• Title/Summary/Keyword: surface grinding machining

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Effects of the Surface Grinding Conditions on the Machining Elasticity Parameter (평면연삭조건이 가공탄성계수에 미치는 영향)

  • 임관혁;김강
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.8
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    • pp.26-32
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    • 1998
  • The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed and depth of cut, on this parameter experimentally. Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

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The Performance Improvement of the Aspheric Form Accuracy by Compensation Machining Program (보정 가공 프로그램을 활용한 비구면 형상정밀도 향상에 관한 연구)

  • Park, Yo-Chang;Yang, Sun-Choel;Kim, Geon-Hee;Lee, Young-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.4 no.2
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    • pp.10-15
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    • 2005
  • For the development of compensation machining program, ultra precision grinding used in ultra precision machine and corrective machining was studied. We explored a new rough grinding technique on optical material such as zerodur. The facility used is a polishing machine with a custom grinding module and a range of diamond resin bond wheel. Surface roughness and form accuracy are measured by surface measurement equipment(Form Talysurf series2). Our compensation machining program has complied with a target of producing surface roughness better than $0.05{\mu}m$ Ra and form accuracy of around $0.05{\mu}m$ Rt and has been unveiled as a work-hour model.

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A Study on Machining Variable of centerless Grinding using for Ferrule Machining (페룰 가공용 무심연삭기의 가공변수에 관한 연구)

  • 박봉진;이은상;최헌종;이석우;조순주
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.28-31
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    • 2002
  • This paper compared the surface roughness with variables before development of centerless grinding using far ferrule machining. In this paper, theoretical surface roughness is obtained from variables such as mesh number, rate of concentration of grinding wheel, wheel rotation of work-piece etc., and optimum condition of machining is selected. For satisfaction the technical side and economical side, centerless grinding using fur ferrule machining should be designed more than #600, 18.8% rate of concentration of grinding wheel, 1440rpm wheel rotation outwork-piece.

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Effects of the Grinding Conditions on the Machining Elasticity Parameter

  • Kim, Kang
    • International Journal of Precision Engineering and Manufacturing
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    • v.4 no.3
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    • pp.62-67
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    • 2003
  • The grinding force generated during the grinding process causes an elastic deformation of the workpiece, grinding wheel, and machine system. Thus, the true depth of cut is always smaller than the apparent depth of cut. This is known as machining elasticity phenomenon. The machining elasticity parameter is defined as a ratio between the true depth of cut and the apparent depth of cut. It is an important factor to understand the material removal mechanism of the grinding process. To increase productivity, the value of this machining elasticity parameter must be large. Therefore, it is essential to know the characteristics of this parameter. The objective of this research is to study the effect of the major grinding conditions, such as table speed, depth of cut, on this parameter experimentally, Through this research, it is found that this parameter value is increasing when the table speed is decreasing or the depth of cut is increasing. Also, this parameter value depends on the grinding mode (up grinding, down grinding).

Mirror grinding with Electrolytic In-process Dressing Method (전해인프로세스드레싱에 의한 경면연삭기술개발)

  • 이응숙;제태진;강재훈
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.57-60
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    • 1995
  • Recently, ELID (electrolytic in-process dressing) grinding technique is developed. It is possible to make a efficient precision machining of hard materials such as ceramic hard metals, and quenched steels. This paper deals with some typical applications of ELID-grinding for cylindrcal machining. The significant advantages, performance and characteristics on mirror surface grinding for external surface are described.

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Surface grinding of WC-Co with high quality (WC-Co의 고품위 평면 연삭가공)

  • Heo, S.J.;Kang, J.H.;Kim, W.I.
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.5
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    • pp.42-55
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    • 1994
  • Presently, abrasive processing is on eof several methods for cutting and grinding brittle materials, and high quality in dimensional accuracy and surface roughness are often required as a structural components, therefore most of them has to be ground. In manufacturing of tungsten-carbide components, grinding by diamond wheel is usually adopted in order to provide configurational and dimensional accuracy to the components. The present study proposes the experi- mental research of optimum condition to the high quality surface grinding of the WC-Co material using diamond abrasive wheel in order to minimize the damage on the ground surface and to pursue the precise dimension by conventional grinding machine. Brief investigation is carried out to decrease the dressing is constant, theoretical grinding effect such as machining precision is changed according to the speed of workpiece. Accordingly, normal and tangential grinding forces, which are Fn, Ft were analyzed for the machining processes of WC-Co material to obtain optimum grinding conditions, 3-point bending test is carried out to check machining damage on the ground surface layer, which is one of sintered brittle materials.

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Force Modeling and Machining Characteristics of the Intermittent Grinding Wheels

  • Kwak, Jae-Seob;Ha, Man-Kyung
    • Journal of Mechanical Science and Technology
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    • v.15 no.3
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    • pp.351-356
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    • 2001
  • In the surface grinding operations, the grinding fluid cannot be supplied sufficiently in the cutting zone. Temperature generated in the cutting zone increases rapidly and causes thermal damage such as burning on the surface of a workpiece. To reduce thermal damage, the intermittent grinding wheels, which have an excellent cooling effect, have been applied. This paper describes machining characteristics by using intermittent grinding wheels. The grinding force of the intermittent wheels has been simulated by the SIMULAB, which is a program for simulating dynamic systems. Using the intermittent grinding wheels, the characteristics of grinding force, temperature, surface roughness, and geometric error have been evaluated experimently.

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Develvopment of Infeed Grinding Machine and Its Effects on Spherical Surface Grinding (구면 전용 Infeed 연삭기의 개발과 성능평가)

  • 이상직;정해도;최헌종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.1028-1032
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    • 1995
  • This paper describes the manufacture of spherical and aspherical surface on glass, superalloy and ceramic components. The rotationally symmetricallenses, and the ceramic or superalloy molds with spherical shapes are mainly generated by cutting processes on CNC lathe machine or 4,5 axis CNC machining centers. Recently, spherical shape parts require more precise and efficent machining technologies for wide material range such as optical lens of the lithography device in semiconductor manufacturing processes or the high precision mold machining of anti-chemical, anti-wear materials. In this paper, we introduce a newly developed infeed grinding machine with metal with metal bonded cup type wheel and its effects on spherical surface grinding.

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A five-axis CAM system for free-surface grinding (금형연마작업을 위한 5축 CAM 시스템)

  • 서석환;이민석;김두형
    • 제어로봇시스템학회:학술대회논문집
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    • 1993.10a
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    • pp.1024-1030
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    • 1993
  • In manufacturing press die with free surface, grinding operation is an important post process for surface finish and dimensional accuracy. With the advancement of NC technology. surface grinding operation is increasingly replaced by the gantry type manipulator. As the mechanics for grinding operation is different from machining operation, conventional CAM system for machining operation is hard to apply. In this. paper, we develop a five-axis CAM system by which an efficient gantry trajectory can be planned and verified. The developed system consists of four conceptual modules; namely CAD, PROCESS. CAM, and ANALYSIS. In the CAD module, the machined surface is represented by CL-data or surface modeler, and process parameters are specified by the PROCESS module. Then, the CAM module generates a series of grinding paths based on the grinding mechanics together with process databases for tool spaces and grinding conditions. The generated paths are verified via ANALYSIS module. Validation via real experiments is left for further study.

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Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine (로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성)

  • 박창수;김원일;이윤경;왕덕현;김경년
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.660-665
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    • 2002
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

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