• Journal of Welding and Joining
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• v.16 no.6
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• pp.77-85
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• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.1-6
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• 2019

Wettability is an important factor to decide solderability of solder, flux, other soldering-related materials and soldering conditions. The wettability also affects the reliability of solder joint. Wetting balance test is a good method for quantitatively measuring wettability between solder and substrate. The wetting balance test is easy to reproduce the wetting experiment and to measure the wetting time and force. And this test provides wetting curve to calculate the surface tension of the molten solder. Development of new solder has been continued in accordance with various and harsh environment in the electronics industry. In this paper, the principle of wetting balance test and recent research issues including nano-composite solder are explained.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.05a
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• pp.25-33
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• 2002

Effect of surface topography on the water wetting nature and micro/nano tribological characteristics of Si-wafer and PTFE was experimentally studied. The ion beam treatment was performed with a hollow cathode ion gun in different argon don dose conditions in a vacuum chamber to change the surface topography, Micro/nano tribological characteristics, water wetting angles and roughness were measured with a micro tribo tester, SPM (scanning prove microscope), contact anglemeter and profilometer, respectively. Results showed that surface roughness increased with the argon ion dose. The water wetting angle of tile ion beam treated samples also increased with the ion dose. Results also showed that micro-adhesion and micro-friction depend on the wetting characteristics of the PTFE samples. However, nano-triboloSical characteristics showed little dependence on the wetting angles. The water wetting characteristics of modified PTFE samples were discussed in terms of the surface topographic characteristics.

• KSTLE International Journal
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• v.3 no.1
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• pp.12-16
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• 2002

Micro/nano tribological and water wetting characteristics of ion beam treated PTFE (polytetrafluoroethylene) surfaces were experimentally studied. The ion beam treatment was performed with a hollow cathode ion gun at different argon ion dose conditions in a vacuum chamber to modify the topography of PTFE surface. Micro/nano tribological characteristics, water wetting angles and roughness were measured with a micro tribe tester, SPM (scanning probe microscope), contact anglemeter and profilometer, respectively. Results showed that surface roughness increased with the argon ion dose. Water wetting angle of the ion beam treated samples increased with the ion dose, so the surface shows an ultra-hydrophobic nature. Micro-adhesion and micro-friction depend on the wetting characteristics of the PTFE samples. However, nano-tribological characteristics showed different results. The scale effect of surface topography on tribological characteristics was discussed. Also, the water wetting characteristics of modified PTFE samples were discussed in terms of the surface topographic characteristics.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.1-9
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• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.47-53
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• 2000

The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.186-186
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• 2011

최근 전자제품의 소형화로 인해 패키징 방법 또한 고밀도 실장법이 연구되고 있다. 고밀도실장을 위해 칩과 솔더간의 간격이 줄어들고, 칩의 두께 또한 얇아지고 있다. 칩과 회로간 연결 소재로는 주석 계열 솔더가 사용 중인데, 고밀도 실장을 위해 산업계에서는 미세 피치에 적합한 솔더를 이용하고 있다. 이에 대한 기초 연구로 순도가 높은 Sn의 wetting 및 기초 솔더링 특성을 평가하였다. 솔더의 spreading, wetting 시험을 실시하였으며, EDS 및 EPMA의 성분분석 평가도 실시하였다.

• Korean Journal of Materials Research
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• v.31 no.1
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• pp.38-42
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• 2021

In this study, high temperature wetting analysis and AZ80/Ti interfacial structure observation are performed for the mixture of AZ80 and Ti, and the effect of Al on wetting in Mg alloy is examined. Both molten AZ80 and pure Mg have excellent wettability because the wet angle between molten droplets and the Ti substrate is about 10° from initial contact. Wetting angle decreases with time, and wetting phenomenon continues between droplets and substrate; the change in wetting angle does not show a significant difference when comparing AZ80-Ti and Mg-Ti. As a result of XRD of the lower surface of the AZ80-Ti sample, in addition to the Ti peak of the substrate, the peak of TiAl3, which is a Ti-Al intermetallic compound, is confirmed, and TiAl3 is generated in the Al enrichment region of the Ti substrate surface. EDS analysis is performed on the droplet tip portion of the sample section in which pure Mg droplets are dropped on the Ti substrate. Concentration of oxygen by the natural oxide film is not confirmed on the Ti surface, but oxygen is distributed at the tip of the droplet on the Mg side. Molten AZ80 and Ti-based compound phases are produced by thickening of Al in the vicinity of Ti after wetting is completed, and Al in the Mg alloy does not affect the wetting. The driving force of wetting progression is a thermite reaction that occurs between Mg and TiO2, and then Al in AZ80 thickens on the Ti substrate interface to form an intermetallic compound.

• KSTLE International Journal
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• v.9 no.1_2
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• pp.22-25
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• 2008

This paper investigated the wetting and adhesion property of undulated DLC film with surface morphology controlled for a reduced real area of contact. The undulated DLC Films were prepared by 13.56 MHZ radio frequency plasma enhanced chemical vapor deposition (r.f. PECVD) by using nanoscale Cu dots surface on a Si (100) substrate. FE-SEM, AFM analysis showed that the after repeated deposition and plasma induced damage with Ar ions, the surface was nanoscale undulated. This phenomenon changed the surface morphology of DLC surface. Raman spectra of film with changed morphology revealed that the plasma induced damage with Ar ions significantly suppressed the graphitization of DLC structure. Also, it was observed that while the untreated flat DLC surfaces had wetting angle starting ranged from $72^{\circ}$ and adhesion force of 333ni. Had wetting angle the undulated DLC surfaces, which resemble the surface morphology of a cylindrical shape, increased up to $104^{\circ}$ and adhesion force decreased down to 11 nN. The measurements agree with Hertz and JKR models. The surface undulation was affected mainly by several factors: the surface morphology affinity to cylindrical shape, reduction of the real area of contact and air pockets trapped in cylindrical asperities of the surface.

• Journal of the Korean institute of surface engineering
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• v.16 no.2
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.