• 진공이야기
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• 제2권1호
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• pp.10-16
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• 2015

With the recognition of nanotechnology as one of the future strategic technologies, the R&D efforts have been performed under exclusive supports of governments and private sectors. At present, nanotechnology is at the focus of research and public attention in almost every advanced country including USA, Japan, and many others in EU. Keeping tracks of such technical trends, center for nanoscale mechatronics and manufacturing (CNMM) was established in 2002 as a part of national nanotechnology promotion policy led by ministry of science and technology (MOST) in Korea. It will hold widespread potential applications in electronics, optical electronics, biotechnology, micro systems, etc, with the promises of commercial visibility and competitiveness. In this paper, wafer scale multilayer nanoimprint lithography technology which is well-known the next generation lithography, roll-typed nanoimprint lithography (R-NIL), roll-typed liquid transfer imprint lithography (R-LTIL), the key technology for nanomanufacturing and nanoscale measurement technology will be introduced. Additionally, its applications and some achievements such as solar cell, biosensor, hard disk drive, and MOSFET, etc by means of the developed multilayer nanoimprint lithography system are introduced.

• 공업화학
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• 제19권4호
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• pp.357-365
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• 2008

현재 수소에너지는 화석연료의 고갈과 환경문제를 동시에 해결할 수 있는 가능성 있는 자원으로 그 중요성은 점점 커지고 있으며 지금까지 비 화석연료로부터 수소를 생산하는 방법 중에서 관심을 받는 기술은 물 전기분해이다. 물 전기분해는 전기에너지를 이용하여 무한정한 원료인 물로부터 고순도의 수소와 산소를 생산할 수 있는 친환경적인 방법이다. 본 총설에서는 물 전기화학반응의 기본원리와 종류, 최근 국내외 기술 개발현황과 발전가능성에 대해서 기술하고자 한다.

• 패션비즈니스
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• 제4권2호
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• pp.95-111
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• 2000

The purpose of this research is to investigate the concept of the photomontage technique, one of the various photographic techniques, and to analyze the photomontage image through the patterns that appeared in 1990's fashions. Moreover, by making clothes using the photomontage image, the intention of this study to apply the technique in real life is achieved. The results of this thesis for making clothes utilizing image of the photomontage are as followings. First, the photomontage expands the variety of materials that can be used, because the clothes using the photomontage image are able to take any photo images. Second, two different eras can co-exist in a piece of work since a photomontage work can uses two images from different eras. Third, it allows greater adaptability by expressing variety and utility in the making of the casual styles using conventional photo materials. The conclusion of this study is that the clothes appearing in the late 20th century using the photomontage image have been developed corresponding to the accelerated development of photography, machinery, and technical skill in civilization. Trends break away from the conventional expressions of art. This is a new trend and direction in art that will effect culture in the 21st century. The photo montage image would show the possibility of a good unification between human being and machines.

• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.53-59
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• 2011

Recently there have been considerable attentions on nanoimprint lithography (NIL) by the display device and semiconductor industry due to its potential abilities that enable cost-effective and high-throughput nanofabrication. Although one of the current major research trends of NIL is large-area patterning, the technical difficulties to keep the uniformity of the residual layer become severer as the imprinting area increases more and more. In this paper we focused on the deformation of the $2^{nd}$ generation TFT-LCD sized ($370{\times}470mm^2$) large-area soft mold in the UV imprinting process. A mold was fabricated with PDMS(Poly-dimethyl Siloxane) layered glass back plate(t0.5). Besides, the mold includes large surrounding wall type protrusions of 1.9 mm width and the via-hole(7 ${\mu}m$ diameter) patterend area. The large surrounding wall type protrusions cause the proximity effect which severely degrades the uniformity of residual layer in the via-hole patterend area. Therefore the deformation of the mold was calculated by finite element analysis to assess the effect of large surrounding wall type protrusions and the flexiblity of the mold. The deformation of soft mold was verified by the measurements qualitatively.

