• Journal of the Korean Society of Industry Convergence
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• v.20 no.2
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• pp.187-194
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• 2017

This study examined the validity and reliability of the thermal safety design, in order to maintain the heat generated from integrated circuit (IC) chips in the converter, condenser, resistor, and transistor (which are considered as heat sources for thermoelectric devices with a printed circuit board) below target levels during the process of developing a control board and a main power board. The study analyzed the heat generation and dissipation characteristics of the entire printed circuit board (PCB) model to examine its thermal safety.

• Journal of the Korean Society for Geothermal and Hydrothermal Energy
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• v.1 no.2
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• pp.1-6
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• 2005

Ground water source heat pumps are clean, energy-efficient and environment-friendly systems for cooling and heating. Although the initial cost of ground water source heat pump system is higher than that of air source, it is now widely accepted as an economical system since the installation cost can be returned within a short period of time due to its high efficiency. In a ground water source heat pump system, the variation of the ground water temperature is an important factor that influences the system performance. In this study, variation of the ground water temperature of a single well system is studied experimentally for various operating conditions. When ground water flow exists in the underground, the returned water exchanges heat efficiently with the ground and the temperature of the ground water remains nearly constant. Hence the short circuit problem is minimized. If an active flow of ground water flow exists in the underground, a singe well heat pumps system will be free of short circuit problem and can operate with high performance.

• Fire Science and Engineering
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• v.21 no.4
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• pp.65-71
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• 2007

This paper is studied on a protective control system for electrical fire and electrical faults by using electrical and thermal characteristics of PTC thermistor. The PTC thermistor has characteristic or positive resistivity temperature coefficient according to the temperature variation, which is construction of a regular square and cube demarcation with $BaTiO_3$ Ceramics of positive temperature coefficient. Also PTC thermistor shows the phenomenon which is rapidly increased in the resistivity if the temperature is increased over Curie temperature point. This paper is proposed on a protective control system used PTC thermistor which is protected from electrical fire due to electric short circuit faults or overload faults. Some experimental results of the proposed electric safety control apparatus are confirmed to the validity of the analytical results.

• Journal of Electrical Engineering and Technology
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• v.1 no.3
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• pp.359-365
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• 2006

Since the start of the KSTAR (Korea Superconducting Tokamak Advanced Research) project, Instrumentation and Control (I&C) of the Neutral Beam Test Facility (NB-TF) has been striving to answer diverse requests arising from various facets during the project's development and construction phases. Hard-wired electrical circuits have been designed, tested, fabricated, and finally installed to the relevant parts of the system. In relation to the vacuum system I&C, controlling functions for the rotary pumps, a Roots pump, two turbomolecular pumps, and four cryosorption pumps have been constructed. I&C for the ion source operation are the temperature and flow rate signal monitoring, Langmuir probe signal measurements, gradient grid current measurements, and arc detector circuit. For the huge power system to be monitored or safely operated, many temperature measurement functions have also been implemented for the beam line components like the neutralizer, bending magnet, ion dump, and calorimeter. Nearly all of the control and probe signals between the NB test stand and the control room were made to be transmitted through the optical cables. Failures of coolant flow or beam line vacuum pressure were made to be safely blocked from influencing the system by an appropriate interlock circuit that will shut down the extraction voltage application to the system or prevent damages to the vacuum components. Preliminary estimation of the beam power through the calorimetric measurement shows that 87.9% of the total power of the 60kV/18A beam with 200 seconds duration is absorbed by the calorimeter surface. Most of these I&C results would be highly appropriate for the construction of the main NBI facility for the KSTAR national fusion research project.

• Journal of the Korean Society of Visualization
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• v.7 no.2
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• pp.17-21
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• 2010

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.27 no.2
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• pp.168-174
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• 2017

In this work, a piezostack single-stage valve (PSSV) system is proposed and its control performance is experimentally evaluated at high temperature up to $150^{\circ}C$. In order to achieve this goal, a PSSV system is designed and operating principle and mechanical dimensions are discussed. A displacement amplifier and an adjust bolt are used to generate target displacement and to compensate thermal expansion. Then, an experimental apparatus is constructed to evaluate control performance of the PSSV system. The experimental apparatus consists of a heat chamber, a hydraulic circuit, a pneumatic circuit, pneumatic-hydraulic cylinders, thermal insulator, electronic devices, sensors, data acquisition (DAQ) board and a voltage amplifier. The flow rate and displacement control performance of the valve system are evaluated via experiment. The experimental results are evaluated and discussed at different temperatures and frequencies showing the controlled flow rate and spool displacement.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.27 no.9
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• pp.15-22
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• 2013

