• The KIPS Transactions:PartD
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• v.11D no.1
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• pp.11-22
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• 2004

As random access memory chip gets cheaper, it becomes affordable to realize main memory-based database systems. Consequently, reducing cache misses emerges as the most important issue in current main memory databases, in which CPU speeds have been increasing at 60% per year, compared to the memory speeds at 10% per you. In this paper, we design and implement a main-memory database system for real-time mobile GIS. Our system is composed of 5 modules： the interface manager provides the interface for PDA users； the memory data manager controls spatial and non-spatial data in main-memory using virtual memory techniques； the query manager processes spatial and non-spatial query : the index manager manages the MR-tree index for spatial data and the T-tree index for non-spatial index : the GIS server interface provides the interface with disk-based GIS. The MR-tree proposed propagates node splits upward only if one of the internal nodes on the insertion path has empty space. Thus, the internal nodes of the MR-tree are almost 100% full. Our experimental study shows that the two-dimensional MR-tree performs search up to 2.4 times faster than the ordinary R-tree. To use virtual memory techniques, the memory data manager uses page tables for spatial data, non- spatial data, T-tree and MR-tree. And, it uses indirect addressing techniques for fast reloading from disk.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.5
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• pp.445-453
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• 2016

This paper presents the implementation and design of the 1T-1R wireless HD video streaming systems over 28 GHz mmWave frequency using 3GPP LTE-TDD standard on NI USRP RIO SDR platform. The baseband of the system uses USRP RIO that are stored in Xilinx Kintex-7 chip to implement LTE-TDD transceiver modem, the signal that are transceived from USRP RIO up or down converts to 28 GHz by using self-designed 28 GHz RF transceiver modules and it is finally communicated HD video data through self-designed $4{\times}8$ sub array antennas. It is that communication method between USRP RIO and Host PC use PCI express ${\times}4$ to minimize delay of data to transmit and receive. The implemented system show high error vector magnitude performance above 25.85 dBc and to transceive HD video in experiment environment anywhere.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.38 no.5
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• pp.509-517
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• 2001

Full-search algorithm requires large amount of computation which causes time delay or very complex hardware architecture for real time implementation. In this paper, we propose a fast motion estimator based on bit-plane matching, which reduce the computational complexity and the hardware cost. In the proposed motion estimator, the conventional motion estimation algorithms are applied to the binary images directly extracted from the video sequence. Furthermore, in the proposed VLSI motion estimator, we employ a Pair of processing cores that calculate the motion vector continuously By controlling the data flow in a systolic fashion using the internal shift registers in the processing cores, we avoid using SRAM (local memory) so that we remove the time overhead for accessing the local memory and adopt lower-cost fabrication technology. We modeled and tested the proposed motion estimator in VHDL, and then synthesized the whole system which has been integrated in a 0.6-$\mu$m triple-metal CMOS chip of size 8.15 X 10.84$\textrm{mm}^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.12
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• pp.22-28
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• 2008

This paper designed a efficient 8-bit CMOS analog-to-digital converter(ADC) for an SOC(System On Chip) application. The architecture consists of two modified 4-bit full-flash ADCs, it has been designed using a more efficient architecture. This is to predict roughly the range in which input signal residers and can be placed in the proximity of input signal based on initial prediction. The prediction of input signal is made available by introducing a voltage estimator. For 4-bit resolution, the modified full-flash ADC need only 6 comparators. So a 8-bit ADC require only 12 comparators and 32 resistors. The speed of this ADC is almost similar to conventional full-flash ADC, but the die area consumption is much less due to reduce numbers of comparators and registors. This architecture uses even fewer comparator than half-flash ADC. The circuits which are implemented in this paper is simulated with LT SPICE tool of computer.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.4
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• pp.826-832
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• 2004

A CMOS 8 bit folding and interpolating ADC for an embedded system inside VLSI is presented in this paper. This folding ADC uses the 2 stage architecture for improving of nonlinearity. repeating the folding and interpolating twice. At a proposed structure, a transistor differential pair operates on the second folder. A ADC with 2 stage architecture reduces the number of comparators and resisters. So it is possible to provide small chip size, low power consumption and high operating speed. The design technology is based on fully standard 0.25m double-Poly 2 metal n-well CMOS Process. The simulated Power consumption is 45mW with an applied voltage of 2.5V and sampling frequency of 250MHz. The INL and DNL are within <ㅆㄸㅌ>$\pm$0.2LSB, respectively. The SNDR is approximately 45dB for input frequency of 10MHz.

