• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.751-754
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• 1998

This research aims at developing a single chip multiprocessor for high-performance computer system. Our design approach is to design a relatively small and simple processor unit and to integrate multiple copies of the unit in an efficient way. The proposed multiprocessor is composed of four CPUs and one graphic coprocessor. The four CPUs share the graphic coprocessor and each CPU implements the 64-bit SPARC-V9 instruction set architecture. This paper gives an overview of the proposed microarchitecture and discusses the considerations made in the course of the design.

• IEIE Transactions on Smart Processing and Computing
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• v.5 no.1
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• pp.55-62
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• 2016

In this paper, we propose a hybrid multi.system-on-chip (H-MSoC) architecture that provides a high-flexibility system in a rapid development time. The H-MSoC approach provides a flexible system-on-chip (SoC) architecture that is easy to configure for physical- and application-layer development. The physical- and application-layer aspects are dynamically designed and modified; hence, it is important to consider a design methodology that supports rapid SoC development. Physical layer development refers to intellectual property cores or other modular hardware (HW) development, while application layer development refers to user interface or application software (SW) development. H-MSoC is built from multi-SoC architectures in which each SoC is localized and specified based on its development focus, either physical or application (hybrid). Physical HW development SoC is referred to as physical-SoC (Phy-SoC) and application SW development SoC is referred to as application-SoC (App-SoC). Phy-SoC and App-SoC are connected to each other via Ethernet. Ethernet was chosen because of its flexibility, high speed, and easy configuration. For prototyping, we used a LEON3 SoC as the Phy-SoC and a ZYNQ-7000 SoC as the App-SoC. The proposed design was proven in real-time tests and achieved good performance.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.9_10
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• pp.485-496
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• 2008

As the complexity of SoC (System-on-Chip) design increases dramatically. traditional system performance analysis and verification methods based on RTL (Register Transfer Level) are no more valid for increasing time-to-market pressure. Therefore a new design methodology is desperately required for system verification in early design stages. and hardware software (HW-SW) cosimulation at TLM (Transaction Level Modeling) level has been researched widely for solving this problem. However, most of HW-SW cosimulators support few restricted ion levels only, which makes it difficult to integrate HW-SW cosimulators with different ion levels. To overcome this difficulty, this paper proposes a multipurpose framework for HW SW cosimulation to provide systematic SoC design flow starting from software application design. It supports various design techniques flexibly for each design step, and various HW-SW cosimulators. Since a platform design is possible independently of ion levels and description languages, it allows us to generate simulation models with various ion levels. We verified the proposed framework to model a commercial SoC platform based on an ARM9 processor. It was also proved that this framework could be used for the performance optimization of an MJPEG example up to 44% successfully.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.212-215
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• 2005

The needs of larger screen in mobile device would be increased as the time of ubiquitous and convergence is coming. And, the type of mobile device has been evolved from bar, slide to row. Recently, the study on the multi-display screen which has seamless gap between two display panel has been published, and moreover the System On Chip(SOC) design strategy of core chip has been the most promising Field-Programmable Gate Array(FPGA) technology in the display system. Therefore, in this paper, we proposed the design technique of SOC and evaluated the effectiveness with Very high speed Hardware Description Language(VHDL) Intellectual Property (IP) for the operation of multi display device driver. Also, This IP design would be to allow any kind of user interface in control system.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.2
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• pp.38-47
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• 2001

This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.2 s.332
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• pp.65-72
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• 2005

We can integrate more IP blocks on a silicon die as the development of fabrication technologies and EDA tools. Consequently, we can design complicated SoC architecture including multi-processors. However, most of existing SoC buses have bottleneck in on-chip communication because of shared bus architectures, which result in the performance degradation of systems. In most cases, the performance of a multi-processor system is determined by efficient on-chip communication and the well-balanced distribution of computation rather than the performance of the processors. We propose an efficient SoC Network Architecture(SNA) using crossbar routers which provide a solution to ensure enough communication bandwidth. The SNA can significantly reduce the bottleneck of on-chip communication by providing multi-channels for multi-masters. According to the proposed architecture, we design a model system for the SNA. The proposed architecture has a better efficiency by $40\%$ than the AMBA AHB according to a simulation result.

• Proceedings of the KIEE Conference
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• 2000.07b
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• pp.1099-1101
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• 2000

ASIC chip design for motor control has been a subject of increasing interest since an effective methodology of system-on-a-chip design was developed. This paper investigates the design and implementation of ASIC chip for vector control of induction motor using VHDL which is a standard hardware description language. The vector control algorithm is finally implemented using a simple electronic circuit based on FPGA. The performance of the designed ASIC is verified through simulation and experiment.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.36 no.1B
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• pp.86-92
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• 2011

In this paper, we propose a novel hardware MPI(Message Passing Interface) unit which supports message passing in multiprocessor system which use distributed memory architecture. MPI Hardware unit processes data synchronization, transmission and completion, and it supports processor non-blocking operation so it reduces overhead according to synchronization. Additionally, MPI hardware unit combines ready entry, request entry, reserve entry which save and manage the synchronized messages and performs the multiple outstanding issue and out of order completion. According to BFM(Bus Functional Model) simulation result, the performance is increased by 25% on many to many communication. After we designed MPI unit using HDL, with synopsys design compiler we synthesized, and for synthesis library we used MagnaChip $0.18{\mu}m$. And then we making prototype chip. The proposed message transmission interface hardware shows high performance for its increase in size. Thus, as we consider low-cost design and scalability, MPI hardware unit is useful in increasing overall performance of embedded MPSoC(Multi-Processor System-on-Chip).

• ETRI Journal
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• v.19 no.3
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• pp.228-241
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• 1997

In this paper, we present a design of modem and vocoder digital signal processor (DSP) chips for CDMA mobile station. The modem chip integrates CDMA reverse link modulator, CDMA forward link demodulator and Viterbi decoder. This chip contains 89,000 gates and 29 kbit RAMs, and the chip size is $10 mm{\times}10.1 mm$ which is fabricated using a $0.8{\mu}m$ 2 metal CMOs technology. To carry out the system-level simulation, models of the base station modulator, the fading channel, the automatic gain control loop, and the microcontroller were developed and interfaced with a gate-level description of the modem application specific integrated circuit (ASIC). The Modem chip is now successfully working in the real CDMA mobile station on its first fab-out. A new DSP architecture was designed to implement the Qualcomm code exited linear prediction (QCELP) vocoder algorithm in an efficient way. The 16 bit vocoder DSP chip has an architecture which supports direct and immediate addressing modes in one instruction cycle, combined with a RISC-type instruction set. This turns out to be effective for the implementation of vocoder algorithm in terms of performance and power consumption. The implementation of QCELP algorithm in our DSP requires only 28 million instruction per second (MIPS) of computation and 290 mW of power consumption. The DSP chip contains 32,000 gates, 32K ($2k{\times}16\;bit$) RAM, and 240k ($10k{\times}24\;bit$) ROM. The die size is $8.7\;mm{\times}8.3\;mm$ and chip is fabricated using $0.8\;{\mu}m$ CMOS technology.