• Journal of the Korean Vacuum Society
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• v.7 no.3
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• pp.221-228
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• 1998

Enhancement of adhesion between polymer films and metal films are obtained by forming the hydrophilic functional groups on the polymer surfaces by ion assisted reaction which uses ion beam in reactive gas environments. In ion assisted reaction, ion dose, blown gas flow rate and ion energy were changed from $5\times 10^{14}$ to $1\times 10^{17}\textrm{ions/cm}^2$, from 0 to 8 sccm, and 0.3 to 1.2 kV, respectively. Wetting angle of water on polymer films modified by $ Ar^+$ ion without blowing oxygen decreases to ~$40^{\circ}$. Contact angle of water on polymer films modified by $ Ar^+$ ion with blowing oxygen decreases to ~$20^{\circ}$, and the surface free energy increases to ~70 dyne/$\textrm{cm}^2$. However, contact angle of water on polytetraflouroethylene (PTFE) modified by ion assisted reaction increases with ion dose. The adhesion strength of metal film deposited on the polymer surface was investigated. In the case of the metal film deposited on the untreated polymers, the metal films are detached from the polymer surface. While, In the case of the metal film deposited on the polymers treated by ion assisted reaction, the metal films are strongly adhere to the polymer surfaces.

• The Journal of Engineering Geology
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• v.28 no.3
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• pp.489-499
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• 2018

A flume experiments was used to study the characteristics of the surface displacements and volumetric water contents (VWC) during torrential rain. The surface displacement and VWC of the granite weathered soil were measured for rainfall intensity (100, 200 mm/hr) and initial ground condition (VWC 7, 14, 26%). The test processes were also recorded by video cameras. According to the test results, The shallow failure is classified into three types: retrogressive failure, progressive failure and defined failure. In the case of retrogressive failure and progressive failure, relatively large damage could occur due to the feature that soil is deposited to the bottom of the slope. the shallow failure occurred when the VWC reached a certain value regardless of the initial soil condition. It was found that the shallow failure can be predicted through the increase patton of the VWC under the condition of the ground dry condition (VWC 7%) and the natural condition (VWC 14%). For high rainfall intensity, progressive failure predominated, and rainfall intensity above a certain level did not affect wetting front transition.

• Proceedings of the Korean Society of Crop Science Conference
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• 2017.06a
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• pp.186-186
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• 2017

Relay intercropping system of direct seeded rice and winter cereal is labor saving cultivation and has high land use efficiency in Japan. In this system, rice seeds are direct seeded into inter-row space of winter cereals (wheat or barley) in March or April. If the direct seeding of rice is conducted before stem elongation phase or using suitable seeder, these are little effect to yield of winter cereals. Though the seeds are generally thiuram treated, it's a matter that seedling establishment rate (SER) of direct seeded rice is low and unstable. The cause of low SER has not been revealed. In present study, with the aim to reveal causes of low SER, we conducted experiments and investigated the SER, and analyzed some factors that might affect SER. Experiment1: In 2015, 2016, we buried rice seeds underground, and investigated the transition of the seed survival rates (SSR). Seeds were thiuram-treated or non-treated. In 2 periods, SSR of thiuram-treated seeds were significantly higher than non-treated seeds. In 2016, thiuram-treated seeds were high in SSR (almost 75%) at April 30th, but low SER (10~27%) after harvest of winter cereals. Therefore, almost all of seed death might have been happen after germination. Analysis 1: We investigated the SER and cultivation conditions in Ibaraki pref. for several years. Meteorological factors were referred from the nearest point of AMeDAS. From mean temperature (MT) among 5days after and before the day, we divided the period of seeding ~June 20 to phase1~4. We defined each phase as below; Phase1: $MT{\leq}10^{\circ}C$, Phase2: $10^{\circ}C<MT{\leq}15^{\circ}C$, Phase3:$15^{\circ}C<MT{\leq}20^{\circ}C$, Phase4: $MT>20^{\circ}C$. We analyzed the correlation of SER and meteorological factors by each phase. Total number of days in phase 1~4 was significantly negative correlated with SER. In phase1, total rain fall and number of soil wetting days were significantly negative correlated with SER. In phase2~4, only MT was significantly positive correlated with SER. This result suggested that rainfalls in phase1 declined seed vigor to emergence from soil surface, by repeated water absorption and re-dry. From these present studies, it was suggested that one of factors of low SER of direct seeded rice in relay intercropping system is changing of water condition by rainfalls in phase1 ($MT{\leq}10^{\circ}C$). To improve SER, it's necessary to consider something seed treatments such as prevent water absorption during phase1. However, 58~60% of seeds seemed to die during May. It's suggested that, if seeds are thiuram treated, almost all of seeds can germinate underground, but the seed vigor to emergence from soil surface are insufficient. Further studies are needed to reveal the rest causes that is happening during emergence from soil surface.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Geosynthetics Society
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• v.15 no.3
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• pp.49-55
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• 2016

