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Evaluation of Control Board and Power Board Thermal Performance

제어보드와 파워보드에 관한 발열성능 평가

  • Jang, Sung-Cheol (Department of Mechanical System Engineering, Polytechnic, Chungjoo Camp.) ;
  • Kweon, Min-Soo (Department of Electronics Technology Engineering, Polytechnic, Chungjoo Camp)
  • 장성철 (한국폴리텍 충주캠퍼스 기계시스템과) ;
  • 권민수 (한국폴리텍 충주캠퍼스 전자기술과)
  • Received : 2017.04.05
  • Accepted : 2017.05.12
  • Published : 2017.06.30

Abstract

This study examined the validity and reliability of the thermal safety design, in order to maintain the heat generated from integrated circuit (IC) chips in the converter, condenser, resistor, and transistor (which are considered as heat sources for thermoelectric devices with a printed circuit board) below target levels during the process of developing a control board and a main power board. The study analyzed the heat generation and dissipation characteristics of the entire printed circuit board (PCB) model to examine its thermal safety.

Keywords

References

  1. Yoo Young-bok, "Expected growth of new market due to automobile electricization", high heat dissipation carbon/polymer composites for automobiles, Vol. 5, Issue 5, pp. 20-23 (2015).
  2. A. Shah, B. G. Sammakia, H. Srihari, and K. Ramakrishna, "A numerical study of the thermal performance of an impingement heat sink-fin shape optimization," IEEE Trans. Components and Packaging Technologies, vol. 27, Issue 4, pp. 710 - 717, Dec. (2004). https://doi.org/10.1109/TCAPT.2004.838879
  3. S. Narasimhan, A. Bar-Cohen, and R. Nair, "Thermal compact modeling of parallel plate heat sinks," IEEE Trans. Components and Packaging Technologies, vol. 26, Issue 1, pp. 136-146, March.(2003). https://doi.org/10.1109/TCAPT.2003.811860
  4. J. R. Culham, M. M. Yovanovich, and S. Lee, "Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection," IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 18, Issue 3, pp. 559-566, Sept. (1995). https://doi.org/10.1109/95.465153
  5. W. Zhimin and C. K. Fah, "The optimum thermal design of microchannel heat sinks," in Proc. 1997 Electronic Packaging Technology Conf, pp. 123-129, (1997).
  6. C. Farcas, I. Ciocan, D. Petreus and N. Palaghita, "Thermal Modeling and Analysis of a Power Device Heat Sinks," 2012 IEEE 18th International Symposium, pp. 25-28, (2012).