• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 1999.04b
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• pp.361-365
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• 1999

This study examined the effects of multiple recycling on deinkability and properties of recycled paper from laser computer printout (LCPO). First, alkaline paper with a 20% printed area was disintegrated by TAPPI standard disintegrator at room temperature. After dewatering, the pulp was flotated and dried in oven at80$^{\circ}C$ for 24 hrs. A sequence of wetting, disintegrating, flotating and drying was one recycling cycle and this cyclic treatment was repeated from zero to five times. The recycled handsheet dropped to 90% of the original brightness after five cycles, and lost the most brightness after five cycles, and lost the most brightness in the first two cycles. However, it had a gain of 10% in opacity after five cycles as the same as the case of nonprinting. And, in this study, the method for determining residual ink(toner) content in recycled handsheets ere established by means of SEM-EDX and Py-GC. The change of residual ink percentage on recycled paper showed the effect of recycling numbers on deinkability of waste paper. A slight decrease in deinkability was noted for the recycled handsheets, which may be due to the change of fiber surface free energy connected with fiber swelling.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.20.2-20.2
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• 2010

Recently inkjet printing technology has been developed in the areas of low cost fabrication in environmentally friendly manufacturing processes. Although inkjet printing requires the interdisciplinary researches including development of materials, manufacturing processes and printing equipment and peripherals, manufacturing a printhead is still core of inkjet technology. In this study, a piezoelectric driven DOD (drop on demand) inkjet printhead has been fabricated on three layers of the silicon wafer in MEMS Technology because of its chemical resistance to industrial inks, strong mechanical properties and dimensional accuracy to meet the drop volume uniformity in printed electronics and display industries. The flow passage, filter and nozzles are precisely etched on the layers of the silicon wafers and assembled through silicon fusion bonding without additional adhesives. The piezoelectric is screen-printed on the top the pressure chamber and the nozzle plate surface is treated with non-wetting coating for jetting fluids. Printheads with nozzle number of 16 to 256 have been developed to get the drop volume range from 5 pL to 80 pL in various industrial applications. Currently our printheads are successfully utilized to fabricating color-filters and PI alignment layers in LCD Flat Panel Display and legend marking for PCB in Samsung Electronics.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Proceedings of the Korea Water Resources Association Conference
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• 2004.05b
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• pp.1173-1177
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• 2004

현재 다양한 분야에서 널리 사용되고 있는 지하투과레이더(Ground Penetrating Radar, GPR)를 이용하여 지하수면 및 함수량을 추정하였다. 비피압대수층 내에서의 얕은 포화대(saturated zone) 깊이을 산정하는 연구(livari and Doolittle, 1994, van Overmeeren, 1994)와 포화대 상부 습윤대(wetting fronts)의 거동를 조사한 연구(Vellidis et al, 1990) 등에 활용된 바 있는 GPR 기숙을 바탕으로 비피압대수층의 통기대와 포화대 내의 함수량 및 지하수면 추정을 위한 기초 실험을 수행하였다. 지하수면 및 함수량의 현장 적용성을 검증하기 위해서는 시간과 경제적인 면에서 비효율적인 점을 고려하여 사질토로 구성된 실험용 토조를 제작하여 건조시 획득된 GPR 자료, 지하수면의 변화에 따른 GPR 이미지를 비교하여 그 적용성을 검토하고 시${\cdot}$공간적 지하수면의 정확한 추정을 위해서 삼차원으로 비교${\cdot}$검토할 수 있도록 하였으며, GPR 자료의 정확성을 검증하기 위해서 토조 하부에 액주계(piezometer)를 설치하였다. 본 연구에서 적용된 GPR 실험은 획득된 이미지의 해석에 다소 어려움이 있지만 토양을 교란시키지 않고 비교적 간편하게 함수랑 및 지하수면의 위치를 파악하는데 매우 효과적이며, 추가적으로 GPR을 이용한 다양한 실험이 수행된다면 GPR 기술은 향후 기존 방법에서 쉽게 판단하기 어려운 시${\cdot}$공간적인 함수량 및 지하수의 분포 특성을 효율적으로 파악하는데 매우 큰 도움을 줄 수 있을 것이다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.26-26
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• 2011