Field measurement units and a system were constructed and installed in a waste-dump slope at the Imgi mine to investigate and analyze the variations in the unsaturated characteristics of the soil. The field instrumentation system was composed of a data acquisition system (DAS), a solar system, and measuring sensors. The rainfall, matric suction, and volumetric water contents were continuously measured from the units in the instrumented site. The variations in matric suction and volumetric water content were primarily affected by the rainfall intensity. At the surface of the slope, the largest increase and decrease in the changes in matric suction and volumetric water content were observed during the wetting and drying processes, respectively. Also, the matric suction and volumetric water content were 5-35 kPa and 0.12-0.24, respectively. However, the ground water level was not suddenly increased just after rainfall but gradually increased after 2 or 3 days later.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.3
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• pp.205-209
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• 2017

Unlike spherical drop impact, ellipsoidal drop impact can control the bouncing height on a heated surface by significantly altering impact behavior. To scrutinize the effect of the aspect ratio (AR) of the drop on the bounce suppression, in this study, non-axisymmetric spreading behaviors are observed from two side views and characterized based on the spreading width of the drop for horizontal principal axes. In addition, the maximum spreading width is investigated for various ARs. The results show that as the AR increases, the maximum spreading width of the minor axis increases, whereas that of the major axis shows no significant variation. In the regime of high AR and high impact velocity, liquid fragmentations by three parts are observed during bouncing. These fragmentations are discussed in this work. The hydrodynamic features of ellipsoidal drop impact will help understand bouncing control on non-wetting surfaces for several applications, such as self-cleaning and spray cooling.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.09a
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• pp.764-771
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• 2010

The stability analysis method of an unsaturated slope considering the suction stress was performed on the infinite sand slope. During drying and wetting processes, the Soil-Water Characteristics Curve (SWCC) of the sand with the relative density of 75% was measured using the automated SWCC apparatus. Also, the Suction Stress Characteristics Curve (SSCC) was estimated. Based on these results, the stability analysis of an unsaturated infinite slope was carried out considering the slope angle, the weathering zone and the relative change in friction angle as a soil depth. According to the result of slope stability analysis, the safety factors of slope were less than 1 when the slope angles were more than $50^{\circ}$. The safety factors of slope tend to increase with increasing the depth from the ground surface. Especially, the safety factors have a tendency to increase and decrease above near the ground water level due to the suction stress. The maximum safety factor of slope in this analysis was occurred at the Air Entry Value (AEV) of drying process. The influence range of suction stress above the ground water level can be found out and can be defined as the funicular zone which means the metric suction range from the air entry point to the point of residual volumetric water content.

• Environmental Engineering Research
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• v.13 no.1
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• pp.19-27
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• 2008

Simultaneous removal of ternary gases of $NH_3$, $H_2S$ and toluene in a contaminated air stream was investigated over 180 days in a biofilter. A commercially available inorganic/polymeric composite chip with a large void volume (bed porosity > 0.80) was used as a microbial support. Multiple microorganisms including Nitrosomonas and Nitrobactor for nitrogen removal, Thiobacillus thioparus (ATCC 23645) for $H_2S$ removal and Pseudomonas aeruginosa (ATCC 15692), Pseudomonas putida (ATCC 17484) and Pseudomonas putida (ATCC 23973) for toluene removal were used simultaneously. The empty bed residence time (EBRT) ranged from 60 - 120 seconds and the inlet feed concentration was $0.0325\;g/m^3-0.0651\;g/m^3$ for $NH_3$, $0.0636\;g/m^3-0.141\;g/m^3$ for $H_2S$, and $0.0918\;g/m^3-0.383\;g/m^3$ for toluene, respectively. The observed removal efficiency was 2% - 98% for $NH_3$, 2% - 100% for $H^2S$, and 2% - 80% for toluene, respectively. Maximum elimination capacity was about $2.7\;g/m^3$/hr for $NH_3$, > $6.4\;g/m^3$/hr for $H_2S$ and $4.0\;g/m^3$/hr for toluene, respectively. The inorganic/polymeric composite carrier required 40 - 80 days of wetting time for biofilm formation due to the hydrophobic nature of the carrier. Once the surface of the carrier was completely wetted, the microbial activity became stable. During the long-term operation, pressure drop was negligible because the void volume of the carrier was two times higher than the conventional packing materials.