A new LED lamp driving technology with a charge pump instead of a conventional DC-DC converter is proposed. The proposed driving technology is used to control the LED lamp with digital dimming. The power loss in the zener diodes is reduced because the charging process of the capacitors is selectively controlled according to the digital control signal. From the experimental results, when dimming four LED lamps simultaneously, the average driving circuit efficiency of 89% is obtained, regardless of the dimming level. White light with color temperature over a range of 2800~7200K was produced by dimming control of red, green, blue and amber LED lamps with the proposed driving circuit. The characteristics of the driving circuits can be changed depending on the characteristics of the R, G, B, and A LED lamps. The efficiency of the driving circuits up to a maximum 89% can also be obtained depending on the combination of LED lamps. The driving technology with digital dimming control for LED lamps proposed in this paper would be effective for obtaining high efficiency in LED driving circuits and remote control of LED lamps using digital communications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.6
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• pp.129-135
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• 2015

This paper shows significant methods that improve the lifespan of LED modules as well as efficiently using an aluminum heat-sink for LED module in high power. It proposes a method that raises stability and lifespan to protect LED modules and the power unit when the LED module has been used for a long hours at high temperatures. During the research, we applied a method of pulse-width modulation (PWM) in order to prevent the phenomenon that the entire power of a system is turned off and the lifespan is reduced when the LED nodule reacts to the high temperatures. To protect the LED module and SMPS based on high efficiency, a temperature sensor is attached underneath the circuit board and the sensor measures the temperature of circuit board when the LED module is powered on. The electrical power connected to SMPS is controlled by PWM when the temperature of the LED module reaches a particular temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.93-93
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• 2016

Large scale integrated circuits (LSIs) has been improved by the shrinkage of the circuit dimensions. The smaller chip sizes and increase in circuit density require the miniaturization of the line-width and space between metal interconnections. Therefore, an extreme precise control of the critical dimension and pattern profile is necessary to fabricate next generation nano-electronics devices. The pattern profile control of plasma etching with an accuracy of sub-nanometer must be achieved. To realize the etching process which achieves the problem, understanding of the etching mechanism and precise control of the process based on the real-time monitoring of internal plasma parameters such as etching species density, surface temperature of substrate, etc. are very important. For instance, it is known that the etched profiles of organic low dielectric (low-k) films are sensitive to the substrate temperature and density ratio of H and N atoms in the H2/N2 plasma [1]. In this study, we introduced a feedback control of actual substrate temperature and radical density ratio monitored in real time. And then the dependence of etch rates and profiles of organic films have been evaluated based on the substrate temperatures. In this study, organic low-k films were etched by a dual frequency capacitively coupled plasma employing the mixture of H2/N2 gases. A 100-MHz power was supplied to an upper electrode for plasma generation. The Si substrate was electrostatically chucked to a lower electrode biased by supplying a 2-MHz power. To investigate the effects of H and N radical on the etching profile of organic low-k films, absolute H and N atom densities were measured by vacuum ultraviolet absorption spectroscopy [2]. Moreover, using the optical fiber-type low-coherence interferometer [3], substrate temperature has been measured in real time during etching process. From the measurement results, the temperature raised rapidly just after plasma ignition and was gradually saturated. The temporal change of substrate temperature is a crucial issue to control of surface reactions of reactive species. Therefore, by the intervals of on-off of the plasma discharge, the substrate temperature was maintained within ${\pm}1.5^{\circ}C$ from the set value. As a result, the temperatures were kept within $3^{\circ}C$ during the etching process. Then, we etched organic films with line-and-space pattern using this system. The cross-sections of the organic films etched for 50 s with the substrate temperatures at $20^{\circ}C$ and $100^{\circ}C$ were observed by SEM. From the results, they were different in the sidewall profile. It suggests that the reactions on the sidewalls changed according to the substrate temperature. The precise substrate temperature control method with real-time temperature monitoring and intermittent plasma generation was suggested to contribute on realization of fine pattern etching.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.728-735
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• 2016

A 70 MHz temperature-compensated on-chip CMOS relaxation oscillator for mobile display driver ICs is proposed to reduce frequency variations. The proposed oscillator compensates for frequency variation with respect to temperature by adjusting the bias currents to control the change in delay of comparators with temperature. A bandgap reference (BGR) is used to stabilize the bias currents with respect to temperature and supply voltages. Additional temperature compensation for the generated frequency is achieved by optimizing the resistance in the BGR after measuring the output frequency. In addition, a trimming circuit is implemented to reduce frequency variation with respect to process. The proposed relaxation oscillator is fabricated using 45 nm CMOS technology and occupies an active area of $0.15mm^2$. The measured frequency variations with respect to temperature and supply voltages are as follows: (i) ${\pm}0.23%$ for changes in temperature from -30 to $75^{\circ}C$, (ii) ${\pm}0.14%$ for changes in $V_{DD1}$ from 2.2 to 2.8 V, and (iii) ${\pm}1.88%$ for changes in $V_{DD2}$ from 1.05 to 1.15 V.