• 한국전기전자재료학회논문지
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• 제23권1호
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• pp.6-9
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• 2010

Surface properties of polytetrafluoroethylene(PTFE) films fabricated by rf-magnetron sputtering system with UV surface treatment were investigated to increase water contact angle for their hydrophobic property. We found that the surface morphology and water contact angles of PTFE film modified as a function of the UV treatment times using UV-irradiation were influenced. The water contact angle of PTFE film with optimized UV treatment time for 15 minute showed a high hydrophobicity compared with the film without any surface treatment. We thought that it was due to the energy change of PTFE surface with an adhesion improvement to the glass surface as a smoothing a rough surface with needle-shape and/or the enhancement of an interface property as a removing some defects on the surface like a cleaning effect.

• 전자공학회논문지D
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• 제35D권5호
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• pp.33-39
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• 1998

The BST (Ba$_{1-x}$ Sr$_{x}$TiO$_{3}$)(50/50) thin film has been grown by RF magnetron reactive sputtering and its characteristics such as crystallization, surface roughness, and electrical properties have been investigated with varying the film thickness. The crystallization and surface roughness of BST thin film are investigated by using XRD and AFM, respectively The BST thin film anealed at 800.deg. C for 2 min has pure perovskite structure and good surface roughness of 16.1.angs.. We estimate that the thickness and dielectric constant of interface layer between BST film and electrode are 3nm and 18.9, respectively, by measuring the capacitance with various film thickness. As the film thickness increases form 80nm to 240nm, the dielectric constant at 10kHz increases from 199 to 265 and the leakage current density at 200kV/cm decreases from 0.682.mu.A/cm$^{2}$ to 0.181 .mu.A/cm$^{2}$. In the case of 240nm-thick BST thin film, the charge storage density and leakage current density at 5V are 50.5fC/.mu.m$^{2}$ and 0.182.mu.A/cm$^{2}$, respectively. The values indicate that the BST thin film is a very useful dielectric material for the DRAM capacitor.or.

• 대한기계학회논문집
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• 제17권7호
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• pp.1794-1804
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• 1993

The thermal stress intensity factors for interface cracks of Griffith and symmetric lip cusp types under vertical uniform heat flow in a finite body are calculated by boundary element method. The boundary conditions on the crack surfaces are insulated or fixed to constant temperature. The relationship between the stress intensity factors and the displacements on the nodal point of a crack tip element is derived. The numerical values of the thermal stress intensity factors for interface Griffith crack in an infinite body and for symmetric lip cusp crack in a finite and homogeneous body are compared with the previous solutions. The thermal stress intensity factors for symmetric lip cusp interface crack in a finite body are calculated with respect to various effective crack lengths, configuration parameters, material property ratios and the thermal boundary conditions on the crack surfaces. Under the same outer boundary conditions, there are no appreciable differences in the distribution of thermal stress intensity factors with respect to each material properties. But the effect of crack surface thermal boundary conditions on the thermal stress intensity factors is considerable.

• 대한치과보철학회지
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• 제39권4호
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• pp.366-375
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• 2001

The objective of this study was to investigate the surface contact and screw joint stability between screw and implant interface by use of sealer. The implants evaluated in this study were Steri-Oss futures(Hexlock $3.8D{\times}10mm$: Steri-Oss, Yorba Linda, CA), and Steri-Oss staight abutment. Titanium alloy screws were used to secure abutments to implants. The other titanium alloy screws applicating sealer(Impla-Seal, Implant Support Systems, Inc. Irvine, CA) were used to secure abutments to implants. In one another sample, 6kg of force was applied during simulated intraoral movements after abutment screws were secured to the implants with sealer. All samples were cross sectioned with sandpaper and polished with $0.1{\mu}m\;Al_2O_3$. Then samples were recorded with an scanning electron microscope. The results were as follows : 1. In the case of titanium alloy screw, irregular contacts and relatively large gap were present at thread mating surface. Also abutment screw/implant interface demonstrate incomplete seating and only one surface contact of threads between implant and screw. 2. In the case of titanium alloy screw applecating sealer, sealer was present between implant and screw. Therefore implant and screw had relatively close and tight contact without the presence of large gap. 3. On the other hand, in the case of titanium alloy screw applicating sealer and dynamic loading of suprastructures, sealer was partially present between implant and screw. Conclusively, sealer fills voids, creating a barrier to moisture and bacteria. In addition, loading of suprastructures may change the situation and limit the indications for gap sealing.

