• Corrosion Science and Technology
• /
• v.18 no.6
• /
• pp.277-284
• /
• 2019

External corrosion control of buried pipe can be achieved by the combination of barrier coating and cathodic protection. Coating damage and deterioration can be induced by many reasons; damage during handling and laying, enhanced failure at low temperatures, failure during commissioning and operation, disbanding due to inadequate surface cleaning, rock penetration during installation and service etc. This work focused on the effect of survey conditions on the reliability of coating flaw detection of buried pipes. The effects of applied voltage and anode location on the detection reliability of coating flaw of buried pipe in soil with the resistivity of ca. 25.8 kΩ·cm were discussed. Higher applied voltage increased the detection reliability, regardless of buried depth, but deeper burial depth reduced the reliability. The location of the anode has influenced on the detection reliability. This behaviour may be induced by the variation of current distribution by the applied voltage and buried depth. From the relationship between the applied voltage and reliability, the needed detection potential to get a desire detection reliability can be calculated to get 100% detection reliability using the derived equation.

• Journal of Mechanical Science and Technology
• /
• v.20 no.4
• /
• pp.494-504
• /
• 2006

This research proposes a reliability-based topology optimization (RBTO) using the finite element method. RBTO is a topology optimization based on probabilistic (or reliability) constraints. Young's modulus, thickness, and loading are considered as the uncertain variables and RBTO is applied to static and eigenvalue problems. The RBTO problems are formulated and a sensitivity analysis is performed. In order to compute probability constraints, two methods-RIA and PMA-are used. Several examples show the effectiveness of the proposed method by comparing the classical safety factor method.

• Journal of the Korean institute of surface engineering
• /
• v.38 no.6
• /
• pp.216-226
• /
• 2005

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

• Journal of Korean Society for Quality Management
• /
• v.34 no.4
• /
• pp.13-21
• /
• 2006

This paper includes an example of applying Six Sigma to Non-function test process to improve the efficiency and reliability of the Ammunition Stockpile Reliability Program (ASRP). By applying the DMAIC which is one of the Six sigma methods. we found out the vital few and as an improved version : effective redesign of check-sheets, pre-examination of technology, on-the-scene support system. As a result, we could enhance the reliability and reduce manpower and additional expenses.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.1-26
• /
• 2004

The implementation of Pb-free solder technology is making good progress in electronic industry. Further understanding on fundamental issues on Pb-free solders/processes is required to reduce reliability risk factors of Pb-free solder joints. Several reliability issues including thermal fatigue, impact reliability, IMC growth, spalling, void formation are reviewed for Pb-free solder joints. Several applications of Pb-free technology are discussed, such as Pb-free, CBGA, CuCGA, flip chips, and wafer bumping by IMS.

• Journal of Applied Reliability
• /
• v.12 no.1
• /
• pp.1-12
• /
• 2012

The quality of a part has directly effect on part reliability. In the basis of MIL-HDBK-217F model, it is the determined rule that part's quality level should follow its nominal one written in its specification. If quality information is unknown, quality level of the part should be determined as 'Lower'. However, the prediction model is said to be short in reflecting parts applying 'state-of-the-art' technology and result in over-estimated failure rate by some reliability-related authorities or research institutes. In this study, the reliability prediction results by the model of MIL-HDBK-217F and Telcordia SR-332 are compared and analyzed to verify whether the statement is reasonable or not.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.22 no.2
• /
• pp.241-248
• /
• 2019

In this paper, we aim to check the reliability growth of multiple launch rocket components by the life evaluation. We apply the Crow-AMSAA model to the sets of test data obtained from the development phase. The result of the data analysis shows that the reliability of some components needs to be improved. In order to improve their reliability, we analyze the failure mechanism and change their designs. The verification of the reliability growth for those components is done by analyzing the data sets obtained by the accelerated life tests. As a result, we show that the MTBF of those components is increased and also their reliabilities improved.

• Geomechanics and Engineering
• /
• v.29 no.5
• /
• pp.487-496
• /
• 2022

Most of the pile's vertical static load tests in construction sites are the proof load tests, which is difficult to accurately estimate the ultimate bearing capacity and analyze the reliability of piles. Therefore, a reliability analysis method based on the proof load-settlement (Q-s) data is proposed in this study. In this proposed method, a simple ultimate limit state function based on the hyperbolic model is established, where the random variables of reliability analysis include the model factor of the ultimate bearing capacity and the fitting parameters of the hyperbolic model. The model factor M = R_uR / R_uP is calculated based on the available destructive Q-s data, where the real value of the ultimate bearing capacity (R_uR) is obtained by the complete destructive Q-s data; the predicted value of the ultimate bearing capacity (R_uP) is obtained by the proof Q-s data, a part of the available destructive Q-s data, that before the predetermined load determined by the pile test report. The results demonstrate that the proposed method can easy and effectively perform the reliability analysis based on the proof Q-s data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.257-258
• /
• 2008

Hall-type current sensors have been widely used in many fields such as elevator and train system. To estimate lifetime of hall-type current sensors, an accelerated life test with real-time monitoring system simultaneously was designed and performed in high temperature environment with three different temperatures. From the experimental results, activation energy was about 0.9 eV, and acceleration factor was about 450 based on Arrhenius model. As a results, $B_{10}$ lifetime of hall-type current sensor is estimated to be 65,460 hours.

• Journal of Applied Reliability
• /
• v.10 no.1
• /
• pp.11-24
• /
• 2010

Lighting industry is rapidly being developed as the ubiquitous society based on sensor network emerges. This kind of paradigm shift brings the society convergence of technologies which leads to smart lighting system as well as the integration of interior and sensibility control. However, standards for sensors have not been firmly established, and problems related to quality and malfunction have been brought up, thereby calling for careful approach to the enhancement and assessment of reliability of the item. In this article reliability assessment criteria for sensor module for lighting fixtures is established in terms of performance assessment criterion and reliability assessment criterion.