• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.34-46
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• 2004

Copper films were prepared by using ECR-MOCVD(Electron Cyclotron Resonance Metal Organic Chemical Vapor Deposition) coupled with a DC bias system. The DC bias is connected to the electrode which placed 1∼3cm above the polymer substrate. The pulse electrical field around the electrode attracts the positive charged copper ions generated from the dissociation of copper precursor, $Cu(hfac)_2$, under ECR plasma. Condensation of supersaturated copper ions in the space between the electrode and substrate, makes it possible to deposit copper film on the polymer substrate even at room temperature. In this study, optimization of the electrode configuration was carried out in order to obtain the uniform films. The uniformity of the deposited films were closely related to the parameters of electrode geometry such as electrode shape, thickness, grid size and the spacing between electrodes. The most uniform copper film was observed with the electrode that enabled uniform electrical field distribution across the whole dimension of electrode.

• International conference on construction engineering and project management
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• 2022.06a
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• pp.784-791
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• 2022

Tack coat is a thin layer of asphalt between the existing pavement and asphalt overlay. During construction, insufficient tack coat layering can later cause surface defects such as slippage, shoving, and rutting. This paper proposed a method for tack coat inspection improvement using an unmanned aerial vehicle (UAV) and deep learning neural network for automatic non-uniform assessment of the applied tack coat area. In this method, the drone-captured images are exploited for assessment using a combination of Mask R-CNN and Grey Level Co-occurrence Matrix (GLCM). Mask R-CNN is utilized to detect the tack coat region and segment the region of interest from the surroundings. GLCM is used to analyze the texture of the segmented region and measure the uniformity and non-uniformity of the tack coat on the existing pavements. The results of the field experiment showed both the intersection over union of Mask R-CNN and the non-uniformity measured by GLCM were promising with respect to their accuracy. The proposed method is automatic and cost-efficient, which would be of value to state Departments of Transportation for better management of their work in pavement construction and rehabilitation.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.10a
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• pp.56-56
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• 1999

For advanced TFT-LCD manufacturing processes, dry etching of thin-film layers(a-Si, $SiN_x$, SID & gate electrodes, ITO etc.) is increasingly preferred instead of conventional wet etching processes. To dry etch Al gate electrode which is advantageous for reducing propagation delay time of scan signals, high etch rate, slope angle control, and etch uniformity are required. For the Al gate electrode, some metals such as Ti and Nd are added in Al to prevent hillocks during post-annealing processes in addition to gaining low-resistivity($<10u{\Omega}{\cdot}cm$), high performance to heat tolerance and corrosion tolerance of Al thin films. In the case of AI-Nd alloy films, however, low etch rate and poor selectivity over photoresist are remained as a problem. In this study, to enhance the etch rates together with etch uniformity of AI-Nd alloys, magnetized inductively coupled plasma(MICP) have been used instead of conventional ICP and the effects of various magnets and processes conditions have been studied. MICP was consisted of fourteen pairs of permanent magnets arranged along the inside of chamber wall and also a Helmholtz type axial electromagnets was located outside the chamber. Gas combinations of $Cl_2,{\;}BCl_3$, and HBr were used with pressures between 5mTorr and 30mTorr, rf-bias voltages from -50Vto -200V, and inductive powers from 400W to 800W. In the case of $Cl_2/BCl_3$ plasma chemistry, the etch rate of AI-Nd films and etch selectivity over photoresist increased with $BCl_3$ rich etch chemistries for both with and without the magnets. The highest etch rate of $1,000{\AA}/min$, however, could be obtained with the magnets(both the multi-dipole magnets and the electromagnets). Under an optimized electromagnetic strength, etch uniformity of less than 5% also could be obtained under the above conditions.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.3
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• pp.289-294
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• 2012

There are several indicators to represent characteristics of chemical mechanical planarization (CMP) such as material removal rate (MRR), surface quality and removal uniformity on a wafer surface. Especially, the removal uniformity on the wafer edge is one of the most important issues since it gives a significant impact on the yield of chip production on a wafer. Non-uniform removal rate at the wafer edge (edge effect) is mainly induced by a non-uniform pressure from nonuniform pad curvature during CMP process, resulting in edge exclusion which means the region that cannot be made to a chip. For this reason, authors tried to minimize the edge exclusion by using an edge profile control (EPC) ring. The EPC ring is equipped on the polishing head with the wafer to protect a wafer from the edge effect. Experimental results showed that the EPC ring could dramatically minimize the edge exclusion of the wafer. This study shows a possibility to improve the yield of chip production without special design changes of the CMP equipment.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.81-86
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• 2004

A new method to improve the wet etching characteristics is described. The anisotropic wet-etching of (100) Si with megasonic wave has been studied in KOH solution. Etching characteristics of p-type (100) 6 inch Si have been explored with and without megasonic irradiation. It has been observed that megasonic irradiation improves the characteristics of wet etching such as an etch uniformity and surface roughness. The etching uniformity on the whole wafer with and without megasonic irradiation were less than ${\pm}1\%$ and more than $20\%$, respectively. The initial root-mean-square roughness($R_{rms}$) of single crystal silicon is 0.23 nm. It has been reported that the roughnesses with magnetic stirring and ultrasonic agitation were 566 nm and 66 nm, respectively. Comparing with the results, etching with megasonic irradiation achieved the Rrms of 1.7 nm on the surface after the $37{\mu}m$ of etching depth. Wet etching of silicon with megasonic irradiation can maintain nearly the original surface roughness after etching process. The results have verified that the megasonic irradiation is an effective way to improve the etching characteristics such as etch uniformity and surface roughness.