• Advances in concrete construction
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• 제15권6호
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• pp.359-376
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• 2023

Ultra-high-performance concrete (UHPC) has become an attractive cast-in-place repairing material for existing engineering structures. The present study aims to investigate age-dependent high-early-strength UHPC (HESUHPC) material properties (i.e., compressive strength, elastic modulus, flexural strength, and tensile strength) as well as interfacial shear properties of HESUHPC-normal strength concrete (NSC) composites cured at different season temperatures (i.e., summer, autumn, and winter). The typical temperatures were kept for at least seven days in different seasons from weather forecasting to guarantee an approximately consistent curing and testing condition (i.e., temperature and relative humidity) for specimens at different ages. The HESUHPC material properties are tested through standardized testing methods, and the interfacial bond performance is tested through a bi-surface shear testing method. The test results quantify the positive development of HESUHPC material properties at the early age, and the increasing amplitude decreases from summer to winter. Three-day mechanical properties in winter (with the lowest curing temperature) still gain more than 60% of the 28-day mechanical properties, and the impact of season temperatures becomes small at the later age. The HESUHPC shrinkage mainly occurs at the early age, and the final shrinkage value is not significant. The HESUHPC-NSC interface exhibits sound shear performance, the interface in most specimens does not fail, and most interfacial shear strengths are higher than the NSC-NSC composite. The HESUHPC-NSC composites at the shear failure do not exhibit a large relative slip and present a significant brittleness at the failure. The typical failures are characterized by thin-layer NSC debonding near the interface, and NSC pure shear failure. Two load-slip development patterns, and two types of main crack location are identified for the HESUHPC-NSC composites tested in different ages and seasons. In addition, shear capacity of the HESUHPC-NSC composite develops rapidly at the early age, and the increasing amplitude decreases as the season temperature decreases. This study will promote the HESUHPC application in practical engineering as a cast-in-place repairing material subjected to different natural environments.

• 한국전기전자재료학회논문지
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• 제16권8호
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Geomechanics and Engineering
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• 제25권4호
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• pp.275-282
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• 2021

Failure mechanism which can affect geotechnical infrastructures (shallow foundations, retaining walls, and piles) constitutes one of the most encountered problems during the design process. In this respect, the shear behavior of interfaces between grained soils and solid building materials, as well as those between cohesive soils should be investigated. Therefore, a range of ring shear tests with different cohesive soils and stainless-steel interfaces have been carried out through the Bromhead apparatus that allows simulating large displacements along a failure surface. The effects of steel rings roughness and soil type on the residual friction coefficient and the shear zone features (structure, thickness, and texture orientation angle) have been investigated using the Scanning Electron Microscopy. The obtained results indicate that the residual friction coefficient and the structural characteristics of the shear zone vary according to the surface roughness and the soil type. Scanning electron microscopy reveals that the particles inside the shear zone tend to be re-oriented. Also, the shear failure mechanism can be identified along with the interface, within the soil, or simultaneously at the interface and within the soil specimen.

• Nuclear Engineering and Technology
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• 제56권6호
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• pp.2367-2374
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• 2024

In this paper, based on the need for high-strength connections between all-tungsten-oriented plasma materials and thermal sinking materials of copper and its alloys in nuclear fusion devices, a study on the effect of tungsten surface laser micro structuring on the interfacial bonding properties of W/Cu joints was carried out. In the experiment, the connectors were prepared by vacuum fusion infiltration technology, and the effects of microgroove structure on the mechanical and thermal conductivity of W/Cu connectors were investigated under different parameters (including microgroove pitch, microgroove depth, and microgroove taper). The maximum shear strength is 126.0 MPa when the pitch is 0.15 mm and the depth is 34 ㎛. In addition, the negative taper structure, i.e., the width of the entrance of the microstructure is smaller than the width of the interior of the microstructure, is also investigated. The shear tests show that there is an approximately linear relationship between the shear strength of W/Cu and taper. Compared with the positive taper, the shear strength of the samples with the same morphological density and depth of the tungsten surface is significantly higher.

• 접착 및 계면
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• 제6권1호
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• pp.7-10
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• 2005

Condensation control of nano-particles has become important in order to fabricate minute condensed structures. In this study, we focus our attention on condensation mechanism of polymer aggregates in a resist film. The polymer aggregate is structural component of a resist material which is used in lithography process. The condensation nature of polymer aggregates in the resist film surface is observed by using atomic force microscope (AFM). By using the AFM, the condensation of polymer aggregates can be observed clearly. The condensation of polymer aggregate strongly affects to precise fabrication of resist pattern below 100nm size. The interaction force among polymer aggregates can be analyzed based on Derjaguin approximation. We also discuss about condensation nature of polymer aggregates in the resist film surface with the help of micro sphere model.

• 천문학회지
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• 제34권4호
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• pp.237-241
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• 2001

Our goal is to present a simple volume-of-fluid type interface-tracking algorithm to compressible two-phase flow in two space dimensions. The algorithm uses a uniform underlying Cartesian grid with some cells cut by the tracked interfaces into two subcells. A volume-moving procedure that consists of two basic steps: (1) the update of volume fractions in each grid cell at the end of the time step, and (2) the reconstruction of interfaces from discrete set of volume fractions, is employed to follow the dynamical behavior of the interface motion. As in the previous work with a surface-tracking procedure for general front tracking (LeVeque & Shyue 1995, 1996), a high resolution finite volume method is then applied on the resulting slightly nonuniform grid to update all the cell values, while the stability of the method is maintained by using a large time step wave propagation approach even in the presence of small cells and the use of a time step with respect to the uniform grid cells. A sample preliminary numerical result for an underwater explosion problem is shown to demonstrate the feasibility of the algorithm for practical problems.