• Journal of Biosystems Engineering
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• v.38 no.2
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• pp.87-94
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• 2013

Purpose: Pineapple is now the third most important tropical fruit in world production after banana and citrus. Phytosanitary irradiation is recognized as a promising alternative treatment to chemical fumigation. However, most of the phytosanitary irradiation studies have dealt with physiochemical properties and its efficacy. Accurate dose calculation is crucial for ensuring proper process control in phytosanitary irradiation. The objective of this study was to optimize phytosanitary irradiation treatment of pineapple in various radiation sources using Monte Carlo simulation. Methods: 3-D geometry and component densities of the pineapple, extracted from CT scan data, were entered into a radiation transport Monte Carlo code (MCNP5) to obtain simulated dose distribution. Radiation energy used for simulation were 2 MeV (low-energy) and 10 MeV (high-energy) for electron beams, 1.25 MeV for gamma-rays, and 5 MeV for X-rays. Results: For low-energy electron beam simulation, electrons penetrated up to 0.75 cm from the pineapple skin, which is good for controlling insect eggs laid just below the fruit surface. For high-energy electron beam simulation, electrons penetrated up to 4.5 cm and the irradiation area occupied 60.2% of the whole area at single-side irradiation and 90.6% at double-side irradiation. For a single-side only gamma- and X-ray source simulation, the entire pineapple was irradiated and dose uniformity ratios (Dmax/Dmin) were 2.23 and 2.19, respectively. Even though both sources had all greater penetrating capability, the X-ray treatment is safer and the gamma-ray treatment is more widely used due to their availability. Conclusions: These results are invaluable for optimizing phytosanitary irradiation treatment planning of pineapple.

• Korean Journal of Food Science and Technology
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• v.27 no.5
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• pp.680-689
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• 1995

Rice based infant foods of carrot, of beef, and of egg for 4-6 month old infants were prepared using freeze drying (FD) process. The optimum moisture content prior to FD and the plate temperature in the drier were determined with the use of response surface methodology. For all the infant foods under this study, FD time was longer as the initial moisture content was higher and the plate temperature was lower. Brittleness of the dried infant foods increased as the moisture content decreased and the plate temperature increased. Among the sensory attributes, hydration rate, uniformity, and smoothness were greater with increased moisture content and with decreased plate temperature. Ease to spoon increased as moisture content increased and mouthcoating increased as both the moisture content and the plate temperature increased. Optimum moisture content and plate temperature for the FD of carrot, beef and egg foods were 88.5% and $34^{\circ}C$, 88.5% and $28^{\circ}C$, and 87.3% and $39^{\circ}C$, respectively.

• Korean Journal of Materials Research
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• v.8 no.6
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• pp.499-504
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• 1998

For the formation of cobalt polycide gate electrode, CoSi, was grown on columnar poly-Si, granular poly-Si or amorphous Si by depositing either Co monolayer or Co/Ti bilayer and its thermal stability was compared to study effects of the substrate crystallinity and the silicide formation method. When specimens were rapidly heat-treated at 90$0^{\circ}C$ up to 600 seconds, using amorphous Si or Co/Ti on all substrates improved the thermal stability. This was attributed to the uniform chemical composition of initial CoSi, and its smooth interface with the substrates, induced by smooth and clean Si surface and delayed Co diffusion. The main factors determining the thermal stability were found to be composition uniformity and smooth interface of $CoSi_2$, intially formed at the early stage of the heat-treatment.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.151-155
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• 2009

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

• Elastomers and Composites
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• v.45 no.1
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• pp.17-24
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• 2010

Herein, the effect of the dispersion uniformity of the multi-wall carbon nanotube (MWCNT) on the thermal and electrical conductivity of polystyrene (PS)/MWCNT composite was investigated. The PS/MWCNT composites were prepared by solution mixing from dispersions of various MWCNTs in PS/tetrahydrofuran (THF) solution. Three types of MWCNTs were used; pristine MWCNT, hydroxyl functionalized MWCNT, which was functionalized with $KMnO_4$ in the presence of a phase transfer catalyst at room temperature, and pristine MWCNT with BYK-9077 as a dispersant. It was found that the stable dispersion state of MWCNT in PS/THF solutions significantly improved the thermal and electrical conductivity of the ultimate composites. It is noted that the thermal and electrical conductivity of PS/3 wt% pristine MWCNT composite with BYK-9077 were about 9.4 and 30~50% higher than those of PS/3 wt% pristine MWCNT composite, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.27 no.8
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• pp.395-401
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• 2015

