• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.1
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• pp.62-67
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• 2011

Grinding process is executed in the final machining stage to meet the quality requirements. In generally the ground surface of workpiece is affected by dressing condition as well as grinding condition. In order to estimate the roughness of workpiece, the several roughness models have been researched. These models defined the specific parameters and considered the several parameters which affect to roughness as multiply relationship among them. However, the multiply relationship among parameters is not enough to show the complicated grinding mechanism. Therefore, the neural network algorithm is used in this paper to predict the ground roughness for the plunge grinding. The proposed structure is composed of the initial roughness as well as final roughness model. The input parameters of proposed neural network are referred with the existing roughness model's. The performance of the proposed model is verified through experiments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.290-290
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• 2009

Blu-ray Disk, the next generation optical information storing equipment used Blu-ray is the next generation leading storing equipment that has capacity is about from six times to thirty-five times bigger than the existing CDs, DVDs. Especially, we need elaborate optical pick-Up equipment to record and recognize detailed date. Moreover, Blu-ray disk has so narrow track-pitch so it is used high NA(Numerical Aperture) aspheric glass objective lens. In this research, we processed optical pick-up aspheric glass objective lens molding press core by parallel grinding method with ultra precision machining and mold core surface measured form accuracy(PV), surface roughness(Ra).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.999-1002
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• 1997

In this study, in order to set ELID conditions in the internal grinding wheel, the characteristics with the variations of grit size, output voltage and peak current were examined by using conventional machining center(M/C) equipped with electrolytic in-process dressing(EL1D). The initial working voltage was lowered and the working current was high with increasing grit size. The insulating layer thickness increased, as the final voltage increased with the output voltage and peak current. The initial wear rate of the wheel machined with ELID were measured indirectly by using surface roughness tracer. The initial wear rate of the wheel with ELID increased along with high grit size. In case that the grit size with ELID was low, the output voltage and peak current had to be increased to increase the insulating layer thickness. In case of the high grit size, the output voltage and the peak current were established low, which made the insulating layer thickness decreased.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.11
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• pp.893-898
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• 2016

Plastic array lens are cheap to manufacture; however, plastic is not resistant to high temperatures and moisture. Optical glass represents a better solution but is a more-expensive alternative. Glass array lens can be produced using lithography or precision-molding techniques. The lithography process is commonly used, for instance, in the semiconductor industry; however, the manufacturing costs are high, the processing time is quite long, and spherical aberration is a problem. To obtain high-order aspherical shapes, mold-core manufacturing is conducted through ultra-precision grinding machining. In this paper, a $4{\times}1$ mold core was manufactured using an ultra-precision machine with a jig for the injection molding of an aspherical array lens. The machined mold core was measured using the Form TalySurf PGI 2+ contact-stylus profilometer. The measurement data of the mold core are suitable for the design criterion of below 0.5 um.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.18-22
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by grinding, lapping and polishing. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. This mechanical stress and strain can be cured by thermal anneal ing process. The sapphire crystalline wafers were annealed at $1100~1400^{\circ}C$ and then characterized by double crystal X-ray diffraction. The sample showed good quality of crystalline wafer surface wi th full width at hal f maximum of 16 arcsec for the 4-hour heat-treatment at $1300^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.04b
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• pp.108-113
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• 1993

The material for the machine tool structure should have high static stiffiness and damping in its property to improve both the static and dynamic performances. The static stiffness of a machine tool can be inceased by using either higher modulus material in the structure of a machine tool. However, the machine tool structrue with high stiffness but low damping is vulnerable to vibration at the resonance frequencies of the structure . For the high precision and highsped machine tool structure, therefore, the high damping capacity is most important in order to suppress vibration. The damping of a machine tool can not be increased by increasing the static stiffness. The best way to increase the damping capacity of the machine tool structure is to use a composite material which is composed of on material with high stiffness with low damping and another material with low stiffness with high damping. Therefore, in this paper, the bed of the ultra high precision grinding machine for mirror surface machining of brittle materials such as ceramics and composite materials was designed and manufactured with the epoxy concrete material. The epoxy concrete material was prepared by mixing epoxy resin with different size sands and gravels. The modulus, compressive strength, coefficient of thermal expansion, specific heat, and damping factor were measured by varying the compaction ratio, sizes and contents of the ingredients to assess the effect of the processing parameters on the mechanical properties of the material. Based of the measured properties, the prototype epoxy resin concrete bed for the mirror surface CNC grinding machine was designed and manufactured.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.12
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• pp.39-46
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• 2008

Asymmetric glass lens core for portable projection optic system was designed and simulated. And it was machined by newly developed non-rotational ultra precision grinding method. With the designed lens data which optimized for multi-collimation, we generated the we core surface data. Mold pressing conditions analyzed by FEM. In the machining process, ground profile errors were compensated based on measured data, minimized feed rate and depth of cut. The deviations of machined core profile were acceptable level for glass mold press. Mold pressed glass array lens was coated with $SiO_2\;and\;Ta_2O_5$ for anti-reflection.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.46-52
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• 2005

The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology, The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 mV without the slurry in deionized water and was -37.05 mV for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 mV, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1∼4$\AA$.

• Journal of the Korean Society of Safety
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• v.24 no.2
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• pp.7-12
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• 2009

The machining process of ceramics can be characterized by cracking and brittle fracture. In the machining of ceramics, edge chipping and crack propagation are the principal reasons to cause surface integrity deterioration. Such phenomenon can cause not only poor dimensional and geometric accuracy, but also possible failure of the ceramic parts. Thus, traditional ceramics are very difficult-to-cut materials. Generally, ceramics are machined using conventional method such as grinding and polishing. However these processes are generally costly and have low MRR(material removal rate). To overcome such problems, in this paper, h-BN powder, which gives good cutting property, is added for the fabrication of machinable ceramics by volume of 10 and 15%. The purpose of this study is an analysis of endmill's rake angle for appropriate tools design and manufacturing for the machinable ceramics. In this study, Experimental works are executed to measure cutting force, surface roughness, tool fracture, on different axial rake angle of endmills. Cutting parameters, namely, feed, cutting speed and depth of cut are used to accomplish purpose of this paper. Required experiments are performed, and the results are investigated.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.770-776
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• 2003

#140 mesh and #600 mesh wheels were adopted to grind (111) and (100) oriented single crystalline silicon wafer and the grinding induced change of the surface integrity was investigated. For this purpose, microroughness, residual stress and phase transformation were analyzed for the ground surface. Microroughness was analyzed using AFM (Atomic Force Microscope) and crystal structure was analyzed using micro-Raman spectroscopy. The residual stress and phase transformation were also analyzed after thermal annealing in the air. As a result, microroughness of (111) wafer was larger than that of (100) wafer after grinding. It was observed using Raman spectrum that the silicon was transformed from diamond cubic Si-I to Si-III(body centered tetragonal) or Si-XII(rhombohedral). Residual stress relaxation was also shown in cavities which were produced after grinding. The thermal annealing was effective for the recovery of the silicon phase to the original phase and the residual stress relaxation.