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2444-2452
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• 2022

The field-programmable gate array (FPGA) is gaining popularity in industrial automation such as nuclear power plant instrumentation and control (I&C) systems due to the benefits of having non-existence of operating system, minimum software errors, and minimum common reason failures. Separate functions can be processed individually and in parallel on the same integrated circuit using FPGAs in comparison to the conventional microprocessor-based systems used in any plant operations. The use of FPGAs offers the potential to minimize complexity and the accompanying difficulty of securing regulatory approval, as well as provide superior protection against obsolescence. Wireless sensor networks (WSNs) are a new technology for acquiring and processing plant data wirelessly in which sensor nodes are configured for real-time signal processing, data acquisition, and monitoring. ZigBee (IEEE 802.15.4) is an open worldwide standard for minimum power, low-cost machine-to-machine (M2M), and internet of things (IoT) enabled wireless network communication. It is always a challenge to follow the specific topology when different Zigbee nodes are placed in a large network such as a plant. The research article focuses on the hardware chip design of different topological structures supported by ZigBee that can be used for monitoring and controlling the different operations of the plant and evaluates the performance in Vitex-5 FPGA hardware. The research work presents a strategy for configuring FPGA with ZigBee sensor nodes when communicating in a large area such as an industrial plant for real-time monitoring.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.1
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• pp.21-31
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• 2017

In this paper, the Zynq system-on-chip (SoC) platform is used to design an adaptive noise reduction and edge-detection system using partial reconfiguration. Filters are implemented in a partially reconfigurable (PR) region to provide high computational complexity in real-time, 1080p video processing. In addition, partial reconfiguration enables better utilization of hardware resources in the embedded system from autonomous replacement of filters in the same PR region. The proposed edge-detection system performs adaptive noise reduction if the noise density level in the incoming video sequences exceeds a given threshold value. Results of implementation show that the proposed system improves the accuracy of edge-detection results (14~20 times in Pratt's Figure of Merit) through self-reconfiguration of filter bitstreams triggered by noise density level in the video sequences. In addition, the ZyCAP controller implemented in this paper enables about 2.1 times faster reconfiguration when compared to a PCAP controller.

• The Transactions of the Korean Institute of Power Electronics
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• v.4 no.1
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• pp.26-34
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• 1999

According to increase of nonlinear power electronics equipment, active power filters have been researched and developed for many years to compensate harmonic disturbances and reactive power. However the commercial of active power filter is being proceeded slowly, because the cost of active power filter compared to the passive filter for harmonic and reactive power compensation is expensive. Especially, the use of DSP (Digital Signal Processing) chip, which is frequently used to control 3-phase active power filter, is a factor of increasing the cost of active power filters. On the other hand, the use of only analog controller makes the controller's circuits much more complicate and depreciates the flexibilities of controller. In this paper, a controller with low cost for 5[kVA] 3-phase active power filter system is designed. To reduce the expense of active filter system, the presented controller is composed of digital control part using Intel 80C196KC $\mu$P and analog control part using hysteresis controller for current control. Characteristic analysis of designed controller for active filter system is performed by computer simulation and compensating characteristics of the designed controller are verified by experiment.tegy can apply to the vector control, leading to better output torque capability in the ac motor drive system. This strategy is that in the overmodulation range, the d-axis output current is given a priority to regulate the flux well, instead the q-axis output curent is sacrificed. Therefore, the vector control even in the overmodulation PWM operation can be achieved well. For this purpose, the d-axis output voltage of a current controller to control the flux is conserved. the q-axis output voltage to control the torque is controlled to place the reference voltage vector on the hexagon boundary in case of the overmodulation. The validity of the proposed overall scheme is confirmed by simulation and experiments for a 22[kW] induction motor drive system.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.9-15
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• 2021

Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper bonding is becoming very important for high performance and fine-pitch in 3D packaging. In this study, the effects of Ti nanolayer on the antioxidation of copper surface and low-temperature Cu bonding was investigated. The diffusion rate of Ti into Cu is faster than Cu into Ti in the temperature ranging from room temperature to 200℃, which shows that the titanium nanolayer can be effective for low-temperature copper bonding. The 12nm-thick titanium layer was uniformly deposited on the copper surface, and the surface roughness (R_q) was lowered from 4.1 nm to 3.2 nm. Cu bonding using Ti nanolayer was carried out at 200℃ for 1 hour, and then annealing at the same temperature and time. The average shear strength measured after bonding was 13.2 MPa.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.8
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• pp.52-59
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• 2007

In this paper, we analyzed and measured implant isolation characteristics for a 1.25 Gbps monolithic integrated hi-directional (M-BiDi) optoelectronic system-on-a-chip, which is a key component to constitute gigabit passive optical networks (PONs) for a fiber-to-the-home (FTTH). Also, we derived an equivalent circuit of the implant structure under various DC bias conditions. The 1.25 Gbps M-BiDi transmit-receive SoC consists of a laser diode with a monitor photodiode as a transmitter and a digital photodiode as a digital data receiver on the same InP wafer According to IEEE 802.3ah and ITU-T G.983.3 standards, a receiver sensitivity of the digital receiver has to satisfy under -24 dBm @ BER=10-12. Therefore, the electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysed and measured results of the implant structure, the M-BiDi SoC with the implant area of 20 mm width and more than 200 mm distance between the laser diode and monitor photodiode, and between the monitor photodiode and digital photodiode, satisfies the electrical crosstalk level. These implant characteristics can be used for the design and fabrication of an optoelectronic SoC design, and expended to a mixed-mode SoC field.