• 접착 및 계면
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• 제18권4호
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• pp.171-178
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• 2017

최근 들어, 다층박막법(Layer-by-Layer(LbL) assembly)을 이용한 표면 젖음성 제어 기술이 큰 관심을 받고 있다. 다층박막법은 고분자, 계면활성제, 나노 입자 등과 같은 다양한 재료를 이용하여 수직 구조와 표면 특성을 나노 및 마이크로 스케일로 제어할 수 있는 다기능적이며 친환경적인 제조방법이다. 본 논문에서는 다층박막법을 이용하여 표면 특성을 제어하는 기술의 최근 동향을 살펴보고자 한다. 특히, 초발수, 초친수, 초발유/초친수 LbL 표면의 제조와 응용에 대한 기술 동향과 연구 결과를 기술한다. 또한, omniphobic, 자가-치유, 지능형 및 외부 반응형 표면 등 최근 각광을 받고 있는 분야의 기본적인 원리와 제조 방법 등에 대해 소개하고자 한다.

• 한국지구물리탐사학회:학술대회논문집
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• 한국지구물리탐사학회 2007년도 공동학술대회 논문집
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• pp.285-290
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• 2007

Electrical and electromagnetic methods were widely applied to survey of civil engineering, environment site assessments and maintenance of underground structures in Korea. Electro-physical properties measurements of soil and rock are necessary in order to quantitatively estimate the ground from these survey results. A few geotechnical researcher groups have been simplified measurement system of the electro-physical properties, which was intermittently operating by the necessity. Recent strong concern about $CO_2$ underground storage and development of gas hydrate projects have urged many advanced countries. The electro-physical properties estimation of the deep object stratum is very importance for basic information of these research. So, advanced countries have a high-end measurement system with high temperature(200 degrees) and pressure(300 MPa), also they have been a lot of experience and know-how on the electro-physical properties measurement.

• 디지털산업정보학회논문지
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• 제11권4호
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• pp.99-112
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• 2015

Drones are more formally known as unmanned aerial vehicles without a human pilot aboard. Its flight is controlled either autonomously by onboard computers or by the remote control of a pilot on the ground. This research aims to analyze market trends and technological developments of drones, use cases and constraints of drones in the cultural industries take advantage of the possibility of future drones. Drones are looking for broadcasting, movie, theater, games, toys drones and racing games in a variety of cultural industry. The biggest problem of drone shall provide penalties for breaches of privacy and security issues in the debate. Drones performances are required such as battery capacity and compactness because of the technical limitations. The drones are expected to be used in various fields such as journalism drone, performance tools, augmented reality games, kidult culture. The drones can create a new cultural industry market such as the combination of robotics and drone journalism, drone crowded theater, utilizing drones character games, racing games etc. In conclusion, drones help reduce manpower, time and costs dramatically and will contribute to creating added value in the cultural industries.

• The Journal of Asian Finance, Economics and Business
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• 제7권8호
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• pp.661-670
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• 2020

This paper investigates the influence of the economic integration exemplified by the Eurasian Economic Union on the entrepreneurial ecosystem in the Kazakhstan corporate sector. Using data collected from 204 small-, medium-, and large-sized Kazakh companies, the researchers analyzed the collected data with percentile. Findings of this study show that small- and medium-sized enterprises, especially in the tertiary sector of the Kazakh economy, are not that much affected by regional integration, whereas large firms have been significantly impacted. The originality of the paper is threefold. First, the research explores the entrepreneurial ecosystems in its focus on geographic location or digital technologies that came across mainly from the ICT space. This is becoming pervasive across mechanical systems, communications, infrastructure, and the built-up environment. Second, the originality of the paper lies in focusing on the entrepreneurial ecosystems' influence on the business processes by clearly understanding the regional, national, and international trends in different markets. Third, the paper is first of its kind to contribute an updated perspective on the entrepreneurial ecosystem's influence on economic integration to the policymakers of Kazakhstan. Policymakers will gain expertise on how to manage network effects while planning investment projects, as well as transactions, modes, and fixed nodes, acquisition, and greenfield investments.

• 대한안전경영과학회지
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• 제12권4호
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• pp.183-190
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• 2010

This paper selects length of berth, area of yard, unloading capacity and number of berth as the input indexes, and cargo turnover as output index to research the source of TFP(Total Factor Productivity) growth of 23 main ports in Korea. The major conclusions are as follows. The TFP of the trade ports in Korea is at the fluctuating stage, but it generally displays a rising trend, and it’s growth originate from the growth of technical efficiency. The Growth rates of TFP of trade ports in the different areas are different, and the sources of growth are also different, but the changing trends are basically the same. Four major factors to the increase of TFP are following: competition between ports, reform of property system, harbor-hinterland economic and international trade, modeling, imitation and innovation in management, technology and system.

• 전자통신동향분석
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• 제32권6호
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• pp.8-16
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• 2017

In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.