and Blasting
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• v.29 no.1
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• pp.34-40
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• 2011

In this study, effects that thermal stress and water pressure have on the deformation behaviour of granite specimens recovered in Gagok Mine are estimated. To analyze effects of the thermal stress and water pressure on the deformation behaviour, granite specimens were preheated with cycles of predetermined temperatures ranging $200^{\circ}C$ to $700^{\circ}C$ and 500, 600, $700^{\circ}C$ specimens were pressurized to 7.5 MPa. The deformation behaviour of the specimens had been studied by performing uniaxial compressive tests. Axial and lateral strains of specimens were found to increase with increasing temperature, and above $600^{\circ}C$, the increase of strains were more pronounced. The reduction trends of uniaxial compressive strength and Young's modulus with temperature appeared to follow an exponential decay function. Specimens under water pressure showed the more inelastic deformation characteristics, which means that water pressure has an effect on the widening and extending of micro-cracks existed in preheated specimens.

• Research in Plant Disease
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• v.11 no.2
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• pp.173-178
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• 2005

Ampelomyces quisqualis 94013 (AQ94013), a hyperparasite, was selected as an effective biological control agent against cucumber powdery mildew. Optimal temperature for mycelial growth of AQ94013 was $26^{\circ}C$, and the optimal pH was 6.5. Conidia of AQ94013 were more Produced on potato dextrose agar (PDA) in darkness than under alternating cycles of 12 hr fluorescent light and 12 hr darkness. Temperature range for spore germination of the fungus was $10\~35^{\circ}C$, and optimal temperature was $20^{\circ}C$. Conidial germination of the fungus began 8 hr after incubation at $24^{\circ}C$. Germination rate of conidia at concentration of $5{\times}10^5\;spores/ml\;and\;5{\times}10^6\;spores/ml$ was higher than at concentration of $5{\times}10^7\;spores/ml$. The best source of carbon and nitrogen for mycelial growth of the fungus were dextrin and neopeptone, respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.7
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• pp.799-804
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• 2011

A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.17-17
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• 2010

The amorphous $Bi_5Nb_3O_{15}$ film grown at room temperature under an oxygen-plasma sputtering ambient (BNRT-$O_2$ film) has a hydrophobic surface with a surface energy of $35.6\;mJm^{-2}$, which is close to that of the orthorhombic pentacene ($38\;mJm^{-2}$, resulting in the formation of a good pentacene layer without the introduction of an additional polymer layer. This film was very flexible, maintaining a high capacitance of $145\;nFcm^{-2}$ during and after 10s bending cycles with a small curvature radius of 7.5 mm. This film was optically transparent. Furthermore, the flexible, pentacene-based, organic thin-film transistors (OTFTs) fabricated on the polyethersulphone substrate at room temperature using a BNRT-$O_2$ film as a gate insulator exhibited a promising device performance with a high field effect mobility of $0.5\;cm^2V^{-1}s^{-1}$, an on/off current modulation of $10^5$ and a small subthreshold slope of $0.2\;Vdecade^{-1}$ under a low operating voltage of -5 V. This device also maintained a high carrier mobility of $0.45\;cm^2V^{-1}s^{-1}$ during the bending with a small curvature radius of 9 mm. Therefore, the BNRT-$O_2$ film is considered a promising material for the gate insulator of the flexible, pentacene-based OTFT.