Recently, many research studies have been carried out on the efficiency of light-shelf daylighting systems, especially comparing performance improvements and the limitations of reflective surfaces and their lighting performance. In this study, a crystal face reflective surface is proposed. The objective of the study is to evaluate the lighting performance of a crystal face light-shelf through a performance study. The performance study was carried out in a full scale test-bed in order to calculate the light distribution and energy consumption utilizing the standard indoor illumination as an index. The conclusions of the performance study are as follows. 1) The optimal angle of incidence for daylighting for both the operable flat type light-shelf and the crystal face light-shelf are taken in the natural environment on the dates of the winter and summer solstices, as well as the autumn and spring equinoxes. 2) The application and installation of the crystal face light-shelf can produce a 29.9%~34.3% increase of light distribution within the indoor space. However, the increase of light distribution can also lead to a decrease in the uniformity ratio, a design challenge that should be considered when applying a crystal face light-shelf. 3) It is possible to achieve a 7.98%~13.3% greater reduction in energy consumption when applying a crystal face light-shelf than when applying a flat type light-shelf. The increase in the number of crystal faces should concur with the analysis of the energy reduction. A limitation of the study is that only one predetermined pattern was performance tested for a crystal face light-shelf. In order to carry out further research on crystal face light-shelves, additional performance studies are needed based on alternative patterns and designs.

• Journal of Microbiology
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• v.40 no.2
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• pp.119-124
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• 2002

Experiments for the characterization of inactivation were performed in a series of batch processes with the total coliform used as a general indicator organism based on the chlorine residuals as a disinfectant. The water samples were taken from the outlet of a settling basin in a conventional surface water treat- ment system that is provided with the raw water drawn from the mid-stream of the Han River, The inactivation of total coliform was experimentally analysed for the dose of disinfectants contact time, filtration and mixing intensity. The curves obtained from a series of batch processes were shaped with a general tailing-off and biphasic mode of inactivation, i.e. a sharp loss of bacterial viability within 15 min followed by an extended phase. In order to observe the effect of carry-over suspended solids on chlorine consumption and disinfection efficiency, the water samples were filtered, prior to inoculation with coliforms, with membranes of both 2.5$\mu$m and 11.0 $\mu$m pore size, and with a sand tilter of 1.0 mm in effective size and of 1.4 in uniformity coefficient. As far as the disinfection efficiency is concerned, there were no significant differences. The parameters estimated by the models of Chick-Wat-son, Hom and Selleck from our experimental data obtained within 120 min are: log(N/N$\_$0/)=-0.16CT with n=1, leg(N/N$\_$0/)=-0.71C$\^$0.87/ with n 1 for the Chick-Watson model, log (N/N$\_$0/)=-1.87C$\^$0.47/ T$\^$0.36/ for the Hom model, log (MHo)=-2.13log (1+CT/0.11) for the Selleck model. It is notable that among the models reviewed with regard to the experimental data obtained, the Selleck model appeared to most closely resemble the total coliform survival curve.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.6
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• pp.367-374
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• 2000

This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.844-848
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• 2012

Encapsulant curing in terms of convection oven leads to thermal induced stress due to nonuniform thermal conductivity in LED package. We have adopted infrared (IR) light for silicone curing in order to release the stress. The light uniformity irradiated on an encapsulant surface is confirmed to be uniform by optical simulation. Shear strength of die paste using IR compared to convection oven is increased 19.2% at the same curing time, which indicates curing time can be shortened. The indentation depth difference between center and edge of silicone encapsulant in terms of convection oven and IR are 14.8% and 3.4%, respectively. Curing by IR also shows 2.3% better radiant flux persistency rate of LED at $85^{\circ}C$ after 1,000 h reliability test compared to convection curing.

• Transactions on Electrical and Electronic Materials
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• v.18 no.3
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• pp.125-128
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• 2017

This study is on how ohmic area etching affects the buffer breakdown voltage of AlGaN/GaN HEMT. The surface morphology of the ohmic metal can be improved by whole etching on the ohmic area. The buffer breakdown voltages of the samples with whole etching on the ohmic area were improved by the suppression of the metal spikes formed under the ohmic contact regions during high-temperature annealing. The samples with selective etching on the ohmic area were investigated for comparison. In addition, the buffer leakage currents were measured on the different radii of the wafer, and the uniformity of the buffer leakage currents on the wafer were investigated by PL mapping measurement.