Self-assembled monolayers (SAMs) prepared by sulfur-containing organic molecules on metal surfaces have drawn much attention for more than two decades because of their technological applications in wetting, chemical and biosensors, molecular recognition, nanolithography, and molecular electronics. In this talk, we will present self-assembly mechanism and two-dimensional (2D) structures of various organic thiol SAMs on Au(111), which are mainly demonstrated by molecular-scale scanning tunneling microscopy (STM) observation. In addition, we will provide some idea how to control 2D molecular arrangements of organic SAMs. For instance, the formation and surface structure of pentafluorobenzenethiols (PFBT) self-assembled monolayers (SAMs) on Au(111) formed from various experimental conditions were examined by means of STM. Although it is well known that PFBT molecules on metal surfaces do not form ordered SAMs, we clearly revealed for the first time that adsorption of PFBT on Au(111) at $75^{\circ}C$ for 2 h yields long-range, well-ordered self-assembled monolayers having a $(2{\times}5\sqrt{13})R30^{\circ}$ superlattice. Benzenethiols (BT) SAMs on gold usually have disordered phases, however, we have clearly demonstrated that the displacement of preadsorbed cyclohexanethiol self-assembled monolayers (SAMs) on Au(111) by BT molecules can be a successful approach to obtain BT SAMs with long-range ordered domains. Our results will provide new insight into controlling the structural order of BT or PFBT SAMs, which will be very useful in precisely tailoring the interface properties of metal surfaces in electronic devices.

• Fibers and Polymers
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• v.7 no.3
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• pp.286-294
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• 2006

This study has examined the flexural properties of natural and chemically modified coir fiber reinforced cementitious composites (CFRCC). Coir fibers of two different average lengths were used, and the longer coir fibers were also treated with a 1% NaOH solution for comparison. The fibers were combined with cementitious materials and chemical agents (dispersant, defoamer or wetting agent) to form CFRCC. The flexural properties of the composites, including elastic stress, flexural strength, toughness and toughness index, were measured. The effects of fiber treatments, addition of chemical agents and accelerated ageing of composites on the composites' flexural properties were examined. The results showed that the CFRCC samples were 5-12 % lighter than the conventional mortar, and that the addition of coir fibers improved the flexural strength of the CFRCC materials. Toughness and toughness index, which were associated with the work of fracture, were increased more than ten times. For the alkalized long coir fiber composites, a higher immediate and long-term toughness index was achieved. SEM microstructure images revealed improved physicochemical bonding in the treated CFRCC.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.783-788
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• ETRI Journal
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• v.32 no.3
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• pp.414-421
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• 2010

The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.

• Electrical & Electronic Materials
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• v.7 no.4
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• pp.331-340
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• 1994

Polysilicon on insulator has been recrystallized by zone melting recrystallization method with graphite strip heaters. Experiments are performed with non-seed SOI structures. When the capping layer thickness of Si$\_$3/N$\_$4//SiO$\_$2/ is 2.0.mu.m, grain boundaries are about 120.mu.m spacing and protrusions reduced. After the seed SOI films are annealed at 1100.deg. C in NH$\_$3/ ambient for 3 hours, the recrystallized silicon surface has convex shape. After ZMR process, the tensile stress is 2.49*10$\^$9/dyn/cm$\^$2/ and 3.74*10$\^$9/dyn/cm$\^$2/ in the seed edge and seed center regions. The phenomenon of convex shape and tensile stress difference are completely eliminated by using the PSG/SiO$\_$2/ capping layer. The characterization of SOI films are showed that the SOI films are improved in wetting properties. N channel SOI MOSFET has been fabricated to investigate the electrical characteristics of the recrystallized SOI films. In the 0.7.mu.m thickness SOI MOSFET, kink effects due to the floating substrate occur and the electron mobility was calculated from the measured g$\_$m/ characteristics, which is about 589cm$\^$2//V.s. The recrystallized SOI films are shown to be a good single crystal silicon.

• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.