• Journal of Bio-Environment Control
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• v.28 no.4
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• pp.335-341
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• 2019

In order to provide basic data for uniformization of temperature distribution in heating greenhouses, heating experiments were performed in two greenhouses with a hot water heating system. By analyzing heat transfer characteristics and improving pipes layout, measures to reduce the variation of pipe surface temperature and to improve the uniformity were derived. As a result of analyzing the temperature distributions of two different greenhouses and examining the maximum deviation and uniformity, it was found that the temperature deviation of greenhouses with a large amount of hot water flow and a short heating pipe was small and the uniformity was high. And it was confirmed that the temperature deviation was reduced and the uniformity was improved when the circulating fan was operated. The correlation between the surface temperature of the heating pipe and the indoor air temperature was a positive correlation and statistically significant(p<0.01) in both greenhouses. It was confirmed that the indoor temperature distribution in a hot water heating greenhouse was influenced by the surface temperature distribution of heating pipe, and the uniformity of indoor temperature distribution could be improved by arranging the heating pipe to minimize the temperature deviation. Analysis of the heat transfer characteristics of heating pipe showed that the temperature deviation increased as the pipe length became longer and the temperature deviation became smaller as the flow rate in pipe increased. Therefore, it was considered that the temperature distribution and the uniformity of environment in a greenhouse could be improved by arranging the heating pipe to shorten the length and controlling the flow velocity in pipe. In order to control the temperature deviation of one branch pipe within $3^{\circ}C$ in the tube rail type hot water heating system most used in domestic greenhouses, when the flow velocity in the pipe is 0.2, 0.4, 0.6, 0.8, $1.0m{\cdot}s^{-1}$, the length of a heating pipe should be limited to 40, 80, 120, 160, 200m, respectively.

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.301-305
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• 2009

The novel carbon coating process for interlayer of fiber reinforced ceramic composites between fiber and matrix was performed by carbonizing phenolic resin solution that coated on fiber surface in $N_2$ atmosphere at $600^{\circ}C$ to improve the strength and fracture toughness of CMC(ceramic matrix composite). 160 nm carbon layer was coated on fiber surface with 5 vol% of phenolic resin solution. Since the process temperature ($600^{\circ}C$) is lower than chemical vapor deposition($900{\sim}1000^{\circ}C$), the strength and toughness could be preserved. Furthermore the coating thickness uniformity was improved to 8% of deviation along the stacking sequence. Therefore, prevention from fiber degradation during coating process and controlling coating thickness uniformity along the preform depth were achieved by coating with phenolic resin carbonizing method.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.13 no.2
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• pp.1-6
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• 1999

Average illuminaoce and luminance can be calculated by grarhical rrethods to a certain extent, but to calculate for a wide place, a suitable software is needed. Softwares suitable for this purpose have been already developed in foreign nations, but the appropiate softwares for domestic use have not been developed 1berefore a program is develqJed which is executable in Hangul Windows. The softwares LAPRoad, is develqJed to calculate luminaoce and illuminance distribution of road surlace, as well as average luminance and illuminance, overall uniformity, longitudinal uniformity, threshold increement, veilling luminance, and glare. And an apparatus that measures road surface reflection properties is developed. Because the road surlace reflection properties is very important in luminance calculation, then concrete road surlace reflection properties were measered.asered.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.86-89
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• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.

• Transactions on Control, Automation and Systems Engineering
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• v.2 no.4
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• pp.268-273
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• 2000

Plasma models are crucial to equipment design and process optimization. A radial basis function network(RBFN) in con-junction with statistical experimental design has been used to model a process plasma. A 2$^4$ full factorial experiment was employed to characterized a hemispherical inductively coupled plasma(HICP) in characterizing HICP, the factors that were varied in the design include source power, pressure, position of shuck holder, and Cl$_2$ flow rate. Using a Langmuir probe, plasma attributes were collected, which include typical electron density, electron temperature. and plasma potential as well as their spatial uniformity. Root mean-squared prediction errors of RBEN are 0.409(10(sup)12/㎤), 0.277(eV), and 0.699(V), for electron density, electron temperature, and Plasma potential, respectively. For spatial uniformity data, they are 2.623(10(sup)12/㎤), 5.704(eV) and 3.481(V), for electron density, electron temperature, and plasma potential, respectively. Comparisons with generalized regression neural network(GRNN) revealed an improved prediction accuracy of RBFN as well as a comparable performance between GRNN and statistical response surface model. Both RBEN and GRNN, however, experienced difficulties in generalizing training data with smaller